Engineering services. This purpose of this task is to: a) assess the use of chip on board (COB) manufacturing technologies in military systems and their effect on reliability; B). Assess the impact to…
Ended Awarded
- Contract number
- HQ072718F1301
- Awardee
-
General Dynamics Mission Systems, Inc. UEI E422A91WKZ57 Part of General Dynamics Corp
- Awarding agency
-
Defense Microelectronics Activity
Department of Defense
- Obligated
- $258,725
Award facts
- Opportunity
-
- HQ072715R0001 Solicitation number
- Advanced Technology Support Program IV (ATSP4) Full and Open Competition Award Notice · Posted Mar 31, 2016
- Advanced Technology Support Program IV (ATSP4) Full & Open Award Notice · Posted Feb 17, 2015
- Advanced Technology Support Program IV (ATSP4) - Full & Open Award Notice · Posted Jan 29, 2015
- Contract value 76% obligated
-
- $258,725.00 Current, with exercised options
- $340,451.00 Potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 541330 Engineering Services
- Set-aside
- No set-aside
- Competition
- Full and Open Competition · 1 offer Multiple Award, Fair Opportunity
- Pricing
- Cost Plus Fixed Fee
- Place of performance
- Minneapolis, MN 55431, USA
Award details come from SAM.gov/FPDS.
About this award
General Dynamics Mission Systems, Inc. was awarded a $340,451 cost-plus-fixed-fee delivery order to provide engineering services assessing chip on board manufacturing technologies, compliant printed circuit board construction, and solder joint integrity of micro-BGA components. This order was issued against the Advanced Technology Support Program IV indefinite-delivery/indefinite-quantity contract vehicle to support the Defense Microelectronics Activity. No set-aside designation was used for this order. Work will be performed in Minneapolis, Minnesota through February 2019. As the prime contractor, General Dynamics Mission Systems will evaluate the effects of chip on board technologies and a soft dielectric top layer for printed circuit boards on reliability for military systems, as well as assess solder joint integrity when micro-BGA components are assembled onto compliant printed circuit boards.
Description
Engineering services. This purpose of this task is to: a) assess the use of chip on board (COB) manufacturing technologies in military systems and their effect on reliability; B). Assess the impact to printed circuit boards (PCBS) reliability when adding a soft dielectric top layer to PCB construction to create a compliant PCB; and C) assess solder joint integrity of micro-BGA electronic components when assembled onto compliant PCBS
Quick answers
Who was awarded contract HQ072718F1301?
HQ072718F1301 was awarded to General Dynamics Mission Systems, Inc. by Defense Microelectronics Activity (Department of Defense) on March 1, 2018.
How much is contract HQ072718F1301 worth?
The government has obligated $258,725 on HQ072718F1301. Its potential value, with all options, is $340,451.
Is contract HQ072718F1301 an order under another contract?
Yes. HQ072718F1301 is a delivery order under HQ072716D0003, an indefinite delivery contract, on Advanced Technology Support Program IV (ATSP4).
Was contract HQ072718F1301 competed?
The extent of competition for HQ072718F1301 was full and open competition. The government received 1 offer.
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