Definitive Contract HR001124C0469

Award Date 8/21/24
Potential Completion Date 7/31/27
Potential Value $5.3M
Ultimate Awardee
Not listed
Federal Contract Vehicle
Set-Aside Type
No Set-Aside Used
Extent Competed
Full and Open Competition
Major Defense Program
Not listed
Pricing Type
Cost Plus Fixed Fee
Place of Performance
Tewksbury, MA 01876, USA
Solicitation Procedures
Basic Research
Number Of Offers Received
31
Legislative Mandate
Employment Eligibility Verification
National Interest Action
Not listed
Research Type
Not listed
Primary Consortia Member
Not listed
Similar Awards
This $21,355,695.00 federal contract award was issued by the Defense Advanced Research Projects Agency (DARPA) to the Raytheon Company's Air & Space Defense Systems Division. The contract is a Cost Plus Fixed Fee definitive contract for a DARPA research project, with an ultimate completion date of April 29, 2026. It does not have a set-aside designation. Key subcontractors include Micross Advanced Interconnect Technology LLC for advanced electronics, Dell Federal Systems L.P. for IT hardware...
This is a $28,771,436.00 definitive cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company, a major aerospace and defense contractor, for a DARPA research project. The contract does not have a set-aside designation. Raytheon will be the prime contractor, and the award includes subcontracts with several specialized electronic component manufacturers such as Rf-Lambda Usa, LLC, Infinite Electronics International, Inc., Digi-Key Corp,...
This $9,660,380.00 cost-plus-fixed-fee federal contract was awarded by the Defense Advanced Research Projects Agency (DARPA) to Northrop Grumman Systems Corporation's Space Systems Division to develop foundational ultra-wide bandgap semiconductor (UWBGS) materials and electrical contacts under the UWBGS program. The contract has no set-aside designation. The UWBGS program aims to develop scalable UWBG technologies over multiple phases, including low-defect density substrates and advanced...
This is a definitive federal contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company's Raytheon Missile Systems division, valued at $4,827,130.00. The contract is a cost-plus-fixed-fee arrangement with a completion date of May 31, 2020. The contract does not have a set-aside designation. Raytheon, as the prime contractor, is a major global defense contractor that specializes in defense electronics, space, IT, and technical services for U.S. defense agencies....
This is a $15,884,284.00 Cost Plus Fixed Fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company, a major defense contractor, for a DARPA research project. The contract has no set-aside designation. Raytheon's Advanced Products & Solutions division is the prime contractor, and the contract work is being performed in Tewksbury, MA. Several subcontractors are involved, including Colorado Engineering Inc., Nuvotronics, Inc., and Mercury Systems, Inc.,...
This is a $3,682,171.00 cost-plus-fixed-fee prime contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company's Space & Airborne Systems division. The contract supports the development of advanced radio frequency (RF) mixed-mode integrated circuits on a CMOS fabrication platform, aimed at enabling new Department of Defense applications including high-capacity communications, radars, and precision sensors. The original solicitation was a DARPA...
This is a $14,033,507 cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company for a research project. The contract has no set-aside designation. It covers a base period through March 2025 and supports DARPA's research into advanced signal processing technologies and techniques for future radio frequency (RF) systems. As the prime contractor, Raytheon will be the lead on the research effort. The contract involves several subcontractors,...
This DARPA research project awarded a $12,598,157.00 definitive cost-plus-fixed-fee contract to Raytheon Company, a major U.S. defense contractor, to provide research, development, and technical services in support of the agency's programs in Goleta, California. The contract does not have a set-aside designation. Several subcontractors were engaged to support the project, including Tempo Automation for custom circuit card assemblies, Q C Graphics for printed circuit boards and engineering...
This is a $51,429,787.00 cost plus fixed fee definitive contract awarded by the Defense Advanced Research Projects Agency (DARPA) to prime contractor Raytheon Company. The contract is for a DARPA research project with no set-aside designation. Raytheon has subcontracted with several vendors, including Extreme Engineering Solutions, Inc., Costa Precision Manufacturing Corp, and Future Hardware Technology, Inc. to provide goods and services such as computer hardware, precision machined components,...
This $3.9 million cost-plus-fixed-fee contract was awarded by the Defense Advanced Research Projects Agency to Raytheon Company for the development of chips-enabled compact electronic warfare payloads. The work is being performed under DARPA's Electronics Resurgence Initiative: Defense Applications program, which seeks to apply emerging electronics technologies to impact Department of Defense and national security capabilities. Raytheon will partner with academic and commercial organizations...

This $5,349,010 Cost Plus Fixed Fee contract was awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company to develop foundational ultra-wide bandgap (UWBG) semiconductor materials and electrical contacts necessary for practical UWBG electronics. The contract, which has a completion date of July 31, 2027, supports DARPA's UWBGS program that aims to enable UWBG applications through the creation of high-quality UWBG materials and contacts.

Two major subcontractors on the contract are Crystal IS, Inc. for H-A-M substrates and Element Six Technologies U.S. Corporation for H-A-M wafers. The contract is not designated as a set-aside. Raytheon, a leading defense contractor, has significant expertise in advanced electronics, radar systems, and other defense technologies that are relevant to this DARPA initiative focused on developing materials and components for future UWBG-enabled devices and applications.

Generated 3/18/25, 9:48 AM