Automatic dicing saw and water recycling system
Ended Definitive Contract Awarded Last action
- Contract number
- FA875123C0008
- Awardee
-
Disco Hi-Tec America, Inc. UEI M94NF1YCNLC6
- Awarding agency
-
Air Force Research Laboratory
Air Force Materiel Command, Department of Defense
- Obligated
- $502,400
Award facts
- Opportunity
-
- Wafer Dicing Saw and Water Conditioning/Recycling System Pre-Solicitation · FA875123R0008 · Posted Jun 22, 2023
- Contract value 100% obligated
- $502,399.71 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Contracting staff
- Funding agency
- Office of the Secretary of Defense Department of Defense
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- Set-aside
- No set-aside
- Competition
- Not Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- San Jose, CA 95138, USA
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Supplemental Agreement for work within scope | -$20,000 | |
| Supplemental Agreement for work within scope | $0 | |
| Original award | $522,400 |
About this award
The U.S. Department of Defense, through the Office of the Secretary of Defense, awarded a $502,399.71 firm fixed-price contract to Disco Hi-Tec America, Inc. for the procurement of an automatic dicing saw and water recycling system. The contract, awarded on September 22, 2023, with a completion date of August 31, 2025, will be performed in San Jose, California. This procurement originated from an Air Force Research Laboratory pre-solicitation notice posted in June 2023 seeking commercially available equipment capable of dicing 300-millimeter wafers and generating/recycling high-purity water from municipal supplies. No set-aside designation was applied to this contract.
The system represents critical capital equipment for semiconductor wafer processing operations at Air Force Research Laboratory facilities in Rome, New York. Disco Hi-Tec America, Inc., a specialized supplier of precision semiconductor manufacturing equipment, was selected as the prime contractor to deliver a solution meeting the government's technical specifications for wafer dicing capability and water conditioning/recycling functionality. This equipment acquisition supports the Department of Defense's research and development initiatives in advanced semiconductor technology and materials processing.
Quick answers
Who was awarded contract FA875123C0008?
FA875123C0008 was awarded to Disco Hi-Tec America, Inc. by Air Force Research Laboratory (Air Force Materiel Command) on September 22, 2023.
How much is contract FA875123C0008 worth?
The government has obligated $502,400 on FA875123C0008.
Which agency awarded contract FA875123C0008?
Air Force Research Laboratory (Air Force Materiel Command) awarded FA875123C0008, with funding from Office of the Secretary of Defense (Department of Defense).
Was contract FA875123C0008 competed?
The extent of competition for FA875123C0008 was not competed under sap. The government received 1 offer.
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