Full-wafer patterning of all interconnect layers at SOP nodes

Ended Definitive Contract Awarded Last action

Contract number
FA865020C1958
Awardee
Awarding agency
Obligated
$30,993,222

Award facts

Opportunity
Contract value 82% obligated
$37,586,245.00 Current and potential, with all options
Completion date 100% complete
  • Current, with exercised options
  • Potential, with all options
Set-aside
No set-aside
Competition
1 offer Negotiated Proposal / Quote
Pricing
Cost Plus Fixed Fee
Place of performance
Santa Clara, CA 95054, USA

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Other Administrative Action P00008 · Full wafer pattererning of all interconnect layers at state-of-practice nodes $0
Supplemental Agreement for work within scope P00007 $0
Funding Only Action P00006 · Full wafer patterning of AL interconect layers at SOP nodes $13,331,222
Funding Only Action P00005 · Multibeam $5,662,000
Exercise an Option P00004 · Full wafer patterning of all interconnect layers at SOP nodes (MEBL) $0
Funding Only Action P00003 · Full wafer patterning with multicolumn E-beam lithography (MEBL) of all interconnect layers enveloping state-of-practice (SOP) nodes $4,743,023
Supplemental Agreement for work within scope P00002 $1,850,000
Supplemental Agreement for work within scope P00001 $0
Original award $12,000,000

About this award

Written by GovTribe AI ·

Multibeam Corporation was awarded a definitive cost-plus-fixed-fee contract valued at $37.6 million by the Air Force Research Laboratory to perform full-wafer patterning of all interconnect layers at state-of-practice technology nodes. The work will be performed in Santa Clara, California, with an ultimate completion date of April 23, 2025. This contract award falls under a larger Air Force Materiel Command initiative focused on Assured and Trusted Microelectronics Solutions, which aims to ensure legacy, current, and future microelectronics remain sustainable, reliable, and secure throughout military system lifecycles. No small business set-aside was used for this award.

The overarching program seeks to address critical Air Force microelectronics needs including design assurance, field-programmable gate array assurance, validation and verification, enhanced fabrication, and radiation-hardened electronics solutions. The broader acquisition vehicle has a total program budget of approximately $300 million to be distributed across multiple contracts ranging from $2 to $20 million over performance periods of 12 to 36 months. Multibeam Corporation's work on interconnect layer patterning directly supports the enhanced fabrication capabilities necessary to maintain trusted microelectronics manufacturing capacity for U.S. defense applications.

Quick answers

Who was awarded contract FA865020C1958?

FA865020C1958 was awarded to Multibeam Corporation by Air Force Research Laboratory (Air Force Materiel Command) on August 20, 2020.

How much is contract FA865020C1958 worth?

The government has obligated $30,993,222 on FA865020C1958. Its current value, with exercised options, is $37,586,245.

Was contract FA865020C1958 competed?

The government received 1 offer.

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