Grinding & Dicing Services, Inc.
Part of Akoustis Inc.
- UEI
- JB1LXJ2E3HV9
- CAGE
- 3FEJ2
- Primary NAICS
- 334413 Semiconductor and Related Device Manufacturing
- SAM.gov registration
- Expired
Company facts
- Self-certified in SAM.gov
- Entity structure
- Corporate Entity (Not Tax Exempt)
- Corporate family
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Parent
Huntersville, NC
DMBLU3M8U856
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Parent
Huntersville, NC
DMBLU3M8U856
- SAM.gov registration date
- Website
- dieprepservices.com
- Industry
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- Industrials
- Capital Goods
- Industrial Conglomerates
- Industrials & Manufacturing
- SIC code
- 38 Instruments & Related Products
Registration and certifications come from SAM.gov and the SBA; company details from public web sources. Updated .
Contract awards
| Award | Agency | Obligated | Awarded |
|---|---|---|---|
| Wafer, dice | Naval Information Warfare Systems Command (Navy) | $7,000 | |
| Purchase Order N6600105MT126 | Naval Information Warfare Systems Command (Navy) | $1,120 |
SBA capabilities narrative
GDSI provides wafer grinding and dicing to large and small integrated circuit manufacturers as well as fabless companies. GDSIs service offerings include backgrinding, dicing and saw, pick and place, automated inspection, and wafer polishing.
Quick answers
Is Grinding & Dicing Services, Inc. registered in SAM.gov?
Grinding & Dicing Services, Inc.'s SAM.gov registration expired on August 12, 2025.
What is Grinding & Dicing Services, Inc.'s most recent federal award?
Grinding & Dicing Services, Inc.'s most recent federal contract award is Wafer, dice (N6600112P7330), from Naval Information Warfare Systems Command (Navy), on May 31, 2012.
On GovTribe
See Grinding & Dicing Services, Inc.'s full federal record
- Federal contract awards
- Funding analysis by agency, NAICS and set-aside
- Similar vendors