Chip Design Systems Inc.
Hockessin, DE
- UEI
- PN31T8TQRHX3
- CAGE
- 4NZV6
- Primary NAICS
- 541715 Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- SAM.gov registration
- Active through
Company facts
- Self-certified in SAM.gov
- Entity structure
- Corporate Entity (Not Tax Exempt)
- NAICS codes registered in SAM.gov
- Corporate family
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Chip Design Systems Inc.
PN31T8TQRHX3
- CDS Global LLC E13GDDJ83QN6
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Chip Design Systems Inc.
PN31T8TQRHX3
- SAM.gov registration date
- Physical address
- 12 Longacre Ct, Hockessin, DE 19707, USA
- Website
- chipdesignsystems.com
- Founded
- 2013
- Employees
- 11-50
- Estimated annual revenue
- $1M-$10M
- Industry
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- Information Technology
- Semiconductors & Semiconductor Equipment
- Semiconductors
- SIC code
- 36 Electronic & Other Electric Equipment
- Profiles
Registration and certifications come from SAM.gov and the SBA; company details from public web sources. Updated .
Recent federal awards
| Award | Agency | Obligated | Awarded |
|---|---|---|---|
| Scalable homeland innovative enterprise layered defense (shield) initial order. | Missile Defense Agency | $500 | |
| Mid-wave infrared interband cascade light emitting diode array | Air Force Research Laboratory | $230,465 | |
| Sbir/sttr phase II r & d | Missile Defense Agency | $1,876,496 | |
| Scene projector electronics | Air Force Research Laboratory | $1,315,486 | |
| Sbir/sttr phase i research & development- next-GEN infrared scene projector for hypersonic hardware-in-the-loop test and… | Missile Defense Agency | $149,989 |
About Chip Design Systems Inc.
Chip Design Systems Inc., a minority-owned, Asian-Pacific American small business based in Hockessin, Delaware, designs and manufactures infrared LED sensor testing equipment and components for the Department of Defense as a prime contractor, operating exclusively in full-and-open competition without set-aside designations on its major vehicle awards. The company specializes in mid-wave infrared interband cascade light-emitting diode arrays, infrared scene projectors, and dual-color infrared clutter generators, with a corporate structure that includes subsidiary CDS Global LLC.
Chip Design Systems serves a concentrated defense customer base across five agencies, all within Department of Defense components. The Air Force Materiel Command Research Laboratory anchors the portfolio at eight awards and $9.4 million in combined potential value, followed by the Missile Defense Agency (six awards, $3.2 million), the Air Force Materiel Command Test Center (four awards, $1 million), the Army Materiel Command Research Development and Engineering Command (three awards, $1.4 million), and the Air Force (two awards, $4.2 million). The company's award concentration is 100% concentrated in its named top five customers. Work has centered on Small Business Innovation Research contracts—SBIR Phase I and Phase II efforts dominate the footprint—with representative awards including a $1.9 million SBIR Phase II contract from the Missile Defense Agency for Advanced Superlattice LED System development (awarded February 2023, completion July 2026), a $1.3 million SBIR Phase II contract from the Air Force Research Laboratory for scene projector electronics (awarded April 2022, completion July 2024), and a $1.1 million SBIR Phase II contract from the Army's Research Development and Engineering Command for a prototype dual-color infrared clutter generator (awarded September 2021, completion September 2024).
Chip Design Systems holds two indefinite delivery contracts as a prime. The first is a single-award Air Force contract valued at $4 million, running through November 2028, for mid-wave infrared interband cascade LED array systems and components; the Air Force has issued one $230 thousand cost-plus-fixed-fee delivery order against it. The second and more significant is the Scalable Homeland Innovative Enterprise Layered Defense (SHIELD) multiple-award IDIQ, awarded by the Missile Defense Agency on December 29, 2025, carrying a multi-billion-dollar ceiling and extending through December 28, 2035. SHIELD is a full-and-open vehicle supporting research, development, prototyping, systems engineering, weapon design, production, test and evaluation, and modernization across multi-domain defense capabilities. Chip Design Systems received an initial delivery order under SHIELD with a $500 ceiling and December 2035 completion. Work performed under SHIELD will leverage the company's established infrared sensor testing expertise to support detection, tracking, interception, and neutralization of air, missile, space, cyber, and hybrid threats.
Activity has been episodic—one award in 2020, two in 2021, one in 2022, three in 2023, and two in 2025—with $13.8 million obligated against $19.3 million in combined potential value across all twenty-three prime awards. The company operates as a 100% prime contractor footprint with no subcontract activity in the source data. SBIR work dominates the category concentration, with eleven awards falling under physical and engineering sciences research and development and nine under similar life sciences R&D categories; PSC coding reflects national defense R&D services across applied research, experimental development, and weapons system categories.
Contract vehicles
Quick answers
What is Chip Design Systems Inc.'s UEI?
Chip Design Systems Inc.'s Unique Entity ID (UEI) in SAM.gov is PN31T8TQRHX3.
What is Chip Design Systems Inc.'s CAGE code?
Chip Design Systems Inc.'s CAGE code is 4NZV6.
What is Chip Design Systems Inc.'s primary NAICS code?
Chip Design Systems Inc.'s primary NAICS code is 541715 (Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)).
Where is Chip Design Systems Inc. located?
Chip Design Systems Inc.'s physical address in SAM.gov is 12 Longacre Ct, Hockessin, DE 19707, USA.
Is Chip Design Systems Inc. registered in SAM.gov?
Yes. Chip Design Systems Inc.'s SAM.gov registration is active through December 10, 2026.
Which contract vehicles does Chip Design Systems Inc. hold?
Chip Design Systems Inc. holds a place on 1 federal contract vehicle: SHIELD.
What is Chip Design Systems Inc.'s most recent federal award?
Chip Design Systems Inc.'s most recent federal contract award is Scalable homeland innovative enterprise layered defense (shield) initial order (HQ085926FF284), from Missile Defense Agency, on December 29, 2025.
On GovTribe
See Chip Design Systems Inc.'s full federal record
- Federal contract awards
- IDV awards
- Contract vehicles
- Subcontracting relationships
- Funding analysis by agency, NAICS and set-aside
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