Automatic dicing saw (UW-MAD)[20-0023]

The University of Wisconsin-Madison is seeking bids for an automatic dicing saw for the Engineering Research Center through a Request for Bid (RFB) solicitation. The procurement targets a new 2019 automatic dicing saw capable of processing microelectronic and integrated circuit substrates from small pieces to 6-inch wafers, with specific technical requirements including automatic and manual alignment capabilities, precision Z-axis control with 1-micron repeatability, a 1.5 kW brushless motor spindle, macro and micro-microscope equipment, and a LCD touch panel interface. Bidders must submit two hard copies or an electronic submission by 2:00 p.m. CDT on September 9, 2019, with written questions due by August 29, 2019. The University reserves the right to conduct oral presentations, product demonstrations, and vendor site visits prior to award. Evaluation will be based on the lowest extended net total bid deemed in the best interest of the University, with pricing to be submitted as net unit price on an FOB Destination basis, inclusive of delivery, packing, freight, insurance, and installation manuals.

The solicitation includes supplier diversity goals, targeting at least 5 percent of the contract price to be awarded to Wisconsin-certified minority business enterprises and 1 percent to disabled veteran-owned businesses when qualified bids are not more than 5 percent higher than the apparent low bid. The successful bidder must provide a comprehensive 2-year warranty, installation and training, technical support within the USA, maintenance options, three business references, and proof of five years of experience in providing automatic dicing saw items and services. Contractors are required to maintain $1 million in commercial general liability and automobile liability insurance, add the Board of Regents as an additional insured, and comply with federal debarment regulations and Wisconsin statutory requirements. Acceptance testing will occur within 15 days of delivery, with payment processed net 30 days following successful acceptance. While no specific budget range is mentioned, the procurement is for a highly specialized piece of semiconductor fabrication equipment, suggesting a potentially significant investment for the University's Engineering Research Center.