DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R & D Roadmap - Public Feedback
Closed Posted
- Opportunity number
- DE-FOA-0003426
- Agency
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Office of Energy Efficiency and Renewable Energy
Department of Energy
- Applications due
- Award size
- Not on record
Opportunity facts
- Assistance listings
- Funding instrument
- Other
- Category
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- Energy
- Eligible applicants
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- Unrestricted
- Full announcement
Opportunity details come from Grants.gov. Updated .
About this opportunity
This Request for Information (RFI) is issued by the U.S. Department of Energy's (DOE) Office of Energy Efficiency and Renewable Energy (EERE), on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO). The purpose is to solicit feedback from stakeholders on the Energy Efficiency Scaling for Two Decades (EES2) initiative and the accompanying draft EES2 Research, Development, and Demonstration (RD&D) Roadmap. The roadmap is divided into eight specialized working groups focused on improving the energy efficiency of computing and the computing stack, covering areas such as materials, devices, circuits, packaging, algorithms, power electronics, manufacturing, and workforce development. Responses to the RFI must be submitted by September 30, 2024 in Microsoft Word format.
This RFI is not accepting applications for financial assistance or incentives. However, DOE may issue a future Funding Opportunity Announcement based on the input received. The EES2 initiative aims to achieve a 1,000x increase in microelectronics energy efficiency over 20 years by doubling efficiency every 2 years. The RFI does not specify award values or budgets, but recent awards under the Conservation Research and Development program, which may fund future EES2 efforts, have ranged from hundreds of thousands to millions of dollars per project.
Synopsis
This is a Request for Information (RFI) issued by the U.S. Department of Energy (DOE) on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO). The intent of this RFI is to solicit feedback from affected stakeholders on the EES2 Initiative in general and on the draft Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) Research, Development, and Demonstration (RD & D) Roadmap that accompanies this RFI. The EES2 roadmap focuses on the energy efficiency of computing and the computing stack. Therefore, we have divided our roadmap into eight specialized working groups, each focusing on specific layers of the computing stack or on enabling technologies and approaches. Working group deliberations focused on identifying key emerging, energy-efficient technologies and their challenges and solutions. The EES2 working groups for version 1.0 are: a. Materials and Devices (MnD) b. Circuits and Architectures (CnA) c. Advanced Packaging and Heterogenous Integration (APHI) d. Algorithms and Software (AnS) e. Power and Control Electronics (PaCE) f. Manufacturing Energy Efficiency and Sustainability (MEES) g. Metrology and Benchmarking (MnB) h. Education and Workforce Development (EWD) Responses to this RFI must be submitted electronically to micro.electronics@ee.doe.gov no later than 5:00pm (EDT) on September 30, 2024. Responses must be provided as a Microsoft Word (.docx) attachment to an email. It is recommended that attachments with file sizes exceeding 25MB be compressed (i.e., zipped) to ensure message delivery. This RFI is not accepting applications for financial assistance or financial incentives. EERE may or may not issue a Funding Opportunity Announcement (FOA) based on consideration of the input received from this RFI. Please see the full RFI document for additional information.
Files
| File | Type | Posted |
|---|---|---|
| DE-FOA-0003426_Request_for_Information_EES2.pdf | ||
| Draft EES2 Roadmap AMMTO_August 2024.pdf |
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