Sole source procurement for FINEPLACER Core+ Ball Grid Array Rework Station.

The Army Contracting Command-Redstone is soliciting a quote. In order for a quote to be accepted, the vendor must be able upon request to provide historical pricing data such as copies of previous invoices or purchase orders to support fair and reasonable pricing. Combined Synopsis/Solicitation Number W31P4Q-18-Q-0173 is to be a Sole-Source procurement to Finetech 560 E. Germann Road, Ste. 103, Gilbert AZ 85297-2943 in accordance with FAR 13.106-1(b) for soliciting from a single source in that the circumstances of the contract action make only one source reasonable available. The corresponding NAICS code for this procurement is 334413 with a small business size standard of 1250 employee. The US Army Contracting Command-Redstone is soliciting a quote for a FINEPLACER Core+ Ball Grid Array (BGA) Rework Station and the parts are listed in the description below.

A21 FINEPLACER Core plus (including 3 standard soldering heads), including Mini PC and monitor, software installed 1
TIR B1-148121-00, Process Start Sensor 1
AC1 B1-142290-00, Target Finder 1
RW6 B1-139358-01, Process Video Monitor 1
RC7P B1-142567-02, Solder Removal Module, Twin suction (including 1 piece of RC6.H) 1
Special B1-129469-03STRBA2, Substrate holder for RB11, for boards small than 150mm 1
190 AP-900125, Dipping Tray with 50x50 holder 1
RC.DPQ B1-160690-00, Direct Component Printing Module with quick change support 1
RC1 Solder page printing head for reflow arm. Assembly includes stencil and head frame for reflow arm. Includes one RC1.S squeegee. 1
RC1.S Squeegee (included with RC1) 1
RC5 BGA-Reballing Module, including Holder Plate, Frame, Template, and nozzle 1
RAH4 (3) Soldering head for CSP or BGA, open design with vacuum cup. (Three included with line item A21). 1
A.INCLD_A20 Includes: Installation at customer site 1
The salient features of the FINEPLACER Core+ as configured above are as follows:

• Capabilities
- Desoldering and soldering of surface mount components on printed circuit
boards, including precision solder paste printing
- Semi-Automated removal of residual solder from boards
- Reballing of surface mount components
- Live process monitoring through magnified video

• Board size: From 400 microns.

• Solder paste printing head for reflow arm - Local and precise position paste application on populated boards. Uses optical tool of rework station.

• Reballing module
- Component size: all.
- Ball size: 250 microns - 760 microns

• Manual and semi-automatic operation
• Touch screen control

The incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2005-100. Any award resulting from this RFQ will be issued on Standard Form 1449 and will contain all clauses required by law, the Federal Acquisition Regulation (FAR), and the Defense Federal Acquisition Regulation Supplement (DFARS) as appropriate for the dollar value of the award. Provision 52.209-2, Prohibition on Contracting with Inverted Domestic Corporations - Representation; Provision 52.212-1, Instructions to Offerors - Commercial; Provision 52.212-2, Evaluation - Commercial items; Provision 52.212-3, Offeror Representations and Certifications - Commercial Items; Clause 52.212-4, Contract Terms and Conditions - Commercial Items; Clause 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders - Commercial Items; Clause 52.223-18 Contractor Policy to Ban Text Messaging While Driving; Clause 52.222-50, Combating Trafficking in Persons; Clause 52.232-18 Availability of Funds; Clause 52.232-39, Unenforceability of Unauthorized Obligations; Provision 252.209- 7999, Representation by Corporations Regarding an Unpaid Delinquent Tax Liability or a Felony Conviction Under any Federal Law; Clause 252.212-7001, Contract Terms and Conditions Required to Implement Statutes or Executive Orders Applicable to Defense Acquisitions of Commercial Items; Clause 252.225-7036 Buy American Act - Free Trade Agreements - Balance of Payments Program; and Clause 252.232-7003, Electronic Submission of Payment Requests and Receiving Reports are applicable to this acquisition. Other clauses may be included in the award if applicable. All responsible sources may submit a capability statement and quotation which shall be considered by the agency. In the event more than one quote is received, the following factors shall be used to evaluate offers: technical capability of the items offered to meet the Government requirement, price, and delivery. All items shall include shipping costs FOB Destination to Redstone Arsenal, AL, 35898. Payment will be made via Wide Area Workflow. As a result, the prospective awardee will have to have an assigned cage code and active profile in the System for Award Management (www.sam.gov) before a purchase order can be fully executed. Responses are due no later than 4:00 PM (local time), 5 September 2018 in the contracting office, Building 5400, Room B-142, Redstone Arsenal, Alabama, 35898. Oral communications are not acceptable in response to this notice. Electronic quotes are preferred, but fax quotes will be accepted. Responses may be submitted to: angela.m.harris.civ@mail.mil or via facsimile at 256-313-2392, marked to the attention of Angela Harris.

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