Semiconductor Die Bonding and Vacuum Packaging System
Award Notice Posted
- Solicitation number
- N0017326P2436
- Agency
-
Office of Naval Research
Secretary of the Navy, Department of Defense
- Awarded
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- N0017326P2436
- NAICS code
- 333993 Packaging Machinery Manufacturing
- PSC
- 3540 Wrapping And Packaging Machinery
- Place of performance
- Washington, District of Columbia 20375, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of the Navy Office of Naval Research awarded contract N0017326P2436 to Cook and Weil, Inc. for a Semiconductor Die Bonding and Vacuum Packaging System on September 14, 2026, with a contract value of $672,985.00.
The award was made under simplified procedures for commercial items under FAR subpart 13.5, with no set-aside applied.
Notice text
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
Awarded contract N0017326P2436 to COOK AND WEIL, INC. for 672985.00 on 2026-09-14.
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