Radiation Hardened Microelectronics Program

Added: Jan 04, 2010 1:21 pm The Defense Threat Reduction Agency (DTRA) intends to modify, on a sole-source basis, Indefinite Delivery Indefinite Quantity (IDIQ) contract HDTRA1-05-D-0001with the Boeing Company, PO Box 3999, Seattle, WA 98124-2490. The purpose of the modification will be to add one five-year option to the basic contract and to raise the contract ceiling by $30M from $60M to $90M. The option period of performance is 31 March 2010 - 30 March 2015. The requirements of the IDIQ contract include the following tasks, with emphasis on advanced (90nm, 65nm, 45nm and 32nm technology nodes) semiconductor electronics: development and demonstration of electronic design automation (EDA) and technology computer aided design (TCAD) technology to support the radiation hardening of complex microelectronics and photonics devices; the modeling and simulation of radiation response of microelectronic and photonic technologies; and the design, fabrication, test and evaluation of prototype radiation hardened microelectronics and photonics devices including digital, analog and mixed signal integrated circuits, system-on-chip (SOC) devices and system-in-package (SIP) developed through the use of EDA and TCAD technology. The statutory authority for this non-competitive action is 10 U.S.C. 2304(c)(1), as implemented by Federal Acquisition Regulation (FAR) 6.302-1, Only One Responsible Source, and is supported by an approved Justification and Approval. This notice of contract action is not a request for competitive proposals. No formal solicitation will be issued as a result of this announcement.