Printed Circuit Board Fabrication and Population IDIQ

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.. Awarded Vendors: Hughes Circuits Inc (DUNS 059548458)
540 S Pacific St
San Marcos, CA 92078-4056
. Contract Award Dollar Amount: $5,000,000. Contract Award Date: 2012-06-06.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.. Awarded Vendors: Accu-sembly, Inc. (DUNS 156217507)
1835 Huntington Dr.
Duarte, CA 91010-2635
. Contract Award Dollar Amount: $5,000,000. Contract Award Date: 2012-06-06.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.. Awarded Vendors: Manufacturing Techniques, Inc (MTEQ) (DUNS 806951570)
140 Technology Park Dr.
Kilmarnock, VA 22482-3837
. Contract Award Dollar Amount: $5,000,000. Contract Award Date: 2012-06-06.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.. Awarded Vendors: TJR Electronics LLC (DUNS 962401068)
234 Pebble Hill Way
Rockledge, FL 32955-6907
. Contract Award Dollar Amount: $4,020,190.00. Contract Award Date: 2012-06-06.

The Naval Air Warfare Center Weapons Division (NAWCWD), China Lake, California, issued a Firm Fixed Price (FFP) Indefinite Delivery Indefinite Quantity (IDIQ) Multiple Award Contract (MAC) for fabrication and population of printed circuit boards utilizing a 100% Small Business Set-Aside process.

The scope of this contract includes fabrication, population, testing, and delivery of high density printed circuit boards (PCBs) for multiple customers at the Naval Air Warfare Center, Weapons Division (NAWCWD), China Lake, CA.
A few of the salient features of the High Density PCBs fabrication and population are defined below:
High Layer count boards: up to 30 layers
PCB Pin count greater than 500 pins/Sq. inch
Through, blind, buried, and micro vias
Fine Line Pitch BGA (0.8mm or smaller), High pin count (1600 or greater)
Differential and Controlled Impedance
Matched Length Traces
Flex Circuits: Rigid Multilayer and Rigid-flex Multilayer
Automated Optical Inspection (AOI) and Manual Inspection (including X-RAYS) to ensure all leaded solder joints and BGA solder joints are correctly formed and placed
The contract includes fabricating PCBs and/or populating PCBs with electronic components.
The electronic components may or may not be Government furnished material (GFM) to the contractor. The Government is seeking contractors that provide Turnkey Assembly services as well as contractors with the capability to purchase parts for PCB population. Specific parts shall be called out within individual delivery orders when required. The electronic components consist of thru-hole, surface mount, ball grid arrays (BGA), leadless parts, and unique packaging. The BGAs can be fine line with ball densities over 1600 contacts per BGA.
The Government is currently developing programs that require prototype and production that will be used in test facilities, prototype systems, and shipboard or weapon environments.
The PCBs will be protected from the environment. Unless otherwise specified in the individual delivery orders, the PCBs must be able to meet military standards and withstand thermal and shock environments. The compact space allocated for these electronic components calls for a very dense configuration. Therefore, the high component density increases the PCBs design complexity, and will require a tightly controlled fabrication process by the PCBs manufacturer.
It is anticipated that multiple Indefinite Delivery Indefinite Quantity (IDIQ) contracts will be awarded to fulfill this requirement under the authority of and in accordance with FAR Part 12 â€" Acquisition of Commercial Items in conjunction with FAR Subpart 13.5 â€" Test Program for Certain Commercial Items.
The estimated release date of the solicitation is 17 October 2011 with an estimated award date of 1 February 2012. The minimum order amount per IDIQ contract is $2,000.00. For any orders in excess of the minimum, each IDIQ contractor will be given a fair opportunity to be considered. Delivery of all line items will be FOB Destination with the destination and time defined within each delivery order. The IDIQ contracts will be awarded using a best value analysis with the requirements that contractors meet the minimum specifications as detailed in the solicitation. All responsible sources may submit a proposal which shall be considered by the agency. Any questions regarding this requirement may be submitted to Dustin Barros at dustin.barros@navy.mil or by mail at Commander Code 254100D, NAWCWD, 429 E.
Bowen Rd. Stop 4015, China Lake, CA 93555-6108.
.

The scope of this contract includes fabrication, population, testing, and delivery of high density printed circuit boards (PCBs) for multiple customers at the Naval Air Warfare Center, Weapons Division (NAWCWD), China Lake, CA.



A few of the salient features of the High Density PCBs fabrication and population are defined below:



High Layer count boards: up to 30 layers



PCB Pin count greater than 500 pins/Sq. inch



Through, blind, buried, and micro vias



Fine Line Pitch BGA (0.8mm or smaller), High pin count (1600 or greater)



Differential and Controlled Impedance



Matched Length Traces



Flex Circuits: Rigid Multilayer and Rigid-flex Multilayer



Automated Optical Inspection (AOI) and Manual Inspection (including X-RAYS) to ensure all leaded solder joints and BGA solder joints are correctly formed and placed



The contract includes fabricating PCBs and/or populating PCBs with electronic components.

The electronic components may or may not be Government furnished material (GFM) to the contractor. The Government is seeking contractors that provide Turnkey Assembly services as well as contractors with the capability to purchase parts for PCB population. Specific parts shall be called out within individual delivery orders when required. The electronic components consist of thru-hole, surface mount, ball grid arrays (BGA), leadless parts, and unique packaging. The BGAs can be fine line with ball densities over 1600 contacts per BGA.



The Government is currently developing programs that require prototype and production that will be used in test facilities, prototype systems, and shipboard or weapon environments.

The PCBs will be protected from the environment. Unless otherwise specified in the individual delivery orders, the PCBs must be able to meet military standards and withstand thermal and shock environments. The compact space allocated for these electronic components calls for a very dense configuration. Therefore, the high component density increases the PCBs design complexity, and will require a tightly controlled fabrication process by the PCBs manufacturer.



It is anticipated that multiple Indefinite Delivery Indefinite Quantity (IDIQ) contracts will be awarded to fulfill this requirement under the authority of and in accordance with FAR Part 12 – Acquisition of Commercial Items in conjunction with FAR Subpart 13.5 – Test Program for Certain Commercial Items.

The estimated release date of the solicitation is 17 October 2011 with an estimated award date of 1 February 2012. The minimum order amount per IDIQ contract is $2,000.00. For any orders in excess of the minimum, each IDIQ contractor will be given a fair opportunity to be considered. Delivery of all line items will be FOB Destination with the destination and time defined within each delivery order. The IDIQ contracts will be awarded using a best value analysis with the requirements that contractors meet the minimum specifications as detailed in the solicitation. All responsible sources may submit a proposal which shall be considered by the agency. Any questions regarding this requirement may be submitted to Dustin Barros at dustin.barros@navy.mil or by mail at Commander Code 254100D, NAWCWD, 429 E.

Bowen Rd. Stop 4015, China Lake, CA 93555-6108.