PCB fabrication and assembly of hpsc processor card

NASA's Shared Services Center seeks fabrication and assembly of printed circuit boards for an HPSC processor card, with proposals due August 11, 2026, at 3:00 p.m. Central Time. The procurement is set aside for total small business, limiting competition to entities meeting SBA size standards.

Place of performance is Stennis Space Center, Mississippi, with delivery FOB Destination to Greenbelt, Maryland. The vendor must manufacture six bare 22-layer PCBs and assemble one of those boards, leaving five unassembled. All deliverables must be completed and shipped within twenty calendar days after receipt of the order, finalized manufacturing files, and components. Fabrication, testing, and inspection must comply with NASA/GSFC 500-PG-8700.2.5, IPC-2221 Class 3, IPC-2222 Type 3, IPC-6011 Class 3, and IPC-6012ES Type 3 standards. Fungus resistance testing is excluded; solderability testing is strictly required. Assembly must follow the provided Bill of Materials and assembly drawings, with assembly and soldering performed to IPC J-STD-001 Space Addendum or IPC-A-610 Class 3. The assembled board requires visual inspection and may require Automated Optical Inspection or X-Ray inspection. Deliverables must include a Certificate of Conformance, test reports with solderability results, and material certifications. Packaging must prevent physical damage, moisture ingress, and electrostatic discharge damage per aerospace handling procedures.

NAICS code is 334418; PSC is 5998. Contract is firm fixed-price with total price determined upon award. Evaluation uses lowest price technically acceptable (LPTA); quotes failing to satisfy all solicitation requirements are technically unacceptable and will be removed from consideration. Offerors must be registered at SAM.gov, include their CAGE Code/UEI in proposals, and reference the notice ID. Questions are due August 10 by 3:00 p.m. CT, submitted in writing to Cody Guidry at cody.d.guidry@nasa.gov. Quote validity is 30 days.