Microelectromechanical Systems (MEMS) Fabrication Support Services

Added: Mar 21, 2016 2:04 pm  

N00174-16-R-0015

Microelectromechanical Systems (MEMS) Fabrication Support Services

FSC Code: R799

NAICS Code: 332999

The proposed contract action is for MEMS fabrication support services for which the Government intends to solicit and negotiate with only one source under the authority of FAR 6.302. Interested persons may identify their interest and capability to respond to the requirement or submit proposals. This notice of intent is not a request for competitive proposals.  However, all information received within fifteen days after date of publication (05 April 2016) of this synopsis will be considered by the Government.  Total contract value is $708,487.14, which consist of a base year and four (4) one year options. A determination by the Government not to compete with this proposed contract is based upon responses to this notice and is solely within the discretion of the Government.  Information received will normally be considered solely for the purpose of determining whether to conduct a competitive procurement. The Government intends to make a sole source award to Corporation for National Research Initiatives MEMS Nanotechnology Exchange (MNX) 1895 Preston White Dr STE 100, Reston, VA 20191-5434.  MNX has access to the ARL cleanroom and ability to fabricate external designs and process flows.  No other contractors with access to the ARL cleanroom are authorized to fabricate external designs.  Fabrication at a different facility would require an unacceptable schedule delay NSWC IHEODTD requires a company that is capable of fabricating MEMS devices utilizing Government drawings and process flows at the Army Research Laboratory (ARL) cleanroom facility located in Adelphi, Maryland so that NSWC IHEODTD employees must be able to oversee, learn, and engage during the production of MEMS devices. The Contractor shall provide the necessary base Silicon wafers required for completion of microelectromechanical systems fabrication after the existing government supply of (6) 150mm Silicon-on-Insulator are exhausted.  Any unused wafers shall be transferred at no cost to the Government at completion of contract. The Contractor shall allow a 4-6 week lead time for ordering the wafers.  The Contractor will review the mask designs and provide advice as needed for step inspections, mask alignment or fabrication. Once the photolithography mask designs are approved, the Contractor will make the masks. The Contractor will develop processing sequences matching the desired tool set for the fabrication of the device(s) in consultation with the Government.  The majority of these tools will reside at the ARL cleanroom. The Contractor will perform MEMS fabrication processing steps including one-sided strip of thick low-stress Silicon Nitride (SiN) film, aligned shadow mask, conformal deposition of a metal, low-impact dicing (or alternative methods), and Hydrofluoric Acid vapor release. The Contractor will process the number of wafers detailed in the task orders issued under this contract. The Contractor will inspect the wafers after the critical steps and the results shall be posted by the Contractor on a secure webpage visible to the Government only. Requirements for inspection derive from the drawing package.  The Government requires approval rights after critical processing steps before proceeding.  Critical steps include Deep Reactive Ion Etching (DRIE), Silicon Nitride deposition, metal deposition, Hydrofluoric Acid vapor release and dicing. The Contractor shall prepare and submit monthly progress reports, as well as a final report after completion of the fabrication summarizing the collected data and findings. FSC Code R799 and NAICs code 332999.  Inquiries may be directed to Waylin Duhon NSWC IHEODTD ; email Waylin.Duhon@navy.mil, BLDG. 1558, Code 026F, Indian Head, Maryland 20640.