HyperSTEP Hot Structure RFI

NASA Johnson Space Center is seeking industry input for the fabrication of hot structure components for the HyperSTEP vehicle, a scaled-down lifting-body design for hypersonic flight testing. The Request for Information (RFI) targets manufacturers capable of producing a hot structure aeroshell comprising a nose cap, bottom tub, top shell, and two body flaps that can withstand extreme heat conditions exceeding 100 Watts/cm2. NASA is specifically interested in gathering detailed information about potential material systems such as C/SiC, SiC/SiC, or high-temperature metallic alloys, along with comprehensive manufacturing processes and associated costs. Respondents must provide information about their manufacturing capabilities, material properties, testing data, timelines, and rough order of magnitude (ROM) costs for both the nominal vehicle size (37.1" long) and a 1.76x scaled version. The RFI responses are limited to 10 pages and must be submitted electronically to the NASA contracting officer by February 18, 2025.

The procurement has no specific set-aside designation and is categorized under NAICS code 336414 for Guided Missile and Space Vehicle Manufacturing. NASA plans to develop two vehicle versions, with Version 1 using ablative thermal protection system (TPS) for launch in Calendar Year 2026 and Version 2 utilizing the hot-structure design to be developed and fabricated in Fall 2025 through CY2026, with flight testing anticipated in CY2027. The target cost for the project is under $1 million for single-use ship sets and under $2 million for reusable ship sets. The RFI represents a preliminary market research effort to identify potential contractors and technical capabilities for this advanced hypersonic vehicle development initiative. Interested manufacturers will need to demonstrate technical expertise in high-temperature materials, advanced manufacturing techniques, and the ability to meet NASA's stringent performance and cost requirements for this innovative aerospace project.