F-16 Circuit Card Assembly- 5-Year IDIQ
Closed Pre-Solicitation Posted
- Solicitation number
- FD20202600237
- Agency
-
Air Force Sustainment Center
Air Force Materiel Command, Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334412 Bare Printed Circuit Board Manufacturing
- Place of performance
- Hill Air Force Base, Utah 84056, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Air Force Materiel Command Air Force Sustainment Center intends to solicit a 5-year firm fixed price IDIQ contract for F-16 Circuit Card Assembly (NSN 5998-01-653-6192 WF, P/N 187218-001) with a response deadline of September 8, 2026 for pre-solicitation qualification packages. The acquisition is Full and Open Competition with no set-asides, restricted to responsible qualified sources only. Offerors must complete a Manufacturing Qualification Requirements (MQR) Source Approval Request (SAR) package prior to solicitation posting; qualification is mandatory for contract award eligibility and will not be delayed for vendor demonstration. The initial order quantity is 36 units.
Place of performance and delivery is Hill Air Force Base, Utah (7537 Wardleigh Road, Building 849W, DLA Distribution Depot Hill). Offerors must possess or demonstrate access to facilities and equipment for manufacturing, inspection, testing, packaging, and storage, certified for government evaluation. The circuit card assembly must comply with ESA-approved engineering data, GE Aviation Systems LLC drawing 187218 or Utah State University Space Dynamics Laboratory drawing 205-4401, Unique Identification requirements per DFARS 211.274, and MIL-HDBK-61B with AS9102 compliance. ESD sensitivity applies. First Article Qualification testing requires a test plan submitted 45 calendar days after award (government review within 45 business days) and a complete test report with at least 90 days advance notice for government witnessing. A Counterfeit Prevention Plan is due 30 calendar days post-award. Estimated qualification costs are $3,500 with an estimated 180-day completion timeline; qualification results notification occurs within 60 days of product submission.
Technical Data Package and supporting documents require DD2345 certification or Joint Certification Program listing for SAM.gov access. Small businesses without teaming agreements must perform more than 50% of manufacturing in-house. Packaging compliance includes MIL-STD-129 Revision R, MIL-STD-2073-1 Revision E, and UN-regulated heat-treated wood packaging per ISPM No. 15. FAR 52.225-5 (Trade Agreements) applies; FAR Part 12 does not.
Contact: Tracey Behringer (tracey.behringer@us.af.mil), Brandon Moses (Brandon.moses.1@us.af.mil), and Avery Irwin (Avery.irwin@us.af.mil).
Notice text
2 versions
Update #2 · Latest ·
This is a Pre-Solicitation Notice for an upcoming Solicitation for: Circuit Card Assembly to support the F-16 Aircraft. See the attachments attached to learn more about this opportunity.
To gain access to the Technical Data Package (TDP) and supporting documents, the individual requesting access in SAM.gov must be on the DD2345, or be showing in the Joint Certification Program (JCP) as such. Any individual not listed will have their request rejected.
Please refer to the MQR provided in the attachments Section C: e, i, & j. "The award will not be delayed to provide the vendor with an opportunity to demonstrate its ability to meet the standards specified in this qualification requirement." "The offeror must be fully qualified in order to be eligible for a contract award"
Update #1 ·
F-16 Circuit Card Assembly 5-Year IDIQ
Files
| File | Type | Posted |
|---|---|---|
| Attach_13_CDRLs.pdf | ||
| Attach_12_MQR.pdf | ||
| Attach_01_Item_Description.pdf | ||
| Attach_02_Package_Requirement.pdf | ||
| Pre-Sol Notice 6192 FA821226Q0005.pdf | ||
| Attach_04_TRNSPDATA.pdf |
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