Electronics Assembly / Packaging of Micro-Electro-Mechanical Systems (MEMS) Devices

The Space and Naval Warfare Systems Center, Pacific (SSC Pacific) intends toissue Request for Quote (RFQ) No. N66001-11-Q-0073 to obtain contractualsupport for the SSC-Pacific Advanced Integrated Circuit and Sensors Branch(Code 55660). Requirements include all processes required to completelyassemble (package) a Micro-Electro-Mechanical Systems (MEMS) device. Thetypical assembly will consist of, but is not limited to; a MEMS die with adelicatemoveable proof mass, a light source such as a Vertical Cavity Surface EmittingLaser (VCSEL), a discrete monitor photodiode, a resistive heating element, andspacer material. These components will be mounted in a ceramic or plasticpackage and precisely aligned to one another. Wire bonding will provide theelectrical connection between the MEMS assembly and the package.Subsequent hermetic sealing in vacuum or an inert atmosphere will follow. Thiscontract will be for Firm-Fixed-Price, purchase order. This RFQ will be aTotalSmall Business Set Aside. The North American Industry Classification System(NAICS) Code is 334413 and the Small Business Size Standard is 500Employees. The estimated released date for the solicitation is anticipated by11 July 2011 and response will be due 10 days thereafter. The solicitationwillonly be available electronically. Electronic copies of the RFQ may beobtainedfrom the SPAWAR E-Commerce website at https://e-commerce.spawar.navy.milunder SSC Pacific "Open Solicitations". Hard copy versions of the RFQ and anysubsequent amendments will not be available. Firms are encouraged to reviewthe website regularly for important solicitation information.