Ceramic ball grid arrays and flip chip

N00164-22-Q-0183 – CERAMIC BALL GRID ARRAYS AND FLIP CHIP– FSC/PSC 5998 –
NAICS 334413
ISSUE DATE 12 JUL 2022 – CLOSING DATE 18 JUL 2022 – 2:00 PM Eastern Time
ITEM DESCRIPTION- Naval Surface Warfare Center (NSWC) Crane has a requirement for
ceramic ball grid arrays and daisy-chained flip chip with solder bumps.
Firm Fixed Prices Are Being Solicited. This Is A FAR 13 Competitive Requirement, 100 Percent
Set Aside For Small Business. Please Include Shipping FOB Destination, Crane Indiana 47522.
Contractors must be properly registered in the System for Award Management (SAM). Offerors
may obtain information on SAM registration and annual confirmation requirements by calling 866-
606-8220 or via the internet at https://sam.gov.
This solicitation is being issued pursuant to the procedures at FAR Part 13. Synopsis exception
FAR 5.202(a)(13) applies and Solicitation Number N00164-22-Q-0183 is hereby issued as an
attachment hereto.
Contract Opportunities on https://sam.gov/ has officially replaced FBO.gov
All changes to the requirement that occur prior to the closing date will be posted to Contract
Opportunities on https://sam.gov/. It is the responsibility of interested vendors to monitor
https://sam.gov/ for any amendments, which may be issued to this solicitation.
For changes made after the closing date, only those offerors that provide a quote will be provided
any changes/amendments and considered for future discussions and/or award.
Offers shall be e-mailed to Jaclyn.m.dufresne.civ@us.navy.mil. All required information must be
received on or before 18 JUL 2022 2:00 PM EASTERN TIME.