Bondjet BJ855 Large Area Wedge Bonder
Closed Solicitation Posted
- Solicitation number
- PR408727
- Agency
-
Department of Energy
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- Place of performance
- Oak Ridge, Tennessee 37830, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Department of Energy, through Oak Ridge National Laboratory (ORNL), is seeking to procure a Bondjet BJ855 Large Area Wedge Bonder, a specialized semiconductor manufacturing equipment used for wire bonding applications. This procurement falls under NAICS code 333242 for Semiconductor Machinery Manufacturing and includes comprehensive specifications for 100 units of various components including the main bonding equipment, microscopy systems, accessory boxes, and related tooling. The solicitation operates under FAR 52.211-6 "Brand Name or Equal" provisions, with ORNL expressing preference for USA domestic solutions while allowing for equivalent alternatives. The contract will be awarded using lowest price technically acceptable evaluation criteria to the vendor that meets all technical specifications and requirements. The original proposal submission deadline was August 28, 2025 at 11:00 AM EST, with questions due by August 26, 2025, though the current posting shows an updated due date of September 2, 2025.
This procurement does not utilize any set-aside designations and is open to all qualified contractors capable of providing the specified semiconductor bonding equipment. The solicitation includes detailed line items for installation and training services spanning 3 days including travel expenses, parts and labor warranty coverage, and provisions for extended warranty periods, though specific pricing remains to be determined for several components. The contract will be performed at Oak Ridge, Tennessee, where ORNL's facilities are located. UT-Battelle, LLC, serving as the Department of Energy's contractor, is conducting this procurement and will govern the resulting agreement under Purchase Order Commercial Items guidelines and specific supplemental flowdown document provisions. The procurement encompasses not only the primary bonding equipment but also supporting systems such as LEICA M50 microscopes, ultrasonic mode selection capabilities, and additional monitoring cameras for comprehensive bonding operations.
Notice text
Bondjet BJ855 Large Area Wedge Bonder
Files
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