BGA Workstation

*Unit must be compatible with 120 VAC, 60 Hz at 2400 Watts maximum, and capable of operating from one 20 A circuit breaker.

*Top-side heater (500 Watt min), Bottom-side IR Preheater (1000 Watt min) needs to be adjustable with multiple emitters capable of preheating large, high mass assemblies

*Vacuum Pick must be counterweight balanced and utilize an optical sensor and precision high temperature linear ball bearings to ensure precise placement and pick up of parts from PCB. Multiple Vacuum Picks

*Must be capable of precision placement of the reflow head and soft landing of components with .00011-inch placement accuracy. Stepper motor and position encoding must provide smooth, precise movement, with no drift, allowing for repeatable and accurate placement

*To ensure proper placement accuracy and precise positioning stepper motors must meet 28μm (.0011") accuracy

*Must incorporate adjustable/removable Board Support Beam; Plus, up to four stationary adjustable height support pins to prevent PCBs from sagging/warping during rework

*Each profile zone must support a Maximum Target Temperature of 328 degrees C. (624 degrees F)

*Must be equipped with a precision PCB Holder featuring micrometer X & Y adjustment, board holder arms that are spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards that have non-uniform edges

*Must support PCB Size up to 610mm x 610mm (24” x 24”)

*Must be able to accommodate a component Size of from 1mm Sq. to 65mm Sq.

*Must have a non-contact Pyrometer and multiple thermocouple inputs that monitor and control the ramp-rate and temperature of the component by controlling top and bottom heaters throughout the reflow process.

*Station must utilize a high-definition Optical Alignment System using a High Definition (1080p) color camera with up to 240X zoom, high intensity LEDs for shadow-free lighting of PCB and components. This system should not require routine calibration

* Cam that allows the operator to watch the entire reflow process in real time to verify solder melt. The camera arm must rotate to provide a 180-degree view at a fixed distance, with minimal focus adjustment and ease of use.

*An automatically controlled and motorized Optics Housing with retractable optics housing that protects the Vision Overlay System from dirt and contamination.

*Must be capable of Quad-Field Imaging for large component alignment (including fine-pitch QFPs), allowing up to four opposite corners of a large component (and its pads) to be viewed under higher magnification

*The system must operate on a single axis, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow

*System must have an Auxiliary Cooling Fan to ensure adequate cooling of the PCB

*System Software should be intuitive, user-friendly and Windows-compatible with free upgrades.

*Video Monitor at least 24” flat panel monitor mounted on adjustable arm

*Video Inputs must be USB 3.0 or later

*Support a minimum of two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement, including a component holding system for parts under 5mm Sq.

*Must have a Flux Dip Plate  for automated flux dipping

*Must include a Pik-Vac Vacuum Wand, with auto-off, supporting manual vacuum pick-up capability for handling SMDs.

*Must come with a minimum of one year Warranty

*Must include onsite set-up assistance and hands-on training using the Rework Station for up to twelve people.