Award Notice: Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

Award Notice Posted

Solicitation number
1333ND26CNB030008
Agency
Awarded
to Auburn University
Set-aside
No set-aside

Opportunity facts

Contract number
1333ND26CNB030008 Federal contract award
NAICS code
541713 Research and Development in Nanotechnology
PSC
5961 Semiconductor Devices And Associated Hardware
Place of performance
Boulder, Colorado 80305, United States
Points of contact

Notice details come from SAM.gov. Updated .

About this opportunity

The National Institute of Standards and Technology awarded a fixed-price contract valued at $1 million to Auburn University on April 28, 2026, for micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture.

The contract action was noncompetitive, made on the basis that only one responsible source could satisfy agency requirements. No set-aside applied. Contract number is 1333ND26CNB030008.

Notice text

The contract action was fixed-price and non-competitive because only one responsible source and no other supplies or services will satisfy agency requirements.

Awarded contract 1333ND26CNB030008 to AUBURN UNIVERSITY for 1000000.00 on 2026-04-28.

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