Award Notice for Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

Award Notice Posted

Solicitation number
133ND26CNB030008
Agency
Awarded
Set-aside
No set-aside

Opportunity facts

Contract number
133ND26CNB030008
NAICS code
541713 Research and Development in Nanotechnology
PSC
5961 Semiconductor Devices And Associated Hardware
Place of performance
Gaithersburg, Maryland 20899, United States
Points of contact

Notice details come from SAM.gov. Updated .

About this opportunity

The National Institute of Standards and Technology awarded a fixed-price contract valued at $1 million to Auburn University on April 28, 2026, for micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture.

The award was made noncompetitively under the rationale that only one source is capable of meeting NIST's requirements. No set-aside applied to this procurement.

Notice text

This contract action was awarded fixed-price and non-competitive because only one source is capable of meeting NIST's requirements. 

Awarded contract 133ND26CNB030008 to AUBURN UNIVERSITY for 1000000.00 on 2026-04-28.

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