TFLN Chips Requirement.pdf
PDF 101 KB Posted
- Attached to
- Thin-Film Lithium Niobate (TFLN) Photonic Chips
- Solicitation number
- AMD-RFQ-25-7700689
About this file
This is a Requirements Document from the National Institute of Standards and Technology (NIST) for fabricating Thin-Film Lithium Niobate (TFLN) Photonic Chips. NIST seeks a contractor to produce seven or more photonic chips with specific technical specifications, including x-cut TFLN with a film thickness between 400-700 nm, optical and electronic components like waveguides, micro rings, couplers, and heaters, and a minimum chip size of 45 mm². The contractor must provide a design manual, process development kit, design rule checks, and chip singulation services.
The procurement is an unrestricted competition with a ten-month performance period, requiring delivery of fabricated chips to NIST within two weeks after fabrication. Quotations are due by April 7, 2025, at 12:00 PM ET, submitted electronically with two volumes: a technical response and a price quotation. The evaluation will use a best value trade-off method, with technical approach and corporate experience weighted more heavily than price. The anticipated contract is a firm fixed-price purchase order, with payment terms of Net 30 days upon receipt and acceptance of deliverables.
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Other files
| File | Type | Posted |
|---|---|---|
| Solicitation TFLN Final.pdf | ||
| Provisions Clauses.pdf |
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Text version
NIST Requirements Document Thin-Film Lithium Niobate (TFLN) Photonic Chips
I. Background:
The Information Technology Laboratory (ITL) at the National Institute of Standards and Technology (NIST) performs research in quantum communications and networking. ITL is investigating integrated optics using the thin-film lithium niobate (TFLN) platform for manipulating optical states and for performing quantum measurements.
II. Purpose:
The purpose of this acquisition is to procure fabricated TFLN photonic chips with designs specified by NIST.
III. Requirements:
A. Fabrication of Government-designed TFLN Photonic Chips
The Contractor shall fabricate seven or more TFLN photonic chips in accordance with the final custom-design TFLN photonic chip.
• Chips shall be fabricated using x-cut thin-film lithium niobate (TFLN) o The lithium niobate film thickness shall be between 400 nm to 700 nm.
o The TFLN layer shall sit on top of a silicon dioxide layer of at least 2 micrometers, which shall sit on top of a silicon handle wafer
• Chips shall contain optical components including waveguides, micro rings, delay lines, 1x2 and 2x2 couplers, edge couplers and surface grating couplers, as well as electronic components including electrical lines and heaters
• Chip size shall be at least 45 mm2
The contractor shall provide tools including a design manual and process development kit (PDK) to allow the Government to design the TFLN photonic chips. The contractor shall provide design rule checks, chip singulation, and process control monitoring (preferably on-chip). The contractor shall provide incidental advice to ensure successful design of devices using the contractor’s fabrication services.
Fabrication shall be completed within four months following design finalization.
IV. Period of Performance / Delivery Requirements
The period of performance shall be ten months from date of award and the Contractor shall deliver the fabricated chips to NIST within two weeks after fabrication. Chips shall be delivered FOB Destination.
FOB Destination means the contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in this document, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment at the delivery point specified in this document; and pay all charges to the specified point of delivery.
The delivery shall be made to the NIST Shipping and Receiving address identified below. The delivery will then be directed to the equipment’s final destination, also identified below.
NIST Shipping & Receiving 100 Bureau Drive Building 301 Gaithersburg, MD 20899-0001
NIST Final Delivery Destination 100 Bureau Drive Building 222, Room B225 Gaithersburg, MD 20899-8913
V. Inspection and Acceptance:
In addition to the inspection and acceptance terms articulated in 52.212-4, the Government will inspect the delivery to ensure that all products are provided in accordance with the requirements identified in this Statement of Work. Delivered products found to be deficient or damaged shall be replaced by the Contractor at the Contractor’s expense.
VI. Payment Terms
The Contractor will be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice for accepted deliverables.
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