Task Order 0001 PWS 21-1H6 Redacted.pdf

PERFORMANCE WORK STATEMENT (PWS)

Microelectronic Technical and Supply Chain Analyses (MTASCA)

Indefinite Delivery Indefinite Quantity (IDIQ) Contract

PWS 21-1H6

7 June 2021

Contract Officer Representative

1.0 TITLE: TAPO Technology Needs Assessment

1.1 Background: The Department of Defense (DoD) and other United States Government (USG) entities require access to a wide range of microelectronics services. Due to the globalization of the integrated circuit (IC) industry, ensuring the confidentiality and integrity of specialized military devices has become increasingly challenging. The DoD Trusted Foundry Program was established to ensure mission-critical national defense systems can obtain integrated circuits, such as application specific integrated circuits (ASICs) from Trusted sources that have the capability to protect the confidentiality and integrity of these devices to at least the secret classification level. The program includes accreditation of trusted sources for design, aggregation, mask manufacturing, wafer fabrication, post-processing, packaging/assembly, test, and broker services. A key requirement includes access to Trusted foundry capabilities for leading edge and state-of-the-art (SOTA) Complementary Metal-Oxide-Semiconductor (CMOS) and Silicon-Germanium (SiGe) Bipolar-CMOS (BiCMOS) technologies. To that end, the Trusted Access Program Office (TAPO) is utilized to aggregate DoD volume for ASICs into a single master contract to leverage economies of scale in access and Intellectual Property (IP) retention. The agreement with the current vendor provides pure commercial access, International Traffic in Arms Regulations (ITAR), and Trust when requested.

1.2 Purpose: The purpose of this study is to analyze the current technologies available that meet TAPO customer demands.

1.3 Performance: Work is to be accomplished under the MTASCA IDIQ contract. Certification by the Government of satisfactory services provided is contingent on the contractor performing in accordance with the terms and conditions of the referenced contract, this PWS, the approved task proposal, any associated work orders, and all amendments. The Defense Microelectronics Activity (DMEA) project engineer will monitor the program via review of the monthly status reports and the final report.

2.0 REFERENCED DOCUMENTS: None.

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 PROJECT MANAGEMENT: The contractor shall perform administrative, technical, and financial management and manpower reporting functions during the course of this PWS and shall maintain status of their effort towards achieving the PWS objectives. The weekly report shall include, but not be limited to: cost accrued, progress/accomplishments to date, activities planned for next period, and concerns to be addressed.

(A001: Weekly Status Report)

3.1.2 TECHNICAL INTERCHANGE MEETINGS: The contractor shall attend and co-chair with the Government Technical Interchange Meetings (TIMs) on a weekly basis. The contractor shall record the minutes for each meeting.

(A002: TIM Minutes)

3.1.3 TRAVEL: Travel may be required during the conduct of this PWS. Negotiated travel shall be approved upon task award. Additional travel shall be authorized only upon written approval of the Procurement Contracting Officer

(PCO).

(A003: Trip Report)

3.2 REQUIREMENTS:

3.2.1 TAPO TECHNOLOGY NEEDS ASSESSMENT: The contractor shall perform a technology needs assessment for DMEA. The objective of the assessment is to provide information to assist DMEA in determining the current state of the microelectronics industry such that DMEA can make a determination regarding the number of available sources that exist that are capable of meeting the TAPO requirements. The assessment shall include the focus areas described in 3.2.1.1-3.2.1.5. The contractor shall develop a report containing all of the data and conclusions based on the assessment. The contractor shall provide a preliminary report three (3) weeks prior to submitting the final report.

(A004: DI-MISC-80508 – TAPO Technology Needs Assessment Report)

3.2.1.1 TECHNOLOGY ACCESS EVALUATION: The contractor shall evaluate DMEA’s access to leading edge and SOTA technologies based on historical TAPO customer needs and future anticipated needs, see Attachment 1:

TAPO Technology Demands. For the purposes of this study, leading edge is defined as sub-14nm technology nodes and SOTA is defined as sub-65nm. The contractor shall evaluate at least the following:

Access to 12nm or equivalent technologies Access to 22nm Fully Depleted Silicon-on-Insulator (FD-SOI) or equivalent technologies Access to FD-SOI technologies below 22nm, for example 12nm FD-SOI or equivalent technology Access to 45nm Silicon-on-Insulator (SOI) that has features for Radio Frequency (RF) such as thick metals, custom IP, for example 45RF and/or 45RFe processes at Global Foundries or equivalent technologies Access to 45nm Partially Depleted SOI (PD-SOI) or equivalent technologies Access to Domestic leading edge and SOTA SiGe BiCMOS technologies below 180nm or equivalent technologies Access to 300mm wafer SiGe or equivalent technologies Access to domestic mainstream CMOS technologies below 180nm or equivalent technologies Access to 200mm wafer Gallium-Nitride (GaN) or equivalent technologies Access to 300mm wafer SOI or equivalent technologies

3.2.1.2 FOUNDRY EVALUATION: The contractor shall evaluate the IP ecosystem supporting all of the technology nodes identified in 3.2.1.1. The contractor shall identify which foundries that are currently operational have qualified processes or equivalent to the technologies identified in 3.2.1.1. The contractor shall evaluate the ability for each foundry identified in 3.2.1.2 to margin each of the technologies identified in 3.2.1.1 down to the Military Standard (MIL-STD) temperature range Process, Voltage, Temperature (PVT) points. The contractor shall evaluate each technology identified in 3.2.1.1 relating to each technologies inherent Radiation tolerance/hardness.

The contractor shall evaluate each foundry’s aggregated multi-project wafer (MPW) or shuttles program for prototype development, research and development (R&D), and for dedicated runs as needed, and each foundry’s aggregation capabilities for the MPW/shuttle programs. The contractor shall evaluate the robustness of the IP library available for users for each foundry identified in 3.2.1.2.

3.2.1.3 HANDLING PROTOCOL EVALUATION: The contractor shall perform an evaluation on each foundry’s ability to meet at least the following handling protocols for each technology identified in 3.2.1.1:

International Traffic in Arms Regulations Trusted Unclassified Trusted Classified Other technology protection methodologies

The contractor shall evaluate each foundry’s willingness and ability to achieve a flow for any of the handling protocols identified in 3.2.1.3. The contractor shall provide a timeline for availability as well as the resources required for each handling protocol identified in 3.2.1.3 where the foundry is willing to achieve a flow in the future but cannot currently meet the requirements. The contractor shall evaluate the ability to perform domestic Graphic Design System II (GDS-II) or Open Artwork System Interchange Standard (OASIS) design data release and photomask sourcing to support the handling protocols identified in 3.2.1.3. The contractor shall evaluate the domestic mask sourcing capacity for each technology identified in 3.2.1.1, relating to either the handling protocols identified in 3.2.1.3 or if it is purely a commercial fabrication run.

3.2.1.4 TECHNOLOGY ROADMAP: The contractor shall provide Domestic technology roadmaps. The technology roadmaps shall include a roadmap to future access for all of the technologies identified in 3.2.1.1. The roadmap shall include the current state as well as the necessary steps and resources required to reach the future access. The roadmap shall include future technologies that are currently in development or planning. The contractor shall evaluate the potential advanced access to these technologies in advance of general availability. The roadmap shall include a Radiation Tolerant/Hard product roadmap. The roadmap shall consider historical TAPO customer request needs as well as future anticipated needs, see Attachment 1. The contractor shall evaluate the DoDs current and future anticipated technology needs, including specific Major Defense Acquisition Programs (MDAP) or programs of record, requiring access the 12nm, 10nm, 7nm, 5nm and future technologies, as well as what specific requirement (for example Size, Weight and Power) is being met by those technologies.

3.2.1.5 COST-BENEFIT ANALYSIS: The contractor shall perform a Cost-Benefit Analysis (CBA) on TAPO using each of the other foundries identified in 3.2.1.2. The CBA shall consider that TAPO has programs supporting MDAPs that are currently in development targeting the current performer. The CBA shall evaluate how retargeting all of the programs in flight to another foundry, including impact on cost, schedule and any other impacts. The CBA shall consider at a minimum the 12SOI/45RF transfer, and the GaN effort. The CBA shall evaluate the cost impacts of margining Process Design Kits (PDK) to the MIL-STD for all PDKs of value. The CBA shall address the current efforts leveraging TAPO’s PDKs to develop and source PDKs targeting radiation tolerance requirements. The contractor shall evaluate the ideal contract period, whether a five (5) year contract, consisting of one (1) base year plus four (4) option years, or a ten (10) year contract, consisting of one (1) base year plus nine (9) option years provides the best value to DMEA, considering both current and future anticipated needs as well as the microelectronics industry trends and future technology availability. The contractor shall evaluate each foundry identified in 3.2.1.2 as it related to their:

History and past performance as a direct (under contract) supplier to the DoD History and past performance as a pure play foundry Available commercial IP ecosystem Defense Industrial Base (DIB) familiarity of PDKs

3.3 Program Summary: The contractor shall summarize all work accomplished under this PWS, including analysis conclusions, significant policy recommendations and implementations and recommendations, in a final report.

(A005: Final Report)

4.0 DATA ITEMS: The contractor shall develop, coordinate, and complete documents, briefings, and papers pertaining to the requirements paragraphs. The following CDRLs apply to this PWS and shall be submitted as described below. Indicate on the cover of all delivered data the contract number, PWS number, PWS title, and the current DMEA Project Engineer name and office symbol.

1. Sequence Number A001

2. Title Status Report

3. Subtitle Weekly Status Report

4. Authority DI-MGMT-80368A

5. Contract Reference Para. 3.1.1

6. Requiring Office DMEA/MECA

7. DD 250 Req LT

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA/MECA.

10. Frequency WKLY

11. As of N/A

12. Date of First Submission ASREQ - 7 calendar days after Contract Award

13. Date of Subsequent Submission ASREQ – every 7 calendar days after first submission

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable.

1. Sequence Number A002

2. Title Conference Minutes

3. Subtitle Technical Interchange Meeting Minutes

4. Authority DI-ADMIN-81250

5. Contract Reference 19-9E2 Paragraph 3.1.2

6. Requiring Office DMEA/MECA

7. DD 250 Req LT

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA/MECA

10. Frequency WKLY

11. As of N/A

12. Date of First Submission ASREQ - 7 calendar days after the first TIM

13. Date of Subsequent Submission ASREQ - 7 calendar days after each TIM

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable. Include presentation materials in the TIM minutes.

1. Sequence Number A003

2. Title Trip/Travel Report

3. Subtitle Trip Report

4. Authority DI-MISC-81943

5. Contract Reference Para. 3.2.2

6. Requiring Office DMEA/MECA

7. DD 250 Req LT

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA/MECA.

10. Frequency ASREQ - As often as Travel occurs.

11. As of N/A

12. Date of First Submission ASREQ - 7 calendar days after the first Travel

13. Date of Subsequent Submission ASREQ - 7 calendar days after each Travel

14. Distribution See Distribution List

1. Sequence Number A004

2. Title Technical Report - Study/Services

3. Subtitle TAPO Technology Needs Assessment Report

4. Authority DI-MISC-80508

5. Contract Reference Para. 3.2.1

6. Requiring Office DMEA/MECA

7. DD 250 Req DD

8. App Code A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA/MECA.

10. Frequency 2TIME/R -Two times and revisions as necessary

11. As of N/A

12. Date of First Submission 5 Weeks after contract award

If disapproved, the contractor shall resubmit within 7 calendar days.

13. Date of Subsequent Submission 8 Weeks after contract award

If disapproved, the contractor shall resubmit within 7 calendar days.

14. Distribution See Distribution List

1. Sequence Number A005

2. Title Technical Report - Study/Services

3. Subtitle Final Report

4. Authority DI-MISC-80508

5. Contract Reference Paragraph 3.4

6. Requiring Office DMEA/MECA

7. DD 250 Req LT

8. App Code A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA/MECA.

10. Frequency ONE/R - One time and revisions as necessary

11. As of N/A

12. Date of First Submission 7 Calendar days before the end of the PoP

13. Date of Subsequent Submission If disapproved, the contractor shall resubmit within 2 calendar days.

14. Distribution See Distribution List

5.0 POINTS OF CONTACT: