Tab 04 SOW.pdf
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- Attached to
- MultiPrep™ Precision Polishing System with Touchscreen for 8" Platen Federal contract opportunity
- Solicitation number
- 80NSSC26931087Q
About this file
This is a Statement of Work and Specifications for a high-precision 8-inch polishing system designed for delicate microscopic sample preparation. The system is required for the Research and Engineering Directorate's Analytical Science Group and was prepared by Michael J. Kulis, the Analytical Science Group Lead, on April 13, 2026.
The specifications require a semiautomatic polishing system with multiple precision control features to eliminate user variability in sample preparation. Key technical requirements include precision pitch and roll micrometers for angular positioning adjustments, 1 micron resolution for real-time tracking of material removal, and the ability to preset specific removal amounts for unattended operation. The system must incorporate a specially designed drive for delicate, unencapsulated TEM (Transmission Electron Microscopy) wedge thinning that absorbs subtle movements to prevent sample fracture. Additional requirements specify quick-removal sample fixtures that maintain polishing plane consistency during reinspection and repositioning, independent control of sample oscillation and rotation (capable of full 360-degree rotation or limited back-and-forth sweep motions to simulate hand-polishing and reduce stress on fragile materials), and a dual camera system for precise sample alignment during testing with a secondary camera for photo-documentation.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| Tab 07 Capability Statement.pdf |
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Text version
Statement of Work and Specifications for a high-precision 8” polishing system.
The system shall have the ability to eliminate user variability through high-precision, semiautomatic controls specifically designed for delicate microscopic sample preparation.
The system shall have precision "pitch and roll" micrometers that allow for angular positioning adjustments in fine increments.
The system shall provide 1 micron resolution for tracking material removal in real time.
The system shall provide users with the ability to preset specific removal amounts, allowing for unattended operation once target depth is reached.
The system shall have a drive specifically designed for delicate, unencapsulated TEM wedge thinning to absorb subtle movements that might otherwise fracture the sample.
The system shall allow for the quick removal of sample fixtures for inspection and exact repositioning afterward, ensuring the polishing plane remains the same.
The system shall provide independent control over both sample oscillation and rotation, which can be full 360° or limited back-and-forth "sweep" motions to simulate hand-polishing and reduce stress on fragile materials.
The system shall have a dual camera system that allows for precise sample alignment during testing along with a secondary camera for photo-documentation.
Michael J. Kulis 4/13/2026 Technical User Name Date
Analytical Science Group Lead
Title
Research and Engineering Directorate
Office
File details come from the government source that posted it. Updated .