Statement of Work.docx

STATEMENT OF WORK

FOR

PRINTED CIRCUIT BOARD (PCB) SERVICES

1.0 Background

1.1 AISD designs, develops and produces technically-advanced airborne telemetry and instrumentation systems for a variety of missile and aircraft platforms requiring the highest quality and reliability standards. AISD is required to ensure these systems will meet or exceed the specific operational requirements while exposed to the rigors of flight testing, the flight environment, and for tactical robustness.

1.2 AISD maintains strict compliance with, the requirements of COMNAVAIRFORINST 4790.2B, Naval Aviation Maintenance Program and DCMA INST 8210.1C, Contractor’s Flight and Ground Operations for a variety of AISD’s composite products. To meet the highest level of quality and safety standards in DoD, NAVAIR, and NAWCWD, AISD has achieved certification to ISO9001:2015 and AS9100D, Quality Management Systems Audit Requirements for Aviation, Space, and Defense Organizations.

2.0 Applicable Documents

3.0 Scope

The Contractor shall provide Printed Circuit Boards (PCBs), Antenna Boards and PCB Solder Paste Stencils (Stencils) in the characteristics specified in each order, for use at the Naval Air Warfare Center Weapons Division (NAWCWD). All delivered products shall be in accordance with the applicable industry quality standards set in forth by the documents referenced in Section 2.0 of this Statement of Work.

3.1 The contractor shall provide leaded or lead free, multi-layer and single- and double-sided PCBs and Antenna Boards. All delivered boards shall posess characteristics including:

3.1.1 Physical size from small to large.

3.1.2 Mixed component technologies (both surface mount and through-hole).

3.1.3 Flex and Rigid-Flex circuits.

3.1.4 Positive Etchback

3.1.5 Both conductive and NON-conductive epoxy hole-fill on holes as small as 6 mils.

3.1.6 Vias plated shut and vias with copper caps.

3.1.7 Blind and buried vias, micro vias, sequential micro vias, and laser drilled vias.

3.1.8 Board thickness to via diameter aspect ratio of 15:1.

3.1.9 Suitable for population with Ball Grid Array (BGA) and Land Grid Array (LGA) integrated circuits

3.1.10 Finished pad and trace sizes no smaller than detailed in the design files.

3.1.11 Trace pitch down to 0.102 mm (0.004 inches) and with drilled hole positioning drift of less than 0.003 inch per 24 inch panel.

3.1.12 Surface mount component sizes of 0201 or greater, and BGA/Fine Pitch of 16 mil (0.4mm).

3.1.13 Surface finishes of Tin/Lead, Silver, Gold fingers, ENIG, OSP, Hard and Soft Gold.

3.1.14 Copper clad microwave laminate materials, such as Durioid, for Antennas.

3.1.15 Capable to control and verify impedance on all PCBs

3.1.16 Screened-on solder paste (aka SIPAD)

3.2 The contractor shall provide framed and frameless full-sized and mini or rework solder paste stencils that possess characteristics including:

3.2.1 Custom Large Area Stencils, Laser Cut Stencils, Electro-Formed, Stepped Stencils, Foil ONLY Stencils, Epoxy Stencils, Short run Prototype Stencils with fixture, Micro BGA and BGA rework stencils, Hybrid Stencils (Apertures Chemically etched and Laser Cut), Relief Stencils/ Stacked Stencils.

3.2.2 A variety of thicknesses. Stencil Materials to include Stainless Steel, Aluminum, Mylar, Kapton, and Surface Finishes to include Tin/Lead, Silver, Gold fingers, ENIG, OSP, Hard Gold, Soft Gold, and release materials.

3.2.3 Stencils compatible with DEK Vector Guard Reusable Frame System, Ekra 4000 Series Stencil Printer, and Essemtec Tucano In-Line Stencil Printer

4.0 Other Pertinent Information

4.1. The contractor is required to manage Government-furnished property in accordance with FAR Clause, 52.245-1, Government Property.

4.2. Required Documentation: To be returned with every order, as applicable:

4.2.1. PCB Fabrication

4.2.1.1. PCB Lot Certification of Conformance

4.2.1.2. Electrical Test Certification of Conformance

4.2.1.3. Final Test Inspection Report

4.2.1.4. Manufacturer’s Material Test Report

4.2.1.5. Physical Microsection

4.2.1.6. Microsection Test Report

4.2.1.7. PCB Test Coupons

4.2.1.8. Associated PCB Coupon Test Reports

4.2.2 Bare PCB

4.2.2.1 Solder masking and silkscreen markings, including serial numbers

4.2.2.2 Test 100% of all finished PCBs.

4.2.2.3 Provide physical cross-section (micro-section) coupons each Class 2 or Class 3 PCB.

4.3 Certification requirements: The Contractor shall provide all applicable certifications:

4.3.2 CLASS 2 and CLASS 3 Certification requirements:

4.3.2.1 United States/Canada Joint Certification Program (JCP). http://www.dlis.dla.mil/JCP/Default.aspx

4.3.2.2 International Traffic in Arms Regulations (ITAR) Certification. https://www.pmddtc.state.gov/registration/index.html

4.3.2.3 ISO9000 Certification. http://www.iso.org/iso/iso_9000

5.0 Ordering Instructions and Processes:

5.1. The Government intends to provide contract awardees a fair opportunity to compete for orders over $10,000.

5.2. Request for Quote (RFQ): PCO/Ordering Officer’s will issue RFQ’s by email, which will include:

5.2.1. Description of Item(s) and/or Service(s)

5.2.2. Quantity required

5.2.3. Delivery date and location

5.2.4. Evaluation Criteria and Methodology, i.e. Best Value, LPTA

5.2.5. Technical files including but not limited to:

5.2.5.1. Gerber Files

5.2.5.2. Files or drawing detailing requirements.

5.2.5.3. Special considerations and/or performance.

5.3. Quote/Offers: The offer shall be submitted to the Ordering Officer with pricing information including:

5.3.1. Price per board

5.3.2. Price for non-recurring work (NRE) such as engineering and tooling

5.3.3. Price for testing

5.3.4. Price for complete order, including estimated shipping

5.3.5. Proposed delivery date and/or alternate Lead Times

5.3.6. NOTE: No-Bid/Non-Interest: Offerors shall indicate NO-INTEREST on RFQs issued by the Government.

5.4. Evaluation/Award: The Government will issue an order to the offeror whose offer conforming to RFQ will be most advantageous to the Government. Evaluation criteria and methodology will be stated for each order.