Statement of Work.docx

STATEMENT OF WORK

FOR

PRINTED CIRCUIT BOARD (PCB) MANUFACTURING,

PCB ASSEMBLY/POPULATION,

AND SOLDER PASTE STENCILS

1.0 SCOPE

This Statement of Work (SOW) defines the Two-pronged effort to procure Printed Circuit Boards (PCB), and Finished PCB Assemblies for use at the Naval Air Warfare Center Weapons Division (NAWCWD). These prototype and production PCBs and Assemblies will be used for various development and test programs. Contract awardees will be allowed a fair opportunity to compete for orders valued at greater than $3,500 under this requirement. The contractor may use their in-house capability or subcontract effort to business suppliers in accordance with regulatory limitations identified elsewhere in the contract. Subcontractors must meet the same requirements stated herein for Contractors.

2.0 APPLICABLE DOCUMENTS

IPC-6012 Qualification and Specifications for Rigid Printed Boards

IPC-6013 Qualification and Specifications for Flexible Printed Boards

IPC-600 Acceptability of Printed Circuit Boards

IPC-610 Acceptability of Electronic Assemblies

IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies

3.0 REQUIREMENTS/SPECIFICATIONS

Using Government-provided Gerber files, drill files, drawings, applicable parts lists and assembly instructions, the contractor shall provide one or more of the following services: manufacture PCBs and/or Finished Electronic Assemblies for the NAWCWD. The contractor shall be capable of accepting listed documentation submitted via File Transfer Protocol (FTP), secure FTP, on a CD shipped directly to contractor, or via a DoD controlled password protected download site (such as AMRDEC SAFE). All Design data is subject to ITAR and shall only be distributed by one of the aforementioned methods. The contractor shall accept orders either orally or via electronic mail, and quotations shall be delivered to NAWCWD via electronic mail or telefax. Purchase orders may be in different forms and formats, but the contractor shall always accept government form DD1155 as a purchase order. Quotes requiring less than one week delivery shall be submitted no more than 1 business day after the request. Quotes requiring more than one week delivery shall be submitted within 3 business days. Quotes not returned within these timelines will be considered a NO BID.

3.1 PCB Fabrication.

The contractor shall maintain a capability to produce multi-layer as well as single- and double-sided PCBs in accordance with IPC-6012 Class 2 and Class 3/A and/or IPC-6013 Class 2 and Class 3, as appropriate.

3.1.1 The range of PCB physical size manufacturing capability shall be maximized; procurements of very small- and very large-sized PCBs should be anticipated.

3.1.2 Contractor processes shall be capable of employing mixed component technologies (both surface mount and through-hole).

3.1.3 The contractor shall have the capability to control and verify impedance on all PCBs. The contractor shall be able to supply boards with both conductive and non-conductive epoxy hole-fill on holes as small as 8 mils.

3.1.4 The contractor shall be able to supply boards with vias plated shut and vias with copper caps.

3.1.5 The contractor shall be able to supply boards with micro vias, sequential micro vias, and laser drilled vias. The contractor shall maintain a capability to produce PCBs suitable for population with Ball Grid Array (BGA) and Land Grid Array (LGA) integrated circuits in accordance with IPC-6012.

3.1.6 The contractor shall provide boards with finished pad and trace sizes no smaller than detailed in the design files.

3.1.7 The contractor shall maintain a capacity to produce boards with trace pitch down to 0.102 mm (0.004 inches) and with drilled hole positioning drift of less than 0.003 inch per 24-inch panel.

3.1.8 The contractor shall maintain a capability to produce PCBs with surface finishes of Tin/Lead, Silver, Gold fingers, ENIG, OSP, Hard Gold, and Soft Gold.

3.1.9 Markings will include, but not be limited to, permanent sequential serial numbers when required. Solder masking and silkscreen capability shall be available.

3.1.10 In addition, the contractor shall have the capability to accept an IPC-356A net list from the board designer and compare it to the net list taken off of the newly fabricated PCB and be able to test the finished PCBs using a bed of nails, flying probe, or other industry acceptable testing method.

3.1.11 NetList shall not be extracted from government provided Gerber data for the purposes of NetList testing.

3.1.12 The contractor shall be capable of fabrication of Flex and Rigid-Flex circuits.

3.1.13 The contractor shall provide physical cross-section (micro-section), Drill coupons and full documentation with delivery of each order of Class 3 (IPC-6012 or IPC-6013) PCBs.

3.1.14 Reworked boards may be accepted at the discretion of the government on a case by case basis provided that the rework/repair meets the requirements and guidance set forth in IPC-7711/7721.

3.1.15 The contractor shall silkscreen identification numbers to each fabricated printed circuit board. The specific identification number will be in accordance with the Government specification, provided at the order level.

3.1.16

3.2 Electronic Assembly

3.2.1 The contractor shall have the ability to produce single and doubled-sided finished assemblies using leaded solder and solder paste, Restriction of Hazardous Substances (ROHS) compliant Lead free, and have the ability to handle hybrid Leaded/ROHS assemblies.

3.2.2 All finished assemblies shall be produced in accordance with JSTD-001 Class 2, IPC-610, Class 2 and Class 3. The class determination will be specified at the order level.

3.2.3 All assemblies shall have parts placed by Pick and Place machine insertion. Any exceptions shall be identified within the Government provided specifications at the order level. All finished assemblies shall use the identification number form the silkscreen on the fabricated printed circuit board.

3.2.4 Any shortage of parts from the Government provided parts kit shall be reported to within 3 days of receipt of delivery

3.2.5 All assemblies shall be 100% inspected to IPC-A-610 by either an IPC certified quality assurance inspector or an AOI inspection machine prior to being shipped to the government.

3.2.6 The Government will only accept printed boards that meet the specification and meet IPC-A-610 inspection standard.

3.3 X-RAYS

3.3.1.1 The contractor shall perform a post-solder X-ray inspection of all Class 3 BGAs and LGAs. An electronic copy of all X-rays shall be provided to the Government with the completed assemblies. The electronic copies shall include the printed circuit board unique identification number. (CDRLA001)

3.4 BGA REBALLING

The contractor shall be able to Re-ball BGA assemblies down to a pin pitch of .4mm with Leaded Solder balls.

3.5 SOLDER PASTE STENCIL

The contractor shall provide assembly Solder Stencil(s) to the Government from the order upon request.

3.6 TURN KEY

If the Government RFQ is for a complete Turn-Key assembly then the vendor shall provide a quotation document containing costs and proposed sub-contractors for PCB fabrication, finished assembly, and electronic parts. The Vendor shall provide an alternate or modified BOM with the individual electronic parts, number, cost and vendor purchased from. (CDRL A002)

3.7 Delivery

The delivery schedule shall be specified at the order level.

3.8 Quality Program

3.8.1 The contractor shall have quality control processes in-place to maintain product quality. As applicable, the contractor shall maintain a quality program that complies with IPC-600, IPC-610, IPC-6012, and IPC-6013.

3.8.2 One hundred percent (100%) of all Class 3 boards shall be inspected by an IPC-A-600 Certified Quality Assurance Inspector.

3.8.3 The contractor shall be able to provide Class 3 products when required.

3.8.4 Certifications sent with every Class 3 order will include at a minimum the following five documents:

3.8.4.1 PCB Lot Certification of Conformance (CDRL A001)

3.8.4.2 Electrical Test Certification of Conformance against the government provided IPC-356A net list (CDRL A001)

3.8.4.3 Final Test Inspection Report (CDRL A003)

3.8.4.4 Manufacturer’s Material Test Report (CDRL A004)

3.8.4.5 Micro section test report (CDRL A005)

4.0 MISCELLANEOUS

4.1. Certification requirements differ for Class 2 and Class 3 boards (as defined in IPC-6012 and 6013):

The contractor shall comply with all applicable certifications in accordance with regulatory and statutory requirements, including the following:

4.1.1. Class 2 certification requirements:

4.1.2. United States/Canada Joint Certification Program (JCP) REQUIRED. http://www.dlis.dla.mil/JCP/Default.aspx

4.1.3. International Traffic in Arms Regulations (ITAR) Certification REQUIRED. https://www.pmddtc.state.gov/registration/index.html

4.1.4. ISO9000 compliance REQUIRED. http://www.iso.org/iso/iso_9000

4.1.5. Class 3 certification requirements:

4.1.6. United States/Canada Joint Certification Program (JCP) REQUIRED. http://www.dlis.dla.mil/JCP/Default.aspx

4.1.7. International Traffic in Arms Regulations (ITAR) Certification REQUIRED. https://www.pmddtc.state.gov/registration/index.html

4.1.8. AS9100 Certification REQUIRED. http://asq.org/as9100/