Specs.pdf

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Packaging of DRPA and HTP silicon carbide pressure sensors
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80NSSC20732581Q
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Specification for the packaging of DARPA silicon carbide pressure sensors for pressure sensing evaluation at 900 ℃ in atmospheric environment

Twenty SiC pressure sensors shall be packaged based on the specification below.

The components to be used for packaging the silicon carbide pressure sensors shall withstand pressure of up to 500 psi and temperature up to 900 o C for a minimum of one hour.

The preferred packaging architecture shall be based on the MEMS Direct Chip Attach concept similar to the one referenced in Fig. 20 of US patent 7,518,234.

The package shall be a 7-through-hole via with central reference cavity fabricated in the preferred aluminum nitride (AlN) header that is closest CTE matched to the SiC sensor material.

The diameter of the AlN header shall be 0.278” and the shoulder diameter to be

0.2465”.

The AlN header that houses the SiC sensor shall be brazed to Kovar tube with OD=0.28” and ID=0.251” or any complementary low CTE material with low oxidization rate that would survive a minimum of 1 hour in air at 900 ℃.

The brazing material to braze the AlN header to the Kovar tube shall be non-oxidizing or have low oxidation rate to survive a minimum of 1 hour in air at 900 ℃.

The brazing material to braze the AlN header to the Kovar tube shall be leak free during use for a minimum of 1 hour in air at 900 ℃. Leak rate lower than 6x10 -7 would be acceptable.

The leakage current between pins (Au) and the AlN header carrier substrate shall be no more than 0.5 mA at 900 o C.

The length of the Kovar tube shall be 4 inches.

The Au pins shall be protected by stainless steel sleeves that extend out of the Kovar tube and the stainless steel dam that is attached to it, and be rigidly secured at the backend of the Kovar tube with non-electrically conducting high temperature rated ceramic paste.

An insulating AlN plate will be inserted into the stainless steel dam and secured with a retainer ring to protect the back end of package.

Each packaged sensor shall be tested at room temperature prior to shipment.

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