Specifications of Automated Wire-bonder.pdf
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- Attached to
- Automated Wire Bonder Federal contract opportunity
- Solicitation number
- 80GRC022AWB2
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This document contains a sources sought notice and specifications for an automated wire bonder. The National Aeronautics and Space Administration Glenn Research Center is seeking information on potential sources that can provide a fully automated wire bonder to package high temperature silicon carbide integrated circuits for aerospace applications. The wire bonder must be capable of switchable ball-wedge and wedge-wedge wire bonding with gold or aluminum wire between 0.75 to 3 mil in diameter and have automated programming for positioning, parameters, and bonding geometry. It should have a heated stage up to 180°C, microscope, data storage, and the ability to conduct wire bond testing and failure analysis. Interested parties must respond with capability statements by October 15, 2021 describing their experience, past performance on similar contracts, and qualifications to meet the technical requirements. The North American Industry Classification System code for this procurement is 333242 with a small business size standard of 1,500 employees.
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Text version
Specifications of Automated Wire-bonder for Packaging High Temperature SiC Integrated Circuits
NASA Glenn Research Center (GRC) is interested in a fully automated wire-bonder for packaging SiC high temperature integrated circuits (ICs) for aerospace applications. This automated wire-bonder should meet following basic functions and demonstrated specifications:
1. Switchable ball-wedge and wedge-wedge wire bonding.
a. Au ball-wedge bonds using Au wires from 0.75 to 2 mil diameter, 3 mil preferred.
b. Au wedge-wedge bond using Au wire from 0.75 to 2 mil diameter, 3 mil preferred.
c. Al wedge-wedge bond using Al wire from 0.75 to 2 mil diameter, 3 mil preferred.
d. Au ball stud for flip-chip using 0.75 to 2 mil wires.
e. For both ball-wedge bond and wedge-wedge bond, the maximum distance between the first bond and second bond is 0.515 inches or above.
2. Automated wire-bonding with parameter setup through programming or parameter inputs.
a. Establishing on-board/carrier X-Y coordinates using a reference/index on the carrier/PCB.
b. Establishing on-die X’-Y’ coordinates using a reference/index on the die.
c. The capability using two different reference systems on carrier/PCB and die to allow reasonable tolerances of die in-plane position and die azimuthal angles.
d. Geometry parameter input through program or direct data input.
i. On-screen mouse clicking to select bonding spots.
ii. Repeating geometry parameters to multiple but same die/carrier assemblies through pattern recognition.
e. Bonding parameter input through program or direct data input.
i. Repeating bonding parameters to multiple but same die/carrier assemblies through pattern recognition.
f. Z adjustment between the first and second bonds: selecting the bonding spots and measuring the Z difference using mouse and clicking, adjust Z through automatic programing (or direct manual data input).
g. Bonding speed: 2 wires/second.
h. Manual interruption.
i. Parameter change/modification after interruption.
ii. Resume bonding function after parameter changes.
i. Bonding failure detection.
3. Full manual and semiautomatic wire-bonding operation.
a. Manual control to select bonding positions using mouse.
b. Manual control of bonding parameters.
c. Manual operation of bonding using mouse.
d. One wire semi-automated bonding using programed bonding parameters with mouse/keyboard for control.
4. Stage and holder: Effective bonding area 8 in. x 8 in. with heating, and 12 in. x 12 in.
without heating.
a. Heating sample stage/holder with effective work area 8 in. x 8 in. and maximum temperature of 180°C at least, 210°C is preferred.
b. Both vacuum and mechanical carrier/PCB holding mechanisms for multiple carriers/PCBs.
c. Temperature ramp rate control is a plus.
d. Mounting two heating holders in parallel to double the effective bonding/heating area
(optional).
5. Two-inch wire spool and wire feeding system for 0.5 – 2 mil Au and Al wires, up to 3 mil is preferred.
6. Stereoscopic optical microscope system and on-screen color imaging/video system for positioning carrier/PCB (and die), bonding process control and monitoring, and programming/data input.
a. Optical or on-screen assistance for wire-threading for both ball-wedge and wedge-wedge bonding heads.
b. On-screen video system for selection of bonding spots as part of programing or data input.
c. On-screen programming and data input.
d. On-screen 2D (3D) geometric measuring capability, and on-screen display.
e. Color picture or video recording system.
f. On bonding surface light indicator for bonding location, and associated on-screen moving indicator following bonding location for monitoring.
g. Right handed mouse.
7. Wire-bond testing and diagnosis capability (optional)
a. Automated abnormal bonding or failure recognition and recording.
b. Stress-strain pull test using on-screen mouse guided maneuver.
c. Shear stress-strain test using on-screen mouse guided maneuver.
d. Stress-strain shear test using on-screen mouse guided maneuver.
e. Displaying stress-strain test curve and the breakpoint.
f. Data output for stress-strain curve, USB drive is preferred.
8. Data system
a. USB drive is preferred.
b. Save programs or parameter files on external storage.
c. Save automatic recorded abnormal/failure bonding data.
d. Stress-strain test data (optional).
e. Save images and videos in external storage, in a convenient format for retrieve and presentation using external Microsoft Office.
f. Wifi data transfer for remote operation monitoring is a plus, but not required.
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