Specifications for Code 6812 Hemispherical Electron Analyzer for ARPES.pdf

Specifications for Code 6812 Hemispherical Electron Analyzer for Angle-resolved Photoelectron Spectroscopy (ARPES) system (analyzer, sample manipulator, and ultrahigh vacuum chamber)

1. Hemispherical electron analyzer

a. Minimum 135mm mean radius

b. Minimum working distance 30 mm

c. Energy range: 0.5 eV – 1 500 eV

d. High throughput

e. Transmission and Angular lens modes of operation

i. Transmission mode lens acceptance: ±15°

ii. Angle modes up to ±10°

iii. Angular resolution: < 0.1° from 0.1 mm spot

iv. Energy channels: > 850

v. Angular Channels: > 650

f. Electrostatic deflection capability

i. Energy resolution (trans. and ang. mode): 3 meV FWHM at 2 eV pass energy

ii. Pass energies ranging from 2 eV to 100 eV

g. Mu-metal housing

i. Bakeable to 150 °C

ii. Magnetic fields < 0.5 uT

h. Minimum 40mm multichannel plate detector

i. Digital camera detector

ii. 1 Gbit/s readout rate

iii. > 7bit resolution

iv. < 0.01 cps noise per channel

v. > 120 frames per second (TV frame rate)

vi. Pulse and ADC acquisition modes

i. Electronics

i. 110/120 VAC 60Hz

ii. Stable/low noise

iii. Mountable in 19” cabinet

iv. 25m cabling lengths

j. Computer and Software

i. The hemispherical analyzer must be computer operated using a PC from a non-Chinese manufacturer (no Lenovo, Huawei, or Apple)

ii. Software must be provided to perform XPS, UPS, AES experiments in standard transmission mode and in angle-resolved mode

iii. The operating system must be Windows-based

iv. Data should be stored in CasaXPS format for manipulation and analysis

v. Data should be exportable in an acceptable form for publication (Excel, ASCII, JPEG, PDF)

2. Sample Manipulator

a. 5-axis (x,y,z,θ,Φ) of motion

b. Motorized control

c. Sample stage for 90mm diameter sample holder (of a 75mm wafer)

i. Electrical isolation for grounding or biasing of sample

ii. BNC feedthrough for electrical connection

d. x,y travel >25mm

e. z travel >200mm

f. θ travel up to 60° depending on chamber geometry

g. Φ travel +/- 180 ° allowing for analysis of every point on a 75mm wafer

h. Bakeable to 150 °C

3. Ultrahigh vacuum chamber

a. Manufactured from mu-metal or stainless steel with mu-metal shielding for all internal surfaces to reject magnetic fields ≤ 0.5uT using only UHV compatible manufacturing techniques.

b. Bakeable to ≥ 150 °C

c. Leak rate ≤ 5x10-10 mTorr

d. Ports for:

i. Connection to Code 6812 preparation chamber (8” CF)

ii. Connection to Code 6812 vacuum pumps (8” CF)

iii. Hemispherical analyzer

iv. Monochromatic x-ray source (4.5” CF)

v. Dual anode x-ray source (2.75” CF)

vi. Ultraviolet photon source (2.75” CF)

vii. Small spot electron gun (4.5” CF)

viii. Secondary electron detector (2.75” CF)

ix. Sputter ion source (2.75” CF)

x. Electron flood gun (2.75” CF)

xi. Motorized sample manipulator

xii. Sample transfer manipulator (2.75” CF)

xiii. Vacuum suitcase (6” CF)

xiv. Camera viewport (2.75” CF)

xv. Transfer viewport (≥ 4.5” CF)

xvi. Lighting viewport (2.75” CF)

xvii. Extra ports for pumping and other needs

e. Integration with existing vacuum equipment, surface analysis techniques, and sample transfer mechanisms (vacuum cart and vacuum suitcase).

4. Software Operation

a. NRL firewalls prevent “remote access” to computers and instruments, so the equipment should/must be capable of “standing alone”.