Specifications-FINAL.pdf

Requirements / Specification Document

TITLE: Wafer Dimensioning Tool

Requesting Laboratory / Division / Group:

Communications Technology Laboratory Radio Frequency Technology Division Radio Frequency Electronics Group (672.01)

General Statement of Need:

NIST is developing a millimeter-wave standard reference material. To deliver this new standard, NIST must measure the thickness of thin (< 200 um) and optically transparent substrates as inputs to determine the electronic properties of these substrates without assuming the electronic properties.

NIST needs a wafer dimensioning tool that can measure the thickness of various coupon.

The dimensions of the coupons include a 6” round coupon, a 3” round coupon, a 90 mm x 90 mm square coupon, and a 35 mm x 45 mm rectangular coupon. The approximate thickness of the coupons ranges from 50 um to 500 um. The wafer dimensioning tool shall include a stage, two sensors, fixturing for the coupons, a microscope with a stage, a computer with a monitor, power distribution units, and automated analysis software. The wafer dimensioning tool must measure the coupons from the top and bottom and compute the thickness without using the dielectric or electronic properties as inputs. The wafer dimensioning tool must produce a point cloud of the thickness of the coupon with a minimum spot size of 100 um and be able to measure the dimensions of a 6” round coupon in less than 1 hour without manual intervention by a technician. Once calibrated with a standard reference shim of the comparable dimension to the 150 um thickness benchmark, the wafer dimensioning tool must maintain calibration for a minimum of 8 hours with the intervention of a technician. Vendors responding to this request must demonstrate the accuracy (100 nm), precision (100 nm) and repeatability (100 nm) of the wafer dimensioning tool over 8 hours of continuous use. The wafer dimensioning tool must produce the total thickness variation (TTV), warp, and bow as outputs in an automated report.

Items and Ancillary Services:

Item 1: Wafer Dimensioning Tool Quantity: 1 Specifications: 1.1 Storing sensor output and location relative to wafer as a point cloud with minimum grid spacing of 100 um

1.2 Measurement scan time < 1 hour per 6” round coupon

1.3 Measurement made from both sides of substrate

1.4 Measurement stage vibration isolation (< 50 nm vertical noise)

1.5 Measurement stage x-y repeatability of 100 nm

1.6 Measure 6” diameter wafer at approximately 100 um and 500 um

1.7 Fixturing for 6” round coupon, a 3” round coupon, a 90 mm x 90 mm square coupon, and a 35 mm x 45 mm rectangular coupon

1.8 Measurement thickness range between 50 um – 500 um

1.9 Measurement repeatability < 5 um

1.10 Measurement accuracy < 100 nm

1.11 Measurement precision< 100 nm

1.12 Non-destructive measurement

1.13 Measurement compatible with transparent substrates including fused silica and sapphire; and non-transparent substrates including silicon, GaN, and InP

1.14 Measurement does not assume refractive index of substrate

1.15 Footprint not to exceed 2 square meters

1.16 Uses conventional wall power (15 A or 20 A).

1.17 Vibration control specification no lower than VC-D

1.18 All software for measuring TTV, bow and warp

1.19 Microscope with objectives with greater

1.20 Microscope objective larger than 2 mm working distance

1.21 Microscope objective smaller than 10 nm vertical resolution

1.22 All data acquisition computers, hardware, and software

Item 2: Option to Buy: Step height package for electrode characterization and mapping Wafer Dimensioning Tool Quantity: 1 Specifications: 2.1 Measure strip widths between 1 um and 10 mm

2.2 Measure gaps widths between 1 um and 1 mm

2.3 Measure ascending and descending step heights from 1 nm to 1 um

2.4 Automatic acquisition and calculation

Item 3: Option to Buy: Surface roughness package for substrate and electrode characterization mapping Quantity: 1 Specifications: 3.1 Measure surface roughness between 1 nm and 1 um surface roughness

3.2 Compatible with metals including gold, palladium, platinum and titanium

3.3 Compatible transparent substrates including fused silica and sapphire

3.4 Compatible non-transparent substrates including silicon, GaN, and

InP

Service Requirements / Item Specifications:

[Provide input for each section]

Section Requirements/Specifications Planning Considerations ☒ N/A

☐ List any visits required to allow potential vendors to see site specific constraints.

[Explain Requirements.] ☐ US citizen required on-site (foreign nationals require pre-registration 30 days prior to visit.)

☐ Vendor Representative On-Site more than three (3) days.

☐ Other Considerations:

[List other considerations to ensure an accurate quote.] Shipping & Delivery ☐ N/A

Shipping Address:

☒ NIST-Boulder

ATTN: Shipping and Receiving 325 Broadway Mail Stop 672.01 Boulder, CO 80305

☐ [Alternate Shipping Address] Shipping Criteria:

☐ Partial Delivery Acceptable

☐ [Enter Shipping and Delivery information by item.] ☒ Direct Delivery to Building Required Installation of system in Building 81 required

☐ Building has Loading Dock Containerization Preference: [Enter Container Type] Other Requirements:

[List Any Other Requirement]

Delivery Date Criteria:

☒ Delivery of Goods, Installation, and Training shall be competed no later than: 120 days ARO ☐ Delivery No Earlier Than: Click or tap to enter a date.

☐ Other: [List other shipping, delivery or special requirements.] [List Other Shipping, Delivery or Special Requirements.]

Electronic Media ☐ N/A

[Enter Electronic Media Requirements by Item.]

☒ Software ☒ Electronic Manuals ☒ License Key ☐ Other:

[List Any Other Electronic Media Requirements] ☐ Email address for Software Delivery:

[Enter Address] Installation ☐ N/A

[Enter Installation Requirements by Item]

☒ Vendor Technician on Site ☒ Rigging ☒ Uncrating / Unpackaging ☒ Removal of Packaging Material ☒ Equipment Set Up ☒ Start-Up Services ☒ Turnkey Installation ☐ Other:

[Enter Details]

NOTE:

When installation is required, TPOC shall be the coordination point.

Facility / Utility Considerations ☐ N/A

[List Site Specific Utility Considerations by Item] ☐ OFPM Work Order Numbers

[List Work Order Numbers] ☒ Power Available Voltage: 120 (V) Maximum Current: 20 (A) Phase: [Choose Phase] Frequency: [Typically 60Hz] (Hz) NEMA Plug Type: [Enter Plug Type] (i.e.: NEMA L5-20P) Environment: [Choose Environment] Other Power Considerations:

[List Any Other Power Considerations.] ☒ Utility Connections:

Air drop ☐ Other Considerations:

[List Other Considerations to Ensure an Accurate Quote.]

Warranty

Extended Warranty Required

[If you require an Extended Manufacturer Warranty, describe the warranty requirements per item.]

What is included?

☒ Labor ☒ Parts ☒ Travel ☒ Cost and Liability for Returns ☐ Other [Enter Other Requirements] ☒ Warranty Length: 3-Years Training ☐ N/A

No more than four weeks after installation

☒ On-Site

Is Travel Required: NO

☐ Off-Site Location: [Enter Location(s)] ☒ Number of Trainees: 3 Scope of Training ☒ Operations ☒ Maintenance ☒ Troubleshooting ☒ Safety ☒ Other Alignment

Calibration of stage and interferometers ☒ Training materials to be provided:

6” round wafer at 150 um thick ☐ Other [Enter Other Training Requirements] NOTE: When training is required, TPOC shall be coordinator.

Inspection and Acceptance

☒ On-Site

[Inspection Requirements Per Item] ☐ Government Acceptance Expected to Not to Exceed 7 Business Days ☒ Government Acceptance Expected to Exceed 7 Business Days 30 Days ☐ Inspection and Acceptance Plan:

[Explanation] ☐ Other:

[Enter Other Requirements] Maintenance ☒ N/A

[Describe Maintenance Requirements Per Item] Service Plan Length:

What is Included?

☐ Labor ☐ Spare Parts ☐ Consumables ☐ Travel

☐ Cost and Liability for Returns ☐ Software Updates ☐ Manuals l

☐ Other [Enter Other Requirements] ☐ Requirements:

[Enter Requirements] (i.e.: On-Site Within 72 hours, etc.)

☐ 1 Option Period ☐ 2 Option Periods ☐ 3 Option Periods ☐ 4 Option Periods (Maximum) Government Furnished Material / Equipment ☐ N/A

[List Any Government Furnished Material / Equipment Per Item] ☒ Samples for Testing

☐ Government Equipment which will leave Government Site (TPOC must coordinate with Division Property Custodian)

Description: [Enter Description] Serial Number: [Enter Serial Number]

NIST Property Number: [Enter NIST Property Number] ☐ Other:

[Enter Other Details] Travel ☒ N/A

[Describe any Travel Requirements Per Item] ☐ Explain:

[Enter Justification / Requirement] ☐ Other:

[Enter Other Requirements] NOTE TO VENDOR: To the maximum extent possible, include travel requirement estimates as part of pertinent sections above (Installation, Maintenance, Repair, etc.). Otherwise, Travel will be a separate line item, reimbursable per the Federal Travel Regulation.