SOW Semiconductor - DRAFT.pdf

DRAFT

Attachment A June 2022

STATEMENT OF WORK

TO

PURCHASE SEMICONDUCTOR CHEMICALS

FOR

THE DETECTOR DEVELOPMENT

LABORATORY

ACRONYMS

NASA – National Aeronautics Space Administration

GSFC – Goddard Space Flight Center

DOT – Department of Transportation

DDL – Detector Development Laboratory

FAR – Federal Acquisition Requirements

SDS – Safety Data Sheet

HAZMAT – Hazardous Materials

CMOS – Complementary Metal-Oxide-Semiconductor

IDIQ – Indefinity Delivery Indefinity Quantity

1.0 - Background

1.1 - NASA-GSFC intends to purchase semiconductor or higher grades chemicals during the period of this contract. This procurement is critical for the continuous daily operation of the Government’s laboratories located in Building 11 and Building 30-DDL.

These laboratories are cleanrooms class 100 and class 10 respectively. The mission of these labs is to research, develop and fabricate semiconductors devices, Microelectromechanical Systems structures, and to support other NASA related projects.

Most chemicals needed will be, but not limited to, Solvents (i.e. Acetone, Isopropyl, Methanol, Ethanol, Toluene, 1165 RR, RR4, RD2, HMDS, etc.), various acids (i.e. HF, HCL, CH3COOH, HNO3, BOE 7;1, E6, H2SO4, etc.), various bases (i.e. NaHCO3, NaOH, H2O2, NH4OH, NH4F, MF312, MF319, AZ400K, TMAH, HMDS, etc.) several types of photoresists (i.e. SC1811, SC1827, AZ4330, AZ4620, AZ 10XT, mr-I T140 series, etc.), and thinners, developers, epoxies, metal plating solutions are also required.

See Attachment A-1 for a complete list of chemicals that have been ordered in the past and potentially be ordered under this contract. Additionally, new chemicals, not listed may be required to be purchased as projects develop new processes throughout the life of the contract.

2.0 - Objectives and scope

2.1 - Contractors shall be able to supply Semiconductor Equipment and Materials International grade 1 chemicals, but at the Government’s discretion supply higher grades as necessary; the chemicals shall be cleanroom bagged bottles suitable for use in critical clean room areas, except when directed by the Government not to be bagged.

2.2 - The chemicals will be ordered in small quantities at the time and as needed, usually one order per week because of storage restrictions onsite.

2.3 - Most chemicals are generally ordered in gallon size bottles, and occasionally in larger five-gallon sizes pails, but in some instances quart size or smaller bottles will be required. For some chemicals, the Government cannot handle large sizes, the contractor shall notify the Government of size changes and gain pre-approval before shipping. If the contractor chooses to re-package a chemical into a smaller container, the contractor shall provide certification of product meeting the specified grade such as a certificate of compliance with the original manufacturer, or Certificate of Analysis after re-packing.

2.4 - The laboratories perform several research activities; from time-to-time new chemicals will be required, and the contractor shall be able to acquire and deliver such products in a timely manner. The Government shall not be penalized in cost, due to contractor un-familiar with a given chemical.

2.5 - While this contract is in force, the Government will issue individual delivery orders for materials needed for its operations, based on the usage of the DDL facility.

These orders will be used to purchase a quantity of products to be delivered and before defined by the Government, and the contractor shall keep a reasonable inventory for immediate shipment of products with the expiration date of no more than three months after at the shipping date. Products with lower usage shall have longer expiration dates.

3.0 - Tasks and requirements

3.1 - The delivery time must be less than one week for each delivery order. The contractor shall keep an inventory in their facility of the most commonly used chemicals for immediate shipment when a delivery order is placed. For products with a shorth shelf life, or impractical contractor storage; those shall be ordered directly from the manufacturer, drop shipped to NASA- Goddard and the shipping time should not exceed three weeks. If there is a known shortage of a specific chemical, the contractor shall notify the Government immediately and work to find alternate suppliers. The contractor shall supply Safety Data Sheet for each chemical ordered and the SDS shall accompany each shipment.

3.2 - The contractor shall provide chemicals suitable for the semiconductor industry produced by the following manufacturers and others:

Avantor Performance Materials, formally known as JT Baker, AZ Electronics Materials, Microchem Corporation, Futurex Inc, KMG Corporation, Microresist, EMD Performance Materials, Allresist, Technic Inc, Alfa Aesar, Fisher Scientific, Brewer Science, Dupont, Dow Chemicals, Transene, Microposit, Appli-tec, Zeon Specialty Materials, Cyantek Corporation, and others. In the event that a specific brand is not available and a change of manufacturer or chemical substitute is needed, the Government or its representatives shall approve the change before the order is placed.

3.3 - The contractor shall be responsible for all licenses for the purchase and sale of chemicals, when importation from overseas of certain products is necessary, the contractor will place the order with the manufacturer, release the products from US Customs and arrange for the transport of such chemicals to NASA-GSFC. The transport of most products must follow Department of Transportation regulations for hazardous materials shipment.

4.0 - Deliverables and Delivery Schedule

4.1 - The chemicals must be delivered in the original manufacturer packaging including all pertinent documents, such as, lot numbers, expiration dates, certifications of quality and Safety Data Sheet. All invoices shall include the number that originated that purchase, and shall include the material unit cost, DOT fees, freight, and the total cost.

5.0 - Security

5.1 - The chemicals shipments shall be delivered to GSFC at 8800 Greenbelt Rd, Greenbelt MD 20771, at the shipping and receiving department located at NASA-GSFC with access from Soil Conservation Rd – Building # 35. The final location for most chemicals will be Building 30 – chemical storage room.

6.0 - Period of performance

6.1 - The period of performance for this contract shall be for one-year base contract and provide four one-year options.

ATTACHMENT “A-1”

3-(Trimethoxysilyl)propyl methacrylate 950 PMMA Series Resists in Anisole Acetic Acid Glacial Acetone Aeroglaze Z306 Flat Black Alconox Alumilite Part A&B Aluminum Ammonium Sulfate Dodecahydrate Ammonium Fluroride Ammonium Hydroxide Ammonium Iodide Ammonium Nitrate Ammonium Pentaborate Octahydrate Amonium Hydroxide (Grade A Aqua Ammonia) ANTImoNY Potassium Tartrate, Trihydrate 08

AP100

AP-300

APX-K1

Aqua Mer Dry Film Photoresist Aquapel® 364 Alkyl Ketene Dimer (Fatty Acid Ketene Dimer) AZ 1350J-SF Photoresist AZ 400k Developer AZ 5209-E Photoresist AZ 5214-E Photoresist AZ 9245 Photoresist (220 CPS) AZ P4903 Photoresist AZ® 1500 Thinner AZ® 300T Photoresist Stripper AZ® 4999 Photoresist AZ® 5206-E Photoresist AZ® Kwik Strip Remover AZ® P4330-RS Photoresist AZ® P4620 Photoresist AZ® R200 Coating Baker PRS-3000™ Postive Resist Stripper Baker PRT Positive Resist Thinner Barium Acetate Barium Carbonate Barium Fluoride Patinal, 001725

Barium Hydride, 35107 Benzai Konium Chloride Solution (0.4%) Benzotriazole, 99% B1140-0 Bismuth Bismuth Nitrate Bismuth Nitrate, Pentahydrate, B-337 Bismuth Standard Bismuth Trichloride, B-330 Blasocut 2000 CF Chlorine Free, Art No 875 Blast-O-Lite Blue Shower II Boron Nitride Aerosol, SP-107 Borosilicafilm 1X10 ** 20 Bromine Bromine Trifluroide Buffer Powder Pillows Buffer Solution pH 4.0 (Color-Coded Red Buffered Oxide Etch Burn Neutralizer Cadmium Acetate, C-4 Cadmium Chloride Cadmium Sulfate Hydrate, 99% Calcium Carbonate, Heavy Precipitation Calcium Carbonate, Light Precipitation Catalyst 11 Catalyst 24LV Catalyst 9 Catechol Ceric Ammonium Nitrate, C248500 Chloramine T Trihydrate Chrome Etchant Chromic Acid (Chromium Trioxide) Chromium Compound-CR-1 Chromium Metal Chromium Standard Chromium Sulfate Chromium(VI) Trioxide Citric Acid Cold Pak (Rapid Aid)

Combat Boron Nitride Coating Type S Conductive Adhesive Con RTV 1, 72-00002 Contact Adhesive Copper Electroplating Solution Copper Etchant 100/200 CR-100 Chromium Ethchant

CR-9

Crystal Bond 509 Crystal Bond 555 Cupric Sulphate Cupric Sulphate Anhydrous CX1615, Chromic Anhydride Chromium (VI) OXI Cyclotene* 4022-35 Developer DS3000 Diamaflow 688-D, 688-S, 688-G Diborane Dichlorodifluromethane Dichloromethane Dielectric Solvent, CLN220

Diethylamine, 99+%

D-Lead® Hand & Body Soap DL-Tartaric Acid

DOT-SP 8249

Dow Corning® 4 Catalyst DP-Suspension

DS2100

Dynalene HC® E-6 Metal Etch W/AES CPG E903-64 EA 9309.2NA Part A Quart EA 9309.2NA Part B Quart

EA-120

E-Beam Resist AR-P 6200

EBR PG

EC-2216 B/A Part A Gray Epoxy Adhesive Eccoslip 122S Ecoclear- Non Solvent Cleaning Fluid Edge Bead Remover(EBR PG) EDTA Solution

EG-2967

EKC265™

EKC630™

Electroless Nickel Plating Ammonia Type (ENPAT) Entwickler AR 600-546

EPO TEK E415G

EPON Resin (Fenwal P/N 80055-31) EPON® Resin 828

EPO-TEK 210-803

EPO-TEK H20E

EPO-Tek H70E Part A&B

EPO-TEK H74

EPO-TEK H74F

Epoxy Adhesive Epoxy Adhesive Coreactant Epoxy Permanent Resist Verion 129, Samples A-Z Epoxy Stripping Agent Ethyl Acetate Ethylene Diamine Tetra Acetic Acid, EDTA;6810 F Catalyst F201 Trans 1,3-Dichloropropene FC-77 Fluorinert Brand Electronic Liquid Ferric Chloride Ferric Chloride, F2877 Fluoroglide FB Fomblin Y-LVAC 06/6* Fomblin Y-LVAC 14/6 Fomblin Y-LVAC 25/6* Fomblin® YL-VAC 14/6 RP Frozen Epoxy Frozen Urethane GenARC® 365 Series Glycerine Glycerol GO-JO Lotion Hand Cleaner Gold Chloride Solution 0.5% (Silicon Surface Sensitizer) Gold- Core Material Gold Etchant Type GE-8148 Goodwrappers Handwrappers

Halotron 1 PRE-SAT BASE Halstead Contact Adhesive * Hexadecanethiol Hexafluoroethane Hexamethydisilazane/PGMEA Hexamethyldisilazane Hexanes

HNR 120

HT100-4 G7642 Gold Chloride Solution Hydrazine Hydrate 35% Hydrobromic Acid Hydrochloric Acid, 33-40% Hydrofluoric Acid, 49% Hydrogen Bromide Hydrogen Chloride Hydrogen Dioxide, HX0530 Hydrofluoric Acid Hydrogen Peroxide 30% Solution, 144 Hydrogen Tetrachloriaurate Trihydrate A Imidazole, 99% Indium Suldamate Plating Bath Inland GS-77 Insulstrip Jell Iodine Iodine Solutions Iodine, 0.1N Standardized Solution Isopropyl Alchohol, (IPA, 2-Propanol) K' Developer Klean-Strip Spray Gun Cleaner, M-33 KTI KPR Resist Quart Lanthanum Boride Lanthanum Chloride Heptahydrate, L950 Lanthanum Nitrate, 12915 Leybanol LVO 130 Linkerixx LOR A Series Resists Magnesium Sulfate Monohydrate, 63141 MagnesiumFluoride, MgF^2 Manganese Dioxide Lithium Primary Battery

Manver Hardness Indicator 425 Megaposit MF-24A Developer

MEK

Methanol Methyl Ethyl Ketone Methyl Isobutyl Ketone MiBK/IPA

MICROFAB® SC LO 70/30

MICROFAB® SC MAKEUP

MICROFAB® SC MD

Microposit 1375 Photo Resist Microposit Developer CD-30 Microposit Remover 1165 Microposit SC 1811 Photo Resist Microposit STR 1045 Photo Resist Microposit 451 Developer Concentrate Microposit 453 Developer Microposit MF-312 Developer Microposit SJR5740 Photo Resist Microposit MF-319 Developer MTO-Dowex M4195, 500GM MX32, Diamond or Cubic Boron Nitride Grind Nalco 2826 Corrosion Inhibitor Nalco 39M Corrosion Inhibitor NANO PMGI 101 Developer

NANO PMGI SF 19

NANO SU-8 2 Negative Resist NANO SU-8 5 Negative UV Resist NANO SU-8 Developer NANO XP SU-8 Series Resists

NANO™ EBR PG

NANO™ EL Thinner NANO™ LOR A Series Resists NANO™ PMGI SF Series Resists

NANO™ PMGI XP DFN 10

NANO™ RemoverPG NANO™ SU-8 Thinner N-Butyl Acetate, 99+% Negative Radiation Resist Thinner

Negative Resist NR1-3000PY Negative Resist NR7-1000PY Negative Resist NR7-1500P Negative Resist NR9-8000 Neutrabase n-Hexane Nickel Plating Solution 350-130 Nitric Acid (70%) Nitrocellulose Lacquer n-Methyl-2-pyrrolidone NOVUS Plastic Polish #2 N-Propyl Alchohol Oakite Deoxidizer LNC Para-Xylylene Dimer Permanganate Reagent R-0733 Phoaphoeosilicafilm 5X10 ** 20 Phobix Phosphoirc Acid Phosphorosilicafilm 1X10 ** 21 Photo Etch Photoresist Deveoper, ER-8

PI-2610

PI-2808

Poly(ethylene glycol), average M.W. 1000 Polyimide Coating Polymide Sealing Resin Polypropylene Positive Photoresist (SC 1827 (CS2GA) ) Positive Photoresist 895K 16.5CS Positive Photoresist Developer 945-Immersi Positive Photoresist Developer DE-3 100% Positive Photoresist Stripper R-10 Potassium Chromate Solution Potassium Cyanide Potassium Dichromate Potassium Hydroxide Potassium Iodide Potassium Nitrate, 3190 Potassium Permanganate Potassium Permanganate Reagent

Potassium Sulfate Potassium Tartrate, P313500 Probimide 286

PSK 2000

Pyrocatechol Quartz Wax

QZ 3322

QZ 3501 Polyimide Developer Reagent Alchohol Resist Developer RD6 Resist Remover RR2 Resist Remover RR4 Resist Remover RR41 Resist Strip J-100 Resorcinol Diglycidyl Ether Riston® Multimaster MM100 Series Photopolymer Film (Vapor) Rosin Soldering Flux (1544) RTV Silicone Rubber RTV Silicone Rubber SWS-845 Rust-Oleum Professional High Performance Enamel Aerosol SafeStrip

SCE-200

Microposit SC 1827 Positive Photo Resist Silica Microspheres 3.0 Microns Silica Microspheres 5.0 Microns Silicon Carbide Silicon Dioxide, Amorphous Silicon Primer Mixture Silicone Rubber Sealant Silver Electroplating Solution Standard Preparation Slytherm XLT# Heat Transfer Fluid Snoop Sodium Azide Sodium Bicarbonate Sodium Carbonate Sodium Carbonate Anhydrous Sodium Carbonate Anhydrous, Soda Ash Sodium Hydroxide Sodium Hydroxide Solution 50%

Sodium Hypochlorite Solution Sodium Hypochlorite, 5% Sodium Periodate Powder Pillows, 21077 Sodium Salicylate, S395500 Sodium Sulfite Sodium Sulfite, Anhydrous Solder Alloys Containing Lead Soldering Flux Spill-X-A Agent Spill-X-C Agent Spin-On Glass (11F, 21F, 31F) Starch Indicator Solution 1%, Acculute Standard Volumetric, Final Volume 1L Stay Clean® Liquid Soldering Flux Strip-X Strontium Carbonate Stycast 2850KT Black STYCAST® 1266, Part A&B SU-8 2000 Series Resists SU-8 5 Negative Radiation Sensitive Resist SU-8 Developer SU-8 Series Resists Sulfamic Acid Sulfuric Acid Sulfuric Acid 96% Sulfuric Acid, 52-100%

SVC-14

SX0863 Solvent Absorbent Spill-X-S Tantalum Etch III Tartaric Acid TC-5050 Part A Techni Strip 2 Tetrafluoromethane Tetramethyl Orthosilicate Tetramethylammonium Hydroxide (in water) Tetramethylammonium Hydroxide, 0.26N Thermal HL80 Thixotropic Base (93-500) Titanium Nitride Coating Titanium(IV) Chloride

Titanium(IV) Oxide Titrant Solution Hardness 3 Toluene Toluene, 99% Trichloroethylene Trichlorofluoromethane Trimethylaluminum Triton X-100 Ultra Clean L Uralane 5753 A V-904, Hydrazine Dydrate, 100% Vasceal High Vacuum Leak Sealant (Liquid) Vecotr HTS-3

VM651

VM652

WaferBOND® CR-200 WaferBOND® Remover WD-40(Aliphatic Petroleum Distillates, Petroluem Base Oil, LVP Hydrocarbon Fluid, Carbon Dioxide, Non-HazardousIngredients) WiDE®-30W XP MicroSpray™ Positive Photoresist Spray XP SU-8 Developer Xylene Yttrium Oxide Z-Axis Adhesive Film 5352R Zero Charge Anti-Static Cleaner/Neutralize Zorrix