SOW_LC-FESEM_28 JAN 2025.pdf

STATEMENT OF WORK

for

Large Chamber Field Emission Scanning Electron Microscope

(LC-FESEM)

for the

809th SCIENCE & ENGINEERING LABORATORY

(809 MXSS/MXDTAC)

Hill AFB, UT

28 January 2025

1. SCOPE:

1.1. This statement of work (SOW) covers detailed specifications and performance requirements for a Large Chamber Field Emission Scanning Electron Microscope system for 809 MXSS/MXDTAC at Hill AFB, Utah. From this point on in the SOW, the Large Chamber Field Emission Scanning Electron Microscope will be referred to as LC-FESEM.

The new LC-FESEM will replace an outdated 809 MXSS scanning electron microscope, simultaneously accommodate/reuse existing 809 MXSS EDS and WDS detectors (section 3.5.2) and enable rapid high resolution failure analysis of aircraft component materials.

Primary applications include, but are not limited to, small particle analysis, fracture surface characterization and material elemental identification in a single system.

2. OVERVIEW:

2.1. Acquisition of a LC-FESEM will allow rapid high-resolution imaging, characterization and elemental analysis of both raw material and processed material samples. Adding a LC- FESEM will increase lab’s capability and expeditious support of the customer workloads.

The LC-FESEM will be used to support analysis of numerous metal components used in landing gear and other systems on A-10, C-130, C-17, F-16, F-35, KC-135, T-38, Ground and Shop Support Equipment and Structures, Vehicles, Missile components, etc.

3. SYSTEM DESIGN:

3.1. ENGLISH: All documents and software submitted by contractor to USAF contracting office must be in American English. All documents and software provided with LC- FESEM must be in American English.

3.2. The LC-FESEM shall be new and one of the manufacturer's current production models, which, on the date of the solicitation, has been designed, engineered, sold or is being offered for sale through advertisements or manufacturer's published catalogs or brochures.

3.3. The LC-FESEM shall be an off the shelf design meant for high resolution imaging in both high vacuum and low vacuum modes. Products such as a prototype unit, pre-production model or an experimental unit do not qualify. The system shall include all components, parts, and features necessary to meet the requirements specified herein and be complete and ready for use.

3.4. Electron Optics. Must meet the following minimum requirements:

3.4.1. Must employ a fully automated in-lens field emission electron gun that utilizes the thermal Schottky effect. Field emitter shall be fully guaranteed for at least 2 years under warranty, see Section 4.1.

3.4.2. Adjustable accelerating voltage with operating range from 500V to 30kV, with at least 50 discreet steps. In the range of 250V to 3kV it shall have 100V or finer steps.

3.4.3. Continuously variable probe current with an operating range of 10pA to 300nA.

3.4.4. Must maintain high vacuum in electron gun column isolated from sample chamber.

3.4.5. Must include a battery backup power system capable of maintaining vacuum in gun column during a power outage. Must be of sufficient size and capacity to eliminate the need for gun bake out.

3.4.6. Must utilize accurate automatic beam alignment, axis alignment, and gun bias.

3.4.7. Must have manual and automatic adjustments for aperture alignment, astigmatism correction, and beam focus.

3.4.8. Include an automatic or manually selectable objective lens aperture located in the front focal plane of objective lens, or equivalent. The aperture assembly shall include at least four (4) aperture sizes with fine adjustments for X and Y.

3.4.9. Include objective lens wobbler for optimum centering of objective lens apertures.

3.4.10. Include automatic/dynamic focus tracking capability linking the mag and working distance for changes to sample stage made in Z position.

3.4.11. Include a Meter for measuring absorbed current and probe current.

3.4.12. Capability for adding a Faraday cup for accurate measurement of probe current. In-column or stage mounted Faraday cups are acceptable.

3.4.13. Include manually activated automatic lens degaussing routine which is linked to changes in kV.

3.4.14. Include tilt correction to correct for foreshortening effect of tilt angle.

3.5. Electron Detectors. Must meet the following minimum requirements:

3.5.1. Include an Everhart-Thornley type secondary electron detector with user control of both collector and scintillator voltages.

3.5.2. Include an integrated multi-element solid state backscattered electron detector.

Detector shall be mounted at the bottom of the final lens, without restricting sample movements specified above. Detector shall permit operation of separate signals for viewing pure compositional and/or topographical images. Shall permit electronically variable operation to adjust the compositional to topographic signal ratio. Detector placement must not hinder high resolution or any imaging performance or limit Energy Dispersive Spectrometer (EDS) and Wavelength Dispersive Spectrometer (WDS) functions, section 3.8.2. A retractable detector with equivalent functions is acceptable.

3.5.3. Include a fully integrated low vacuum secondary electron detector for imaging using a secondary electron signal in low vacuum mode. Must also allow viewing of photon response in both high and low vacuum modes.

3.6. Performance. Must meet the following minimum requirements:

3.6.1. Shall be capable of achieving a resolution of 1.0nm at 20kV, 3.5nm at 1.0kV and 3.0nm at 15kV, or better, while in high vacuum mode. This must be demonstrated without the use of in-lens detectors or beam deceleration.

3.6.2. Shall be capable of achieving a resolution of 2.0nm at 15kV in low vacuum mode using a backscatter electron detector. This must be demonstrated without the use of in-lens detectors or beam deceleration.

3.6.3. Capable of achieving high probe currents up to 300nA or more.

3.6.4. A continuously variable magnification range from 6X to at least 600,000X printed and 14X to at least 1,600,000X displayed, with automatic display size recognition.

3.7. Scanning/Display System. Must meet the following minimum requirements:

3.7.1. Include digital scan generator capable of resolutions up to 5120 x 3072 pixels or better.

3.7.2. Generate live SEM images in full frame or reduced area scans.

3.7.3. Include controls for at least seven scan speeds.

3.7.4. Include controls for fine image shift of at least ± 40 um at any working distance.

3.7.5. Include scanning modes which incorporate frame integration or other charge free methods to inhibit charging of non-conducting samples.

3.7.6. Allow 360-degree digital scan rotation, linkable to working distance. Changes to image rotation will automatically adjust to changes in Z position and XY travel, for all angles of digital rotation.

3.7.7. Includes chamber mounted digital color camera, for capturing images of mounted samples and holder. Allows point and click navigation on image. Transition from color optical image to live scanning electron microscope (SEM) image shall be seamless. Images shall be linked to SEM images collected during the same session.

Shall allow color image overlay on SEM image.

3.7.8. Allow display of SEM images in up to nine navigation windows to use for point and click sample navigation via motorized stage. These windows should allow the instant recall of operating conditions from any stored image.

3.7.9. Include software guided sample exchange with a step-by-step guide from sample introduction to applicable settings to navigation and automatic image creation.

3.7.10. Include in SEM display values for kV, magnification, working distance, low vacuum operating pressure, sequential number, and other pertinent information with independent on/off display for each item.

3.7.11. Include the ability to import any logo to be burned into SEM image when saving.

3.7.12. Include an external scan interface connection and external control software.

To provide direct control of SEM column scan coils using a remote digital scan generator and control of some of the SEM functions for integration with accessories such as third party EDS systems.

3.7.13. Shall allow the display of 4 or more live images simultaneously. Include options to select a dual live image display and live image display in a flexible window and define size and position for display.

3.7.14. Include ability to display up to 4 mixed signals in real time and in any ratio.

3.7.15. Include ability to capture images (TIFF, JPEG or BMP) and movies (AVI or similar) of live image as displayed on screen.

3.7.16. Include automatic file saving function operated simply by a mouse click.

3.7.17. Include automated image montaging function to capture images from multiple detector scans for creating a large area map/image. Built-in automated image collection and stitching. Quick point and drag selection of montage areas. Able to select multiple areas.

3.7.18. Include ability to automate image collection by selecting locations and defining observation conditions. Allow creation of recipes for repeated use. Include built-in recipe function which saves operating conditions, stage location and a thumbnail image of a sample.

3.7.19. Include built-in measurement function. Measure point to point, polygon area, circle diameter, angle, and give a count. Use Scalar function with X, Y, D and circle.

Adjust display of fonts & colors. Allow inputs for text. Display results on live image and allow writing to a stored image or export to CSV file.

3.7.20. Include software interface with operator customizable workspace. Store settings for custom workspace using an individual login.

3.7.21. Include ability to modify the brightness, contrast or to color enhance secondary electron or back scattered electron images on both live and stored images.

3.7.22. Include the ability to reproduce instrument conditions from any stored SEM image.

3.8. Sample Chamber and Stage. Must meet the following minimum requirements:

3.8.1. LC-FESEM shall be equipped with a large, sample chamber with multiple ports designed to accommodate a variety of detectors including multiple EDS (180°), coplanar EDS and Electron Backscatter Diffraction (EBSD), and fully focusing Rowland circle geometry WDS. The chamber shall have more than 10 ports to support a broad range of configurations.

3.8.2. Chamber must include the necessary ports to readily attach an existing Oxford Xmax80N EDS detector and an existing Wave 500 WDS detector (large port). Must be fully compatible with an Oxford AZtecHKL EBSD detector for future requirement.

3.8.3. Door must open fully off to one side of chamber.

3.8.4. Chamber and stage must be capable of accommodating and analyzing samples at any point that are 203mm diameter or larger, 80mm high or larger, and weighing 2kg or more.

3.8.5. Include mechanically eucentric stage where focus, magnification and field of view are maintained at all working distances.

3.8.6. Include computer eucentric rotation and tilt for tall samples when rotating off axis or tilting the stage (regardless of working distance).

3.8.7. Include a large computer controlled 5-axis (X,Y,Z,T,R), asynchronous, motorized stage. Stage speed should be proportional to and linked to the magnification.

3.8.8. Stage and its motors must be internal to the sample chamber and not attached door. Must permit secure placement of samples on stage inside chamber and allow operator to observe the full range of allowable movement, in all axes, prior to closing chamber door for evacuation.

3.8.9. Stage shall have motorized travel movements of 125mm X, 100mm Y, 75mm Z, -10 to 90° tilt and 360° rotation. Motion control operated by multi-touch on screen, keyboard entry, mouse, or joystick on a desktop control. Absolute or relative stage motion shall be possible as well as recall of stored stage coordinates.

3.8.10. The maximum stage tilt axis shall be perpendicular to the EBSD Port.

3.8.11. The stage shall allow movement of all axes via continuous move, click-n-drag, double-click to center, or by click navigation on the displayed SEM images.

3.8.12. The stage shall allow for a user defined frame shift in both X and Y directions, for manual image stitching.

3.8.13. Must include adapter(s) for mounting existing dovetail type JEOL specimen holders onto stage.

3.8.14. Shall include a high-resolution chamber mounted color camera for imaging sample and holder from above. Acquired image shall be storable. Used for navigation.

3.8.15. Shall include an infrared side view chamber camera for viewing sample position with respect to backscatter detector and final lens. Positioning the sample using this camera view shall automatically input sample height offset thus providing a safety interlock for tall samples to avoid collisions.

3.8.16. Software must support point & click sample navigation using live or captured optical image of sample and holder, showing position of beam on sample.

3.8.17. Software must include a graphical display showing sample stage with relative position of beam on sample and relative position of sample to final lens.

3.8.18. Software must include storage and recall of sample positions and automatic position of the stage using cross hairs on the display.

3.8.19. Must include software-controlled stage travel limits that are linked to sample size.

3.8.20. Must include a touch sensor to immediately terminate stage travel.

3.8.21. Include a chamber mounted/integrated Plasma cleaner.

3.9. Vacuum System. Must meet the following minimum requirements:

3.9.1. Chamber high vacuum system shall include a turbo molecular pump rated at ≥200L/sec.

3.9.2. Assist vacuum. Shall include a rotary pump rated at ≥135L/sec to assist turbo pump in high vacuum mode.

3.9.3. Clean vacuum shall be maintained in the electron gun chamber with working pressures of 1x10-7Pa. Shall include two ion pumps, each rated at ≥135L/sec to maintain high vacuum in electron gun chamber.

3.9.4. Chamber vacuum. High vacuum range shall be less than 6x10-4Pa or better.

Low vacuum range shall be 10 to 150Pa or better.

3.9.5. After being vented, the chamber shall evacuate to high vacuum in < 3.5 minutes.

3.9.6. Shall include a replaceable pressure differential aperture for the column that is independent of the objective lens aperture. This pressure differential aperture shall not inhibit low magnification performance but will allow fine adjustment of the objective lens aperture while operating in low vacuum. This aperture need not be removed when switching between high and low vacuum.

3.9.7. A clean vacuum environment shall be maintained at the objective aperture to ensure the aperture assembly stays clean and to improve imaging performance.

3.10. Controller and Operating System. Must meet the following minimum requirements:

3.10.1. Shall include a new high-powered Windows 11 Pro (preferred) or Windows 10 Pro system Controller-Workstation. If a Windows 10 system is used it must be upgradable to Windows 11 without hardware upgrades. Controller-Workstation shall be supplied with the operating system and included software installed.

3.10.1.1. 24-inch Touch Monitor (native resolution: 1920 x 1080 or higher)

3.10.1.2. i5 6-core CPU (Single Thread Rating of 3400 MOps/Sec) or better

3.10.1.3. 16GB Ram or higher

3.10.1.4. 1 TB SSD drive or larger

3.10.2. Include latest version of Microsoft Office, installed and activated.

3.10.3. System software shall allow for multiple user logins with customized settings.

Settings must allow General and Administrator level accounts with password protection.

3.10.4. Include comprehensive on-screen help covering all aspects of routine operation.

3.10.5. Include embedded software which links color navigation images and/or SEM images with their respective locations for position recall and reporting.

3.10.6. System shall support scripting via Python based application.

3.10.7. System shall support option to add integrated 3D measurement software.

3.10.8. Include manual user interface or desktop control to allow operator to manually control system or override automatic settings. Shall have separate controls for magnification, focus, astigmatism correction, brightness, contrast and scan speeds.

Shall have a joystick or similar for controlling stage movements in all axes.

4. OTHER DELIVERABLES:

4.1. TRANSFER and INSTALL KIT. Kit to transfer existing Oxford EDS and WDS systems over to the new LC-FESEM. Minimum requirements:

4.1.1. Shall include the removal of an existing Oxford Xmax80N EDS detector and an existing Wave 500 WDS detector from an existing JEOL 6490LV SEM and complete installation of both onto the new LC-FESEM.

4.1.2. Shall include adapters and hardware necessary to transfer and mount an existing Oxford Xmax80N EDS detector and an existing Wave 500 WDS detector (large port) to the new LC-FESEM chamber.

4.1.3. Shall only be completed by personnel trained by Oxford on the specific make and model EDS and WDS system for installation and use on the new LC-FESEM.

4.1.4. Shall include parts, shipping, labor, food, travel and accommodation expenses for on-site visits.

4.2. WARRANTY. Minimum requirements:

4.2.1. The successful bidder (contractor) shall provide a minimum one (1) year warranty which warrants all products provided under this contract to be free from defects. Except the electron gun emitter which shall be fully covered by, at minimum, a two (2) year warranty. During the warranty period, supplier shall assume responsibility for any and all defects in materials, workmanship and performance. Warranty shall include the cost(s) of: parts, shipping, labor and any travel related expenses. Warranty period to start from date of final acceptance.

4.2.2. During the warranty period, the contractor shall provide free of charge at least two (2) on-site preventive maintenance inspections of the system. Unlimited on-site emergency service visits shall be included. Attention: remote access to LC-FESEM is not allowed.

4.2.3. During warranty period, on-site service should be provided within 48 hours (business days, excluding standard Federal holidays) for inoperable equipment, barring uncontrollable delays such as transportation breakdown, extreme weather, etc. Attention: remote access to LC-FESEM is not allowed.

4.2.4. Any defects in materials or workmanship or failure of any product or component to perform its designed function during the warranty period shall be repaired by the contactor at no additional cost to the government.

4.2.5. The contractor shall provide, free of charge, software updates and/or critical system upgrades that are released during the warranty period.

4.2.6. Contractor shall maintain a service office within a reasonable distance, such that service personnel shall be available for direct telephone consultation during normal business hours local Mountain Time.

5. AFTER CONTRACT AWARD:

5.1. Delivery. The contractor shall crate LC-FESEM for shipment to its final destination in accordance with standard commercial practice, at no additional cost. Contractor shall deliver the LC-FESEM to the job site at Hill Air Force Base, Utah 84056 within 180 days, at no additional cost. The delivery address is 809th Science and Engineering Laboratory.

Attn: Cody Hone or Josh Baugh. 7278 4th Street Bldg. 100, Bay D/E. Hill AFB, UT 84056.

Contractor shall coordinate delivery and off-loading with a designated Point of Contact (POC) from 809 MXSS/MXDTAC. The POC’s contact information will be provided upon contract award. Contractor shall contact POC for scheduling and access to the base.

Contractor’s representative(s) entering the base shall be United States citizens. Security clearance is not required.

5.2. Installation:

5.2.1. The contractor shall provide on-site services for the uncrating, installation and setup of LC-FESEM. Contractor’s representative shall inspect LC-FESEM on-site to ensure that all pieces/parts are present and accounted for. Contractor’s representative shall fully install LC-FESEM. Contractor’s representative shall demonstrate that LC- FESEM meets specified performance requirements prior to final acceptance by POC.

Failure to meet all requirements outlined in this SOW may be grounds for rejection.

5.2.2. All labor, food, travel and accommodation expenses for on-site installation by the contractor’s representative(s) shall be included.

5.3. Familiarization:

5.3.1. Training. Following installation, the contractor shall provide formal training on LC-FESEM, at no additional cost. Contractor shall send a qualified applications specialist(s) on-site that is factory trained on the specific model LC-FESEM. The applications specialist(s) shall provide training for 3 or more operators, for at least three (3) 8-hour days, on-site at Hill AFB, Utah.

Training, at a minimum, shall include:

5.3.1.1. LC-FESEM System Introduction

5.3.1.2. Start Up/Shut Down procedures

5.3.1.3. Detailed system usage

5.3.1.4. Capabilities/features/functions

5.3.1.5. Sample preparation

5.3.1.6. Software – complete operation of all functions, to include procedure/methods development

5.3.1.7. Detector usage and operation

5.3.1.8. High vacuum imaging techniques

5.3.1.9. Low vacuum imaging techniques

5.3.1.10. Automated Measurement

5.3.1.11. Project correlation methods

5.3.1.12. Image Montaging

5.3.1.13. Report Generation

5.3.1.14. System Care & Maintenance

5.3.2. All labor, food, travel and accommodation expenses for the applications specialist(s) to make on-site visit shall be included.