SOW for Micron Semiconductor LLC 8 13 20 4200731595.doc
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- Attached to
- Solid State Detectors (SSD) Federal contract opportunity
- Solicitation number
- 80GSFC20007
About this file
This document summarizes a federal contract opportunity for solid-state detectors. NASA/Goddard Space Flight Center requires 40 solid-state detectors from Micron Semiconductors Limited to be used in the MERiT instrument onboard the Lunar Gateway Mission. The detectors must meet specific technical requirements for silicon material composition, dimensions, thickness, resistivity, and finish. Interested parties have 9 days to submit capabilities for consideration to conduct the procurement on a competitive basis. However, due to Micron Semiconductor's unique expertise, heritage in providing detectors for previous NASA missions, and ability to meet schedule requirements within 3 months, NASA intends to issue a sole-source Request for Proposal for this firm fixed-price, 7-month contract.
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| File | Type | Posted |
|---|---|---|
| SF30 AMENDMENT 1 TO RFP 80GSFC20007 SIGNED.pdf |
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STATEMENT OF WORK FORMAT
Solid-state detectors for the Miniaturized Electron Proton Telescope on the Lunar Gateway (HERMES) mission.
Background
The cis-lunar Gateway platform provides the opportunity for heliophysics investigations to advance our knowledge of the coupled Sun-Earth system and the opportunity better understand the radiation environment in order to support and improve crew safety and operations at the Moon and beyond.
MERIT (Miniaturized Electron Proton Telescope) has been selected by NASA HQ to fly on the Lunar gateway. MERIT is a particle telescope that uses a stack of solid-state detectors (SSD). These SSDs used will also be identical to the MERIT instrument on CeREs, and CUSP CubeSats and the REPT instrument on NASA’s flagship mission Van Allen Probes.
Scope
Micron Semiconductors, UK shall deliver 40 SSD detectors to NASA GSFC which are designated MSD040 DT/RBSP-1500 and have flown on the REPT/Van Allen Probes.
Requirements
The SSD requirements are given by the following specifications:
SILICON:
Float Zone
Orientation: <100>
Dopant: N Type (phosphorus)
Resistivity: 30,000 ohm-cm typical
Resistivity range: 25000-ohm – cm 35000 ohm – cm
Diameter: 100 +/- 0.5 mm (4 inch)
Primary orientation FLAT 32.5mm +/- 2.5 mm
Thickness: 1500 micron +/1 25 micron
Total thickness variation (TTV) +/- 2 microns
Bow 2 microns typical
Finish: Double sided polished (Virginia, USA)
Crystal growing: Topsil Denmark
Cut to ingots: Topsil Denmark
Etched/ lapped: Taiwan Asia
Finish required: defect free excluding outer 5mm viewed x 10 magnification. Free of scratches/ hillocks
Edge: Rounded with no cuts or lesions
DETECTOR SPECIFICATION:
Part designation: MSD040 DT/ RBSP-1500
Design: Ion implanted Multiguard / Field Plate Structure
Single Active Area 12.5cm2
Active diameter: 40mm
Window Type: 2M (<1 micron) both faces
Detector thickness: 1500 micron +/- 25 micron
Packaging: PCB stacks in pairs
Connector: TBA based on delivery timescales
Full depletion (FD) 250 +/- 50 volts subject to silicon selected post processing
Operating voltage FD to FD + 30V (FD + 15V typical)
Capacitance (FD) 100pF typical
Leakage Current (FD + 30V) 2uA typical 3uA maximum
Forward voltage (10mA) 0.8 volts maximum
Multi guard ring – floating unbiased
Total alpha resolution (junction) 241 Am 75KeV maximum
Total alpha resolution (ohmic) Am 100KeV maximum
Metallizing aluminum 3000A° minimum (4KeV electron cut off)
Both sides (to specify) 3000A° maximum (4KeV electron cut off)
Reliability (NASA standard) 21 days + 40°C 10 –6 torr V operating (72 hours for Engineering models)
Leakage current must plateau over this period normally increasing by a factor of 8 to that at 20°C
This vacuum test can be a failure mode
Flight qualification: Followed by QA documentation / Test Data/ C of C
Wire bonding: minimum 2 per electrode with 3 preferred, anode, cathode with guard ring floating
(100%
Non-destructive pull test: MIL-STD-883 Method 2023.5)
Quality assurance: ISO9001 (full traceability) BSENISO9001-2000
Mission quality assurance to inspect and approve as required at Micron (Lancing) or LASP (Colorado)
Detectors supplied with QA release documentation/ test data/ C of C (Certificate of Conformance)
Detector labelling
Gold plating:
Soft gold ultrasonic wire bondable
Rolled annealed copper if rigid flexi
NASA approved company to be used
Detector Packing:
Flight shipping packs, for containing trays, designed and supplied with individual detectors with identification as agreed with LASP. These trays will be suitable for transit between clean rooms at Micron and GSFC and during shipment with courier between destinations Deliverables or Delivery Schedule
The deliverables required are the MSD040 SSDs. The delivery schedule is to be no later than 7 months after receipt of contract. The detectors should be delivered to the MERIT PI, Dr. Shrikanth G. Kanekal, Code 672, NASA/GSFC. The detectors will have accompanying documentation describing the tests conducted and qualification details.
Government-Furnished Equipment and Government-Furnished Information
N/A Place of Performance
Work is to be performed at the contractor’s site.
Period of Performance
Period of performance will be up to 7 months after receipt of the contract.
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