SOW for Mask Aligner DRAFT.pdf

STATEMENT OF WORK

Mask Aligner with Align-for-Bond

PCN:

Background

The Detector Systems Branch of GSFC has a requirement to acquire a contact mask-aligner system with align-for-bond capabilities, for use in the Detector Development Lab (DDL).

The system has two main functions, 1) is to align a mask to a substrate (typically a wafer) and 2) is to expose UV light onto the substrate through the mask. The align and expose feature is used to transfer patterns from metal patterned glass plates to silicon wafers (or other substrates) containing a UV sensitive resist coating. Additionally, an align-for-bond feature allows multiple substrates to be aligned together and held in place prior to transfer, via fixturing, to a separate system which bonds the two substrates together maintaining the previous alignment. The bonding system is not in scope of this requirement. The system shall include all necessary software and hardware to enable precision alignment, force control and temperature control. The vendor shall provide technical support of the equipment. The current requirement is for a system that can align and expose, as well as align for subsequent bonding.

The Detector Systems Branch has a separate bonding system. The requirement presented here is for a system capable of mask-to-substrate alignment (followed by UV light exposure) and shall also be capable of alignment for bonding, directly interfacing with an existing EVG 501 bonder. Any fixtures or substrate-holding required to interface with an

EVG bonding system shall be included and work seamlessly with the existing bonding system.

Such a system is essential for nearly all device fabrication projects under development and in production in GSFC’s Detector Development Lab. While the DDL has multiple processes to create patterns for devices, contact lithography remains the most used among all projects. The requirement is important to maintaining capability in the DDL.

Objectives

1. To procure a system capable of contact mask alignments and subsequent UV exposure

2. To procure a system capable of wafer-to-wafer alignment for subsequent bonding in an existing EVG 501 bonding system.

3. The system is to be installed in the NASA GSFC Detector Development Lab, a class

100 (ISO5) cleanroom.

4. To procure a system with a one-year warranty for parts and labor.

5. To procure a system in accordance with GSFC safety requirements that include meeting SEMI S2 compliance and NFPA 318 standards and to Nationally Recognized

Testing Laboratory (NRTL) standards.

Scope

The scope of this work includes design, production, delivery and startup of a mask alignment and wafer-to-wafer alignment system. No prototypes or one-of-a-kind systems will be considered. The unit must be a production model with similar units working in the field demonstrating all capabilities listed in the requirements. The following milestones are expected.

a) Design of the system at the vendor location, followed by approval of the design by the GSFC technical representative. Installation requirements to be communicated to GSFC.

b) Construction of the system at the vendor facility, followed by factory demonstration of the system. This factory test will verify all requirements listed below are in working order at the vendor facility. This may be a virtual demonstration where reports and performance are shared with the technical representative.

c) The vendor shall assume all crating and shipping responsibilities for delivery to

GSFC.

d) Installing, demonstrating, and training, of approximately three GSFC personnel, on all functions of the system at GSFC.

e) Acceptance testing of the system at GSFC.

Tasks or Requirements

The vendor shall provide a new system that is equipped with the following equipment and meets the following requirements prior to Final Acceptance of System.

1. A brand-new unit is required; no used equipment or accessories are acceptable.

2. The system shall meet current industry standard Semi S2 requirements for safety such as including the use of Emergency Off (EMO) panic buttons, the appropriate shielding, and interlocks for hazardous areas, protecting the user and maintenance personal from high voltages, pneumatics, radiation, moving parts and the tool from potential service failures.

3. The system shall have all hazardous labels in English.

4. The unit shall be a commercially available model with similar units working in the field demonstrating the complete list of requirements.

5. The equipment shall have a small footprint, minimizing floorspace.

6. The system shall be Class 100 (ISO5) Cleanroom compatible. All construction and assembly debris/grease will be cleaned prior to packaging for shipment.

7. The system shall be built out of cleanroom compatible (i.e., low particulate) materials including paints and coatings (no outgassing volatile organic compounds) on metal surfaces.

8. The power off state (when EMO is pressed) shall close all valves, power off all power supplies, and stop flow of any gasses and restrict mechanical movement as relevant.

9. The system shall have an integrated base and frame with side covers to allow for vertical laminar flow.

10. The system shall include a computer interface for control of the system and logging of all process and machine state parameters.

11. The system shall include an industrial PC with modern Windows operating system and User Interface.

12. The computer interface shall be compliant with NASA IT specifications. The supplier shall agree to work to a reasonable extent with NASA to meet IT requirements for 508 compliance or provide necessary information and documentation should waivers be requested.

13. The system shall meet IPv6 compliance standards.

14. Specific system requirements shall include the following.

14.1. The system shall be capable of aligning two wafers together for the purpose of wafer bonding (referred to as bond-alignment mode).

14.2. The bond-alignment mode shall be capable of handling wafers for alignment from

4” up to 200mm diameter. All necessary chucks and fixtures shall be provided to cover this size range.

14.3. The bond-alignment mode shall be capable of directly interfacing with a separate bonding system, EVG 501 Bonder.

14.4. The bond-alignment mode shall seamlessly integrate with the bonding system and require no alteration to bonding hardware.

14.5. The alignment-exposure mode shall be capable of handling 4” to 200mm diameter wafers. All necessary chucks and fixtures shall be provided to cover this size range. Specifically, vendor shall provide wafer and mask chucks to support align and exposure of 4” wafers, 6” wafers and 8” wafers.

14.6. The system shall be capable of standard contact alignment modes that include, soft-contact, hard-contact, vacuum-contact, and proximity mode. All necessary chucks and fixtures shall be provided to cover these modes of operation.

14.7. The system shall be capable of the following exposure modes; timed, flood, split

(with programmable wait periods).

14.8. The system shall be capable of automatic wedge compensation when in contact or without contact between mask and wafer for wafer planarization.

14.9. The system shall accommodate large alignment gaps of greater than 50 microns between the mask and substrate surface to overcome limitations of depth of focus of installed objectives.

14.10. The system shall accommodate wafer thickness from 0.1 – 10.0 mm.

14.11. The system shall be programmable via software/recipe to control mask-substrate separation from 0-300 microns.

14.12. The system shall include a stage with computer-controlled movement.

14.13. The system stage shall have a zero or “home” position.

14.14. The system shall utilize an LED generated broadband (350nm – 450nm), UV exposure system for I-, G-, and H-line.

14.15. The system shall be capable of uniform exposure across a 200mm wafer better than 2.5% uniformity.

14.16. The system shall also include passive vibration control.

14.17. The system shall be capable of Top Side Alignment, looking through a glass mask plate utilizing top-side microscope objective lenses.

14.18. The system shall be capable of Front-to-Back-Side alignment utilizing a separate set of bottom microscope objectives specifically for this mode.

14.19. The system shall have a camera system for both top-side and back-side imaging capable of providing at least 4x digital zoom.

14.20. The system shall include objective turret for at least two objectives. The following objectives are to be included, 3.6x, 5x and 10x.

14.21. The controlling software shall be capable of target training and pattern recognition,

14.22. The system shall be capable of the following operational modes: manual operation, semi-auto and full-auto. Semi-auto and full-auto shall operate for alignment assist without operator intervention. Manual mode shall allow for complete alignment control by the operator.

14.23. The system shall include a vision system for recognizing alignment marks and assist in substrate-mask alignments.

14.24. The system shall include a fully motorized stage in X, Y, Z and Theta.

14.25. Topside microscopes shall have a travel range of 32 – 200 mm separation in X and +/- 75 mm in Y.

14.26. Bottom side microscopes shall have a travel range of 78 – 180 mm separation in X and +/- 12 mm in Y.

14.27. Auto alignment modes shall have a manual alignment check prior to exposure.

14.28. The system shall be capable of top-side alignment accuracies of 0.5 um or better.

14.29. The system shall be capable of bask-side alignment accuracies of 1.0 um or better.

14.30. Installation, DDP shipping and extensive training and support shall be included.

14.31. The system shall occupy a footprint of no more than 54” x 40”.

14.32. Systems that include a separate IR light source for through wafer alignment will be favored.

14.33. Systems with enhanced digital zoom for improved image quality and high contrast images will be favored.

Software

The controlling computer operating system (OS) shall be Windows 10 or later. Any system running an OS older than Win10 shall ship with at least Windows 7 and shall include an upgrade to Windows 10.

The controlling software shall have separate modes for different types of users such as administrator (manage users, control system manually), engineer (recipe development), and basic user (execute recipes).

Facilities

The Tool and all required facilities shall be specified at the time of award and GSFC shall be notified of these requirements. The system shall be delivered to GSFC with exterior surface parts clean and free of grease or dust and compatible with operation in a Class

100 cleanroom environment.

Installation, Training and Documentation

• The system shall include delivery of the tool to Goddard Space Flight Center in

Greenbelt, MD.

• The system shall include installation at Goddard Space Flight Center in Greenbelt, MD.

• The vendor shall provide a factory trained engineer who is a U.S. Citizen or

Lawful Permanent Resident to conduct the installation. Alternatively, if a foreign national must conduct the visit, the vendor shall provide names of visitors and the required documentation 60 days in advance of scheduling a visit.

• Installation shall include a demonstration of all stated requirements. At the completion of installation and demonstration, the vendor shall provide training for up to three GSFC employees.

o The vendor shall provide process support to adapt GSFC recipes to EVG recipes.

o The vendor shall provide an operation training at GSFC to include theory of and basic operation, error recovery, symptom recognition, fundamental skills for safe operation, routine tasks, skills and knowledge of the hardware and software user interface.

o The vendor shall provide advanced operation and preventative maintenance training to include theory of and basic operation, error recovery, symptom recognition, fundamental skills for safe operation, advanced operations, data collection, control systems, maintenance software, basic parts removal and replacement.

• The vendor shall provide all system manuals on cleanroom paper in addition to providing digital copies. Manuals shall present clear instruction for operation, maintenance and care of the system.

• Vendor will provide documentation of all hardware in the system, including and any third-party components, printed versions of any settings associated with the hardware, operation and maintenance.

Warranty

• The vendor shall provide the government the same warranty terms, including extended warranties, provided to the public in customary commercial practice.

Warranty terms must be included with the system. The period of warranty shall begin upon acceptance of the system.

• Supplier shall provide a Warranty of at least 12 Months (Parts and Labor), guaranteed to meet factory specifications.

• Vendor will guarantee functionality of the system, as defined by the state of the system accepted after the demonstration and training visit, for one year after acceptance of installation. This will include replacement of failed parts on the tool, troubleshooting of problems with the system via phone consultation, as well as site visits to restore system if it is non-functioning.

Milestones

The vendor shall be responsible for delivering the complete specified system (as described above) to the GSFC Detector Development Laboratory. The vendor shall also set up and install all components at GSFC Detector Development Laboratory.

The Supplier shall install the system on-site at GSFC’s Detector Development Laboratory and provide operator training of the system. Together with GSFC technical personnel, the Supplier shall review the system, demonstrate, and confirm that the system functions properly based on the specifications above.

1. Factory demonstration shall occur prior to shipping (factory acceptance test). The vendor shall demonstrate that the system meets all stated requirements in this SOW as well as vendor listed specifications.

2. Upon the completion of factory demonstration, the vendor shall ship to

GSFC and install system at GSFC.

3. At GSFC, the vendor shall demonstrate the system meets all stated requirements in this SOW as well as vendor listed specifications. Final acceptance of system will be conditional upon successful demonstration of functions and all stated requirements.

4. Final acceptance of system will be conditional upon providing user training on system operation and providing operational manuals and maintenance manuals with circuit schematics and layouts.

Vendor will complete on-site equipment startup, verification, training, and any other activities related to final acceptance. The vendor will contact the GSFC technical representative within two weeks of date of award to present the planned design for the tool. Vendor will build the tool within 16 months after award, providing updates to the technical representative to ensure scheduled delivery, and to coordinate acceptance testing or visit of GSFC representative to vendor site for inspection and testing of the unit for acceptance.

Vendor will be able to provide servicing visits in a timely fashion using factory trained engineers on the specific system and have common consumables and replacement parts in-stock. Providing data or metrics on number of service engineers deployed and equipment up-time will be welcomed.

Vendor will specialize in all-new construction and use all-new power supplies and other subcomponents. No refurbished tools will be considered.

Vendor will provide installation engineer that has been factory trained on the specific equipment.

Delivery of the tool shall occur 16 months after receipt of order.

Government-Furnished Equipment and Government-Furnished Information

No Government-furnished equipment (GPE) and Government-furnished information

(GFI) will be required. GSFC will provide power and other utility needs as communicated by the vendor.

Security

Vendor will provide all necessary documents or information to GSFC technical representative to acquire access to the GSFC site.

The vendor shall provide an engineer who is a U.S. Citizen or LPR. Alternatively, if a foreign national must conduct the visit, then the vendor shall provide names of visitors and the required documentation 60 days in advance of scheduling a visit.

IPv6 and 508 compliance

During the performance of this SOW the vendor will be providing IT hardware and software items. The Contractor shall ensure all such items are approved through the

(IPv6) compliance and 508 Compliance. The Contractor shall not purchase IT hardware and software prior to approval.

The vendor shall ensure that products and services that use the Internet Protocol provide full feature functionality in both dual stack (IPv4 and IPv6) and IPv6-only environments in compliance with NIST USGv6 Testing Program, see Special Publication 500-267, A

Profile for IPv6 in the U.S. Government Version 1.0. The vendor must notify the

Contracting Officer of all contract specifications that do not comply with providing full feature functionality for IPv6 and act in accordance with the instructions of the

Contracting Officer.

The contractor shall ensure that all NASA deliverables including systems, electronic communications, and any other information and communication technology be accessible to all people including those who use assistive technology as defined by Final Rule of

Section 508 of the Rehabilitation Act. The rule may be found at: Revised 508 Standards and 255 Guidelines (access-board.gov)

Applicable Chapters are as follows:

508 Chapter 1: Application and Administration

508 Chapter 2: Scoping

Chapter 3: Functional Performance Criteria

Chapter 4: Hardware

Chapter 5: Software

Chapter 6: Support Documentation and Services

Chapter 7: Referenced Standards.

Place of Performance

Work will be performed both at the vendor site, where the unit will be designed, built, and acceptance tested, and at NASA GSFC where the unit will be installed and demonstrated for final acceptance.

Period of Performance

The period of performance shall be 18 months from date of award.