SOW Femtosecond Laser.docx

Statement of Work

For

CNC Femtosecond Laser

Project Title: Femtosecond Laser Machining

Document Date: 21 April 2020

Objective and Scope: Acquisition of one femtosecond laser machining system

1. Background: AFRL/RYD needs to acquire a femtosecond laser machining system due to an increased capability need. RYD currently has a microsecond CO2 laser machining system installed primarily for copper patterning on cladded circuit board materials. RYD requirements have increased to require high precision cutting and drilling on a wide variety of materials with minimal thermal damage to the substrates, in addition to copper patterning already required.

2. Minimum Requirements: RYD requires a flexible laser system compatible with a variety of different projects currently ongoing as well as expected future projects. Detailed requirements listed below:

· A system footprint no larger than 6ft wide x 6ft deep x 10ft tall

· Fiducial recognition for alignment

· Ability to process at least 12in x 18in substrates (can be stitched as long as its automatic stitching)

· Ability to handle different file types, including but not limited to: dxf, gerber, gds

· Laser cutout with very small curf (<25microns) through a variety of substrates up to 60 mil thick.

· Laser drilling of holes down to 25microns in diameter.

· Substrate flexibility

· Circuit board materials up to 60mil thick

· FR4, rogers 4003C, rogers 4350B, Rogers CLTE-AP, Duroid 6002, Duroid 6202, LTCC, Dupont Pyralux, Itera MT

· Semiconductor and Insulator materials up to 500microns thick

· Silicon, Quartz, Alumina, Silicon Carbide, Borosilicate

· Able to process all materials with no carbon deposits and minimum thermal damage (melting/cracking) to the substrates.

Delivery Schedule: As soon as possible after contract award

Delivery Destination: 2241 Avionics Circle, Area B, Building 620, Wright-Patterson AFB, Ohio

Inspection and Acceptance: Both inspection and acceptance will be by the Government at Destination.