SOW.pdf

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High Temp Probe Federal contract opportunity
Solicitation number
1333ND25QNB030350
Issued by
Department of Commerce National Institute of Standards and Technology

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This Statement of Work (SOW) details NIST's requirement for a High Temperature Probe Station System for the CHIPS Metrology program. The system is needed to support nanocalorimetry research for semiconductor process metrology, specifically to enable resistance measurements of heating elements on nanocalorimeter sensors at elevated temperatures up to 600°C. Key technical specifications include four electrical probes, a built-in heater element, a thermocouple temperature probe with closed-loop control, an IR transmittance window, vacuum capability, and a compact design weighing less than 5 kg to fit under multiple microscopes.

The procurement calls for a single probe station system to be delivered within 8 weeks after award, with delivery to NIST's Gaithersburg, MD facility. The payment schedule is 90% upon delivery and 10% upon government acceptance, with Net 30-day payment terms. The contractor must provide a minimum 1-year warranty, and no travel is anticipated. The system is critical for NIST's semiconductor research, enabling thermal property measurements and calibration of nanocalorimeter sensors to support the development of next-generation semiconductor devices and improve manufacturing process yields.

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STATEMENT OF WORK

High Temperature Probe Station System

MML / 643

I. BACKGROUND INFORMATION

The success of US semiconductor manufacturing relies on the ability of the industry to out innovate competitors with new technology and outperform foreign manufacturers with high-yield processing.

NIST’s CHIPS Metrology program is tasked with assisting industry by creating new measurement capabilities that enable the development of next generation devices and help manufacturers with metrology solutions that improve the yield of manufacturing processes. The Nanocalorimetry for Semiconductors and Semiconductor Process Metrology project is addressing this need by developing bespoke sensors, instrument control systems, and calibration and model verifications methods. These sensors measure the thermal properties of thin film semiconductor materials, can perform experiments at time scales applicable to the operations of semiconductor devices, and are being investigated for integration into processing tools for plasma and atomic layer deposition processes. The calibration of nanocalorimeter sensors is critical and a probe station capable of heating will allow us to make the resistance measurements of the heating element on the nanocalorimetry sensor as a function of temperature. Additionally, we expect to combine this this high temperature probe station with the other instrument to make measurements of the emissivity of metal thin films as a function of temperature and wavelength in-house which is a critical parameter required to calibrate nanocalorimeter sensors.

The probe station specified here is mobile to be able to work under multiple optical microscopes. The electrical probes allow connections between electrical test equipment and the silicon sensors fabricated at NIST. When the sensors are mounted in the probe station, they are in contact with a heating stage that can be controlled via software with closed loop control from a temperature probe. This type of probe station is much smaller, and significantly simpler and cheaper than wafer probe stations that are automated and frequently used for semiconductor testing.

II. PURPOSE

The Nanomechanical Properties Group requires the acquisition of a high temperature probe station system. This probe station system, which enables direct resistance measurements of the heating element on the nanocalorimetry sensor as a function of temperature, is essential to our CHIPS project of Nanocalorimetry for Semiconductors and Semiconductor Process Metrology by enhancing the calibration reliability of nanocalorimeter sensors. This capability directly supports the CHIPS R&D:

Metrology Program's Grand Challenge to advance semiconductor manufacturing by providing reliable material properties for modeling and improved high-yield processing. This investment will assist industry by improved new measurement capabilities that foster the development of next generation devices and help manufacturers with metrology solutions that improve the yield of manufacturing processes.

This probe station system is critical for the CHIPS project because it allows for direct resistance measurements of the heating element on the nanocalorimetry sensor as a function of temperature, which is essential for reliable calibration of nanocalorimeter sensors to provide reliable thermal data of semiconductor materials and accelerate the development of semiconductor process metrology. The inability to acquire this system will hinder our ability to fully deploy the calibration system of nanocalorimetry system which requires the measurements of resistance of the metal thin film as a function of temperature. Awarding this procurement within this Fiscal Year is necessary to maintain project timelines and meet critical milestones.

III. MINIMUM REQUIREMENTS

Line Item 0001 Description: High Temperature Prober Station Quantity: One Technical Specifications:

1. Probes – four electrical probes are required to take four-point resistance measurements at room temperature and elevated temperature. With additional value for the system of being capable of reducing potential surface scratch due to thermal expansion while maintaining stable electrical contact.

2. Heater element – a build-in heater element is required and can heat sample and sample mount up to 600 °C or above. The heated region must be at least 0.5 inch in one direction.

3. Temperature sensor – a thermocouple probe placed in contact with the sample mount should be equipped with closed loop temperature control.

4. IR transmittance window – a replaceable IR transmittance window with a transmission of at least 60% from 3.0 µm to 5.4 µm are required. ZnSe window is preferred.

5. Vacuum capability – the probe chamber should be capable of being pumped to rough vacuum with a NIST supplied vacuum pump.

6. Working distance – the samples (500 µm thick Si chips) must be held such that the free working distance of optics is less than 10 mm.

7. Physical - the probe station will be used under multiple NIST-owned microscopes. To meet this requirement, the probe station must weight less than 5 kg and fit within a 300 mm × 300 mm × 200 mm envelope, excluding any support electronics or hardware.

IV. DELIVERABLES

V. PLACE OF PERFORMANCE

All work shall be completed at the contractor’s facility. NIST staff will install and verify performance of the system at NIST’s Gaithersburg, MD facility.

VI. PERIOD OF PERFORMANCE/LEAD TIME

8 Weeks ARO

VII. DELIVERY TERMS

CLIN Description Due Date Format

0001 High Temperature Probe Station System

8 weeks after award

Physical Instrument and controller

Delivery shall be F.O.B Destination and shall occur in accordance with the delivery due dates provided in the above table.

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:

DOC/NIST

Shipping & Receiving 100 Bureau Dr.

Attn: Feng Yi, 223/A329 Gaithersburg, MD 20899

VIII. INSPECTION & ACCEPTANCE

In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

Performance Tests:

1. Electrical connection for a four-point resistance measurement.

2. Temperature control: set the temperature and verify the temperature of the sample stage with a test sensor which was previously calibrated.

NIST may choose at its discretion to forego this part of acceptance testing.

A visual inspection of the equipment will be performed by the NIST COR to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.

Ownership of the equipment shall transfer to NIST upon acceptance by the Government.

The Government will test, inspect, and accept or reject the equipment within 2 weeks of the receipt of the equipment unless otherwise indicated above. The

Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.

IX. WARRANTY

The contractor shall warranty the entire system for a period of a minimum of 1 year and shall be in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government.

X. PAYMENT SCHEDULE Advance payment is not authorized. The Contractor must invoice in arrears according to the payment schedule. The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:

Delivery 90% Government Acceptance 10%

NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer. Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.

XI. TRAVEL

a. No travel is anticipated for this requirement.

b. The contractor shall be responsible for all travel expenses.

XII. MISCELLANEOUS INFORMATION

Safety: The Contractor employee must be responsible for knowing and complying with all installation safety prevention regulations. Such regulations include, but are not limited to, general safety, fire prevention, and waste disposal.

Security: NIST is a restricted campus. An identification badge is required for access for entry into buildings and is shown to the armed Security Police when entering the campus.

Regular Business Hours. Regular business hours are Monday through Friday, 8:00 am to 5:00 pm Eastern Time, excluding Federal holidays and NIST closures.

Identification Badges: Contractor employees must comply with NIST identification and access requirements. Each Contractor employee must wear a visible identification badge provided by the NIST Security Office. The contractor shall provide personnel that pass required government background checks to be issued badges for work on site.

Vehicle Registration: All Contractor employees must register their vehicles with the NIST Security Office to gain access to the campus. A valid driver’s license, Government-furnished civilian ID, proof of insurance and current registration must be presented to the NIST Security Office, at which time a NIST vehicle pass will be issued. The pass must be displayed on the vehicle in accordance with NIST Security Office instructions.

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