SATPC0041509 TAB 04 4 SOW.pdf
PDF 132 KB Posted
- Attached to
- Au Sputtering Target for Release Layer Development Federal contract opportunity
- Solicitation number
- 80NSSC26936399Q
About this file
This document is a procurement specification for a custom gold sputtering target required by MSFC ST12. The deliverable consists of a gold (Au) sputtering target with dimensions of 1.50" x 32.00" x 0.060" thick, fabricated to 99.99% purity (4N), and metallically bonded to an OFHC copper backing plate measuring 3.040" x 33.95" x 0.187" thick. The assembled target and backing plate must be machined and fabricated according to the specified dimensions and purity requirements.
The primary requirements are that the target assembly must be compatible with both vacuum and DC magnetron sputtering processes, and the gold target must be metallically bonded to the copper backing plate for integration into a custom-built dual linear magnetron assembly. The contractor is responsible for fabrication, machining, and assembly of all components to the specifications provided. No information regarding response dates, award dates, pricing, set-asides, or contract vehicles is included in this specification document.
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Text version
MSFC ST12 requires the procurement of a custom Au sputtering target with the following specifications:
• 1.50” x 32.00” x 0.060” thick, Purity 99.99% (4N), Metallic Bonded to an OFHC Copper Backing
Plate, 3.040” x 33.95” x 0.187” thick
Requirements:
• Fabrication of a gold (Au) sputtering target metallically bonded to copper backing plate for integration into a custom-built dual linear magnetron assembly
• Target and backing plate assembly must be vacuum and DC magnetron sputtering compatible
• Machine and assemble according to specifications above
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