SATPC0040011 TAB 10 SOW_REDACTED.pdf

STATEMENT OF WORK

1. Objective/Requirements The vendor shall support the design, flip-chip bonding, packaging, and analysis of test articles in Goddard Space Flight Center cleanrooms.

For the PRobe Infrared Mission for Astrophysics (PRIMA) project, the contractor will perform adhesive bonding of five flight-size microlens arrays with fragile Kinetic Inductance Detector arrays using flip-chip bonding methods developed to meet the requirements of the PRIMA/FIRESS instrument.

For each microlens/detector hybrid, the tasks to be carried out are:

• Release microlens array from its carrier wafer after anti-reflection layer deposition.

• Clean the bonding surfaces on both microlens and detector chips using a microscope and single-hair brush to remove all particles greater than 2 microns diameter from the delicate devices.

• Apply adhesive, align parts to ±3 µm, and make the adhesive bond with SET FC300 High Precision Die / Flip Chip Bonder using SET proprietary GUI software (Version 6.1.0.900 or earlier).

• After hybridization, assess bond quality by attaching standoffs to the completed microlens/detector hybrids, taking infrared images through the silicon die with a FLIR A8581 MWIR infrared microscope, and measuring surface profiles with a Zygo NewView 7300 white light interferometer.

• Package the completed hybrid in a custom protective container for shipment to test facilities at the Jet Propulsion Lab.

The timeline of the bonding of microlens and Kinetic Inductance Detector arrays shall be as follows:

• First hybrid completed within the first 2 weeks ARO.

• Second hybrid completed within the first 4 weeks ARO.

• Third hybrid completed within the first 7 weeks ARO.

• Fourth hybrid completed within the first 9.5 weeks ARO.

• Fifth hybrid completed within 52 weeks ARO.

For the NexGen Micro-Shutter Array (NGMSA) project, the contractor will work on the custom designed hybridization process for the microfabricated device by performing the following:

• Establish the standard operation procedure for the NGMSA indium bump bonding process based on the NGMSA device requirement.

• Perform the pre-bonding device inspection and provide cleaning suggestions.

• Perform indium bump bonding for the micro-shutter array and fanout board devices.

• Measure bond gap with Advanced Spectral Technology (AST) Edge-Gap

Inspection and Metrology Tool and provide post-bonding report.

The timeline for the NexGen Micro-Shutter Array (NGMSA) project shall be as follows:

• Hybridization of micro-shutter array and fanout board start within 9 weeks ARO and complete within 52 weeks ARO.

For the “Demonstrating Large Low Noise Transition Edge Sensor Arrays for Future FIR Space Missions” SAT project, the contractor will work with fabrication, packaging, and integration engineers to:

• Perform inspections of computer aided designs of fixtures required for indium bump flip-chip hybridization.

• Clean and inspect indium bumps containing two-dimensional superconducting quantum interference device multiplexer arrays (2d SQUID mux), fanout boards with flexible components, and membrane-isolated bolometric detector arrays in preparation for indium bump flip-chip hybridization.

• Perform indium bump flip-chip hybridization of two-dimensional superconducting quantum interference device multiplexer arrays and membrane-isolated bolometric detector arrays with fanout boards possessing flexible components.

• Perform metrology of hybridized fanout boards with Advanced Spectral Technology (AST) Edge-Gap Inspection and Metrology Tool and provide reports summarizing the metrology.

The timeline for the “Demonstrating Large Low Noise Transition Edge Sensor Arrays for Future FIR Space Missions” SAT project shall be as follows:

• The first fanout board to a 2d SQUID mux hybrid within the first 3 weeks ARO.

• The second fanout board to a 2d SQUID mux hybrid within the first 5 weeks

ARO.

• The first fanout board to detector array hybrid within the first 12 weeks ARO.

• The second fanout board to detector array hybrid within the first 17 weeks ARO.

The contractor shall provide labor with the following technical proficiencies:

• Working experience on the SET FC300 High Precision Die / Flip Chip Bonder using SET proprietary GUI software, Version 6.1.0.900 or earlier.

• Working experience on the SET FC150 Flip Chip Bonder.

• Working experience in developing and performing flip chip bonding processes using epoxy.

• Working experience in developing and performing flip chip bonding processes using indium bump bonding with optical leveling techniques.

• Working experience on the OntosTT Atmospheric Plasma System.

• Working experience using the Nikon SMZ18 and MM800 microscopes and familiarity with the accompanying NIS Elements software.

• Working experience on the Finetech FINEPLACER pico manual die bonder.

• Working experience on the Zygo NewView 7300 interferometer with MetroPro software, Version 9.1.9 or earlier.

• Working experience on the FLIR A8581 MWIR camera.