SATPC0039496 Tab 04 4 SOW.pdf

Specs for High Temperature Electronics Packages HTLP CF580 and Lids

Specs for HTCC Electronics Packages HTLP CF580

A total of 25 pieces of high temperature co-fired 92% alumina electronic package with platinum (Pt) metallization will be purchased. Structure ceramic material shall be 92% white color alumina. Platinum metallization thickness, after co-firing, shall be 5.1 micrometers +/- 10% and shall have sheet resistance of ≤ 75 milliohm per square (≤ 75 mΩ/□). Platinum vias between a Pt wirebond pad and the corresponding Pt pad on the backside of the package shall have a total resistance of 0.35 ohms or less. All of these (25 pieces) parts shall have a co-fired Pt ring on the top surface of surrounding wall of the package. The packages shall have a central Pt metallization pad on the backside (of the package) for mounting.

1. Packages for integrated circuit, having 80 (plus 1) input/outputs. Packages shall measure

1.183 in. x 1.183 in. x 0.112 in (thick). The package design is illustrated as “HTLP CF580 1.1 drawing dimensions for quote 07142025”, which also shows the dimensions and metallization patterns of the packages (The lid piece in this design has separated specs listed below).

2. The package shall have 81 wire-bond pads as illustrated in the design drawing; these 81 pads/traces shall be electrically connected separately to 81 bond pads on backside of the package using hermetic sealed Pt filled vias. In addition, the central floor of the package shall be Pt metallized counted as one of 81 pads, per NASA drawing.

3. The Pt seal ring on the package wall shall be electrically connected to the central pad for attaching die through a buried metallization trace at a lower level with conductive hermetic sealed vias at both ends.

4. Packages shall have a cut corner notch as an orientation mark.

5. 100% of the parts shall have Au coating on Pt surfaces. All exposed surface Pt metallization pads and traces shall have a pure surface Au coating of at least 100 micro inches thick.

Specs for Lids

A total of 25 pieces of high temperature co-fired alumina lid piece with platinum (Pt) metallization will be purchased. The ceramic structure material of the lid pieces shall be 92% white color alumina. Platinum metallization thickness, after co-firing, shall be 5.1 micrometers

+/- 10% and shall have sheet resistance of ≤ 75 milliohm per square (≤ 75 mΩ/□). The design of lid pieces is illustrated in “HTLP CF580 lid drawing for quote 07142025” provided by NASA, it also shows the dimensions and metallization patterns of the lid pieces.

1. Lid pieces shall measure 1.182 in. x 1.182 in. x 0.035 in. (thick). The lid pieces shall have Pt metallization words of “HTLP CF-581” and “NASA GRC LCS” on the top side, and Pt metallization patterns on the backside of the lid pieces, as illustrated in the NASA drawing.

Pt words and patterns on 92% (white color) HTCC alumina shall be co-fired with lid piece.

2. Lid pieces shall have a cut corner /notch as an orientation mark matching the packages.

3. All the parts shall have Au coating on Pt surfaces. All exposed surface Pt metallization pads (not including the letters on the top and the central square-shaped pad on the bottom side of the lids), and traces shall have a pure surface Au coating of at least 100 micro inches thick.