SATPC0036487 Tab 04 4 SOW.pdf
PDF 164 KB Posted
- Attached to
- Acquisition of Automated Dicing Saw
- Solicitation number
- 80NSSC24881279Q
About this file
The document is a Statement of Work (SOW) for an automated dicing saw required by NASA's Glenn Research Center (GRC) for semiconductor processing applications. The SOW specifies technical requirements for the dicing saw, including size, speed, accuracy, and advanced features such as an automated vision system, blade wear monitoring, and integrated cooling and filtration. The related federal contract opportunity is for the acquisition of this automated dicing saw, to be awarded on a sole-source basis to Advanced Dicing Technologies Inc. under FAR Part 12 and Part 13 procedures. The procurement has an estimated period of performance of 8-12 weeks, and interested organizations may submit their capabilities by September 4, 2024 for the government's consideration of a potential competitive solicitation.
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| File | Type | Posted |
|---|---|---|
| SATPC0036487 Tab 07 RDSS_Redacted.pdf |
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Text version
Specifications of Automated Dicing Saw for Semiconductor processing The Smart Sensing and Electronics System branch at NASA Glenn Research Center (GRC) at Lewis Field focuses on developing silicon carbide (SiC) integrated circuits (ICs) and sensors for aerospace applications. NASA GRC needs an automated dicing saw for dicing a variety of materials including silicon carbide and silicon. The period of performance is 8-12 weeks
The dicing saw should meet the following capabilities/specifications:
1. Must be new
2. Voltage: 200-240 V 1-phase
3. Workpiece Size: 8-inch diameter
4. Spindle: 2-inch, 60K rpm/1.8 kW
5. Blade Size: 2-inch to 3-inch
6. Y Axis:
a. Resolution: 0.2 µm
b. Cumulative Accuracy: 1.5 µm
c. Indexing Accuracy: 1.0 µm
7. X Axis Air Slide
8. Z Axis
a. Resolution: 0.2 µm
b. Repeatability: 1.0 µm
9. Θ Axis
a. Repeatability: 4 arc-sec
b. Stroke: 380 deg.
10. Z Close loop, 50mm stroke.
11. Software and hardware to plunge cut.
12. Software and hardware to circle cut.
13. Auto-height, optical height sensor.
14. Automatic vision system.
15. Load monitor and blade wear control.
16. Industrial PC Win 10, or preferably Win 11
17. 17-inch LCD touch monitor.
18. High resolution optics with x100 Microscope
19. Vertical and oblique high brightness LED illumination.
20. Triple flow cooling water control.
21. Water separator and vacuum pump.
22. 100-μ main water filtration system.
23. Service maintenance window.
24. Status light tower.
25. Fully visible cut chamber.
26. Transparent ESD covers.
27. Air gun.
28. Dressing station, 75 mm x 25 mm, T=1-3 mm (8-inch Frame).
29. Dressing board 75 mm x 25 mm x 2 mm 600Mesh.
30. 6-inch round Ceramic Porous Chuck.
31. 6-inch round grooved chuck & frame adapter.
32. USB-3 Camera for continuous Magnification.
33. Wash Pipe
34. Keyboard with mouse/trackball
35. Shaft-lock Blade change tool and Torque meter
36. 2-inch BBD Flange
37. Air Purification Assy.
38. Documented use in Govt./academic/semiconductor R&D facilities
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