SATPC0035298 Tab 04 4 SOW.pdf

Specs for HTCC CF544 Packages and HTCC CF544 Lids

Specs for HTCC CF544 Packages

A total of 50 pieces of high temperature co-fired 92% alumina electronic package with platinum (Pt) metallization will be purchased. Structure ceramic material shall be 92% white color alumina. Platinum metallization thickness, after co-firing, shall be 5.1 micrometers +/- 10% and shall have sheet resistance of ≤ 75 milliohm per square (≤ 75 mΩ/□). Platinum vias between a Pt wirebond pad and the corresponding Pt pad on the backside of the package shall have a total resistance of 0.35 ohms or less. All of these (50/25 pieces) parts shall have a Pt ring on the surrounding wall of the package. The packages shall have a central Pt metallization pad on the backside (of the package) for mounting.

1. Packages for integrated circuit, having 44 input/outputs. Packages shall measure 1.183 in.

x 1.183 in. x 0.084 in (thick). The package design is illustrated as ‘2D Backside View’, ‘2D Top View’, and 3D Top View in the NASA drawings including PDFs and AutoCAD, which also shows the dimensions and metallization patterns of the packages (The lid piece in this design has separated specs listed below).

2. The package shall have 44 (plus 2) wire-bond pads /traces as illustrated in the design drawing; these 44 pads/traces shall be electrically connected separately to 44 bond pads on backside of the package using hermetic Pt filled vias. 32 of these pads will be distributed along the package walls (eight of them on each side of the wall) and there will be nine pads distributed in the first quarter counterclockwise from the notch (cut corner as explained below) away from the edges. There will be two U shaped traces surrounding a die-attach pad at the center, each of these trace will be connected to a pad on the backside of the package. In addition, there will be two stand-alone Pt pads (without connection to other pads or traces), without Au plating, on the top side. In addition, the central floor of the package shall be Pt metallized with a die-attach pad, as per NASA drawing.

3. The Pt seal ring on the package wall shall be electrically connected to the inner U - shaped trace through a buried metallization trace at a lower level with hermetic sealed vias at both ends.

4. Packages shall have a cut corner (notch) as an orientation mark.

5. The parts shall have Au coating on most Pt surfaces. All exposed surface Pt metallization pads and traces except two stand-alone Pt pads as indicated above shall have a pure surface Au coating of at least 100 micro inches thick.

6. The additional traces for implementing surface Au plating have been discussed with the vender indicated in Sole Source document.

7. The parts should be free of any contaminations.

Specs for HTCC CF544 Lids

A total of 25 pieces of high temperature co-fired alumina lid piece with platinum (Pt) metallization will be purchased. The ceramic structure material of the lid pieces shall be 92% white color alumina. Platinum metallization thickness, after co-firing, shall be 5.1 micrometers +/- 10% and shall have sheet resistance of ≤ 75 milliohm per square (≤ 75 mΩ/□). The design of lid pieces are illustrated in “2D Top View”, “2D Bottom View”, and “3D Top View” of NASA drawings that also show the dimensions and metallization patterns of the lid pieces.

1. Lid pieces shall measure 1.183 in. x 1.183 in. x 0.035 in. (thick). The lid pieces shall have Pt metallization words of “HTLP CF-544” and “NASA GRC LCS” on the top side, and Pt metallization patterns on the backside of the lid pieces, as illustrated in the NASA drawing.

There shall be a square/rectangular shaped pad at the center and four L shaped pads surround the center one with a spacing of 5 mil. All Pt words and patterns on 92% (white color) HTCC alumina shall be co-fired with lid ceramic piece.

2. Lid pieces shall have a cut corner /notch as an orientation mark matching the packages.

3. All of the parts shall have Au plating on Pt surfaces. All exposed surface Pt metallization pads and traces (not including the letters on the top side, shall have a pure surface Au plating of at least 100 micro inches thick.

4. The parts should be free of any contaminations.