SATPC0034858 TAB 04 4 SOW.pdf
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- Attached to
- 1-Run of fabrication of silicon nitride photonic integrated circuits wafers, 5-Facet polishing
- Solicitation number
- 80NSSC24868112Q
About this file
This document is a Statement of Work (SOW) for the fabrication of silicon nitride photonic integrated circuits (PICs) to be used in the development of a hyperspectral microwave sensor called HyMPI. The vendor, Light Integration Technologies LLC, is requested to provide a single run of PIC fabrication with the following requirements: 175 nm-thick silicon nitride waveguides, 20 x 20 mm reticle, low optical loss (≤0.2 dB/cm), metal layers for thermal tuning, dicing, and facet polishing. The government-furnished equipment and information are not required for this delivery. The circuits will be fabricated at the vendor's facility, and the fabrication is expected to be completed within 2 months.
The related federal contract opportunity is a sole-source Special Notice for the 1-run of PIC fabrication and 5-facet polishing, with Light Integration Technologies LLC as the sole provider. The National Aeronautics and Space Administration (NASA) Shared Services Center is the procuring agency, and the performance will be located at NASA's Goddard Space Flight Center. The procurement will be conducted using FAR Part 12 and FAR Part 13 procedures for commercial items and services. Interested organizations may submit their capabilities and qualifications by 5/1/2024 for the government's consideration of a competitive basis.
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STATEMENT OF WORK FORMAT
Light Integration Technologies LLC, 4/19/24 Silicon nitride photonic integrated circuit fabrication
PR: 4200868112
Note: Only use the sections that are applicable to your service procurement.
Background
The 2017 Earth Science Decadal Survey recommended that NASA create a new Incubation Program to explore and develop new technologies to probe the Earth’s planetary boundary layer (PBL) by 2027. In response to this initiative, our team at Goddard Space Flight Center has initiated the development of a hyperspectral microwave sensor. Hyperspectral evaluation of the microwave spectra will enable more precise characterization of the state of the atmosphere in this key region.
Our instrument, the hyperspectral microwave photonic instrument (HyMPI,) is being developed to make wideband (~40-GHz,) high-resolution (~20-MHz) measurements of the thermal microwave spectrum. Our instrument employs photonic integrated circuits (PICs) to enable the parallel processing of the wideband microwave signal. The use of PIC technology has the potential to improve measurement performance and reduce instrument size, mass and power.
Our approach uses an electro-optic modulator to encode the microwave spectra onto an optical signal and then uses photonics to process and channelize the signal.
Our project aims at demonstrating the performance of HyMPI. The goal is to provide an instrument that enables consistent measurement with improved information content in key, highly uncertain variables determining the Earth’s radiation budget such as the water vapor continuum, surface emissivity, hydrometeor microphysics and the Planetary Boundary Layer (PBL) thermodynamics with implications for numerical weather prediction and climate science.
Scope
The vendor is requested to provide fabrication service for photonic integrated circuits based on silicon nitride technology. The circuits will be integrated in the HyMPI system.
Requirements
• 175 nm-thick silicon nitride waveguides
• Reticle: 20 x 20 mm
• Low optical loss (equal or less than 0.2 dB/cm)
• Metal layer(s) for thermal tuning of the photonic waveguides
• Dicing
• Facet polishing
Deliverables or Delivery Schedule
• We request one run of fabrication of photonic integrated circuits and facet polishing.
Government-Furnished Equipment and Government-Furnished Information No government-furnished equipment or information is required for the delivery of this device.
Place of Performance
• The production of the circuits will be performed at the vendor’s site/facility.
Period of Performance
• We expect the fabrication to be completed in 2 months.
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