SATPC0033874 Tab 04 SOW.pdf

STATEMENT OF WORK

ELECTROPLATING WET CHEMISTRY BENCH AND

6” ELECTROPLATING STATION WITH ELECTRONICS

PCN: ___ __________________

Background

NASA Goddard Space Flight Center (GSFC) provides detectors for the X-Ray Integral Field Unit instrument as part of the European Space Administration’s ATHENA mission.

The X-ray Calorimeter group at GSFC also provides detectors for proposed mission concepts LYNX and LEM. Fabrication of these microcalorimeter detectors involves electroplating Au on 4” and 6” wafers. Currently, we electroplate Au only on 4” wafers using an ECSI Fibrotools IKo Jr 4” plating station. This station currently occupies a wet chemistry bench in a Class 100 cleanroom. At present, the bench is only able to accommodate one plating station, and it is unable to also accommodate a 6” plating station.

As our previously developed recipes for the 4” IKo Jr plating station plates Au at a sufficiently high RRR, thickess uniformity, and overall film quality to meet detector requirements for ATHENA, we need to continue to use the current IKo Jr system in our lab to maintain production of ATHENA and LEM detector components. However, for the other projects, there is a pressing need to plate Au on 6” wafers and the Detector Development Lab needs a consolidated station for both 4” and 6” plating. Thus, NASA requires the design of an electroplating wet chemistry bench that meets Class 100 Cleanroom requirements and meets safety requirements for acid and base wet chemistry processes that can accommodate simultaneously two electroplating systems – our current 4” IKo Jr system with modifications and an additional 6” Au plating system which we require to be provided with the wet chemistry bench. The bench should also house the separate electronics for the current 4” IKo Jr plating system as well as the new 6” plating station as well so electronic racks outside of the bench do not take up additional space in the cleanroom.

Objectives

Through this statement of work NASA GSFC will obtain:

A wet chemistry bench capable of housing two electroplating stations simultaneously together with their separate electronics An electroplating station capable of handling 6” wafers and the associated electronics Any modifications necessary to accommodate our current IKo Jr 4” plating station and its electronics into the new bench A system meeting all technical specifications and cleanroom compatibility and safety requirements A warranty for all components and workmanship provided.

Requirements

The specifications for the wet chemistry bench include:

The Tool and all required facilities shall be specified at the time of award and GSFC shall be notified of these requirements.

Exterior surface parts shall be clean and free of grease or dust and compatible with operation in a Class 100 cleanroom environment.

Production scale model preferred. Unproven equipment will not be accepted, no first design models or development models will be accepted. Customer may request up to 3 references of a similar tool being utilized in the field prior to selection.

Meets current industry standard (semi S2) requirements for safety including the use of Emergency Off (EMO) buttons. Shielding, and interlocks for hazardous areas protecting the user and maintenance personnel from high voltages, pneumatics, chemicals and moving parts and the tool from potential service failures shall be provided.

Sash will be provided that meets air flow requirements to safely exhaust fumes per the design of the exhausted enclosure per NFPA requirements.

All materials will be compatible with specified chemical use, for acid/base PVDF or PTFE or Polypropylene (PP) in areas where direct contact with chemicals may occur (horizontal surfaces). Materials shall be approved by customer prior to shipping.

Bench must be capable of housing two electroplating stations and associated electronics simultaneously with one station having the capability of plating 6” wafers

Bench must be able to house current NASA property ECSI Fibrotools IKo Jr plating station and its electronics with modifications for the IKo Jr tool provided by the vendor

Bench must have DI cascade rinse Bench must have deck space available for preparing wafers and additional plating chemistry needs such as pre and post wafer plating chemical rinses.

The system shall not exceed 81”W x 42”D x 78”H in dimension with no metallic frame The vendor shall confirm compatibility with hook up to NASA GSFC facilities through the GSFC technical representative prior to build of the system

The specifications for the 6” plating station include:

Electroplating Station capable of handling up to 8” wafers The electroplating station shall be capable of heating the electroplating solution to target temperatures up to 70 C and maintain +/-1 C solution temperature uniformity at the wafer surface and during the wafer plating

The plating station shall come equipped with filtration, Continuous-cartridge, 400 GPH with 1μ filtration

The electroplating station shall be provided with a power supply capable of forward and reverse pulsed application of high current density (up to 10 mA/cm2) to the wafer surface with on/off timing control from 0.01ms to 99s

The electroplating station shall be equipped with a container for the solution required approximately 8 liters of electroplating solution for operation

The plating station shall include a titanium metal mesh reciprocating anode so as to be able to efficiently remove and replenish solution at the boundary layer where electroplating onto the substrate occurs

The plating station shall supply Full Circle gasket/contact current collector holder for 6” wafers

The plating station shall achieve +/- 2% uniformity over 135 mm diameter plated area on a 150mm wafer at rates between 20-300 nm/min of electroplated Au over 135mm diameter on a 6” wafer.

The plating station shall be able to electroplate Au such as to achieve a residual resistance ratio (RRR) > 10.

The housing structure of the plating station shall be constructed of 1/2” and 3/8” regular white polypropylene

The plating station shall include sinks and tanks for wafer and chemical procewsing including: one sink (removable) 16” x 25-1/2” x 12” deep; Secondary containment includes an open drain to 4 gallon carboy; one cascade overflow rinse tank (removable) 10” x 12” x 12” deep, with DI water control valve and overflow drain to 4 gallon carboy

The plating station shall have a DI spray gun, Teflon, located behind cascade rinse tank

The plating station shall have a nitrogen spray gun, Teflon, located behind cascade rinse tank

The plating station shall have a conditioning tank (removable) 10” x 10” x 12” deep, with partition for two solutions as needed

The plating station shall have input power 110/220 VAC, 50/60 Hz, single phase, 15 amps

The plating station shall include a Magnehelic gauge with interlock The plating station shall include an Air Flow Alarm included The plating station shall include an Emergency Power off button Exhaust shall be routed through the top of the bench and able to attach to our 10” diameter exhaust duct. GSFC shall supply flexible ductwork to connect the exhaust from the top of the bench to 10” ductwork.

The drain for the sink shall be an output to the lab drain.

The Conditioning tank shall have a diverter to drain chemical solutions to carboy, and the rinsing process shall be drained to the lab drain.

The Cascade Overflow Rinse drain shall be routed to the lab drain.

The specifications for upgrading NASA owned IKo Jr to footprint of the provided flow bench system

IKo Jr must continue to operate as designed using < 4L of Au plating solution and the same 4” sample holders, 1 μm filter cartridges, metal mesh anodes and electronics as before

IKo Jr must be able to continue to meet +/- 2% uniformity specifications for Au plating over 90mm diameter of a 100mm wafer and achieve Au RRR > 10 for metal thin film thicknesses between 0.2 – 2.0 μm.

Modifications to IKo Jr must be made in a timely manner so NASA does not lose the ability to meet project deadlines requiring 4” Au wafer plating. Thus, vendor has three weeks to make modifications and return IKo Jr from time of delivery, or ensure the design of the modified system can provide adequate 4” wafer plating capability meeting the same specifications of +/- 2% uniformity, RRR > 10 and plating rates between 20-300 nm/min on a 4” wafer while IKo Jr is being modified.

NASA GSFC will obtain a one year warranty for parts and labor on the wet chemistry bench and 6” plating station and modified IKo Jr system against manufactured defects.

Scope

The vendor shall supply the wet chemistry bench and 6” wafer plating station as described in the “Objectives” and “Requirements” sections of this statement of work.

The vendor shall be permitted to make modifications to the current NASA owned IKo Jr system such that it will fit in the new wet chemistry bench with its associated electronics.

The vendor shall provide all manuals and documentation pertaining to the operation and maintenance of the wet chemistry bench and 6” plating station.

The vendor shall provide and support a one year warranty of all components delivered or modified.

Tasks

General

The vendor shall provide a new wet chemistry bench

The vendor shall supply a new 6” plating station. No refurbished components or subcomponents will be accepted.

The vendor shall ensure that the new 6” plating station and its associated electronics fit properly into the wet chemistry bench and function as designed.

The vendor shall ensure that the NASA owned 4” IKo Jr plating station and its associated electronics fit properly into the wet chemistry bench and function as designed.

The vendor shall ensure that the wet chemistry bench and plating stations function properly after installation on site at GSFC. The vendor shall ensure that all subcomponents of the plating stations work properly, specifically the immersion heater, the pump and filters for the plating baths, the reciprocating anodes and the pulsed power supplies. This will be verified by a NASA supplied on site fabrication engineer.

Warranty

The vendor shall provide a one year warranty for all parts delivered and modified.

Manuals

The vendor shall provide documentation on cleanroom paper and a full printed set of drawings for the delivered components.

Selection Criteria

Sole source.

Deliverables or Delivery Schedule

From Date of Award (DOA), the vendor shall proceed to deliver wet chemistry bench and 6” plating station to NASA/GSFC ]

Within two weeks of (DOA), vendor will provide a technical work plan with drawings to the GSFC technical representative.

The technical representative will respond with comments within one week and upon mutual acceptance of the workplan, the vendor can bill for 50% of the total cost

Within 9 months of DOA, the vendor will complete installation of the twin electroplating station at NASA GSFC. Upon tool acceptance, the vendor can bill for the remaining 50% of the total cost.

Government-Furnished Equipment and Government-Furnished Information

NASA GSFC is permitted to send IKo Jr plating station to vendor for modifications to fit into the new wet chemistry bench. This equipment is to be returned fully functional in a timely manner.

Security

None

Place of Performance

The technical acceptance and installation of the wet chemistry bench and plating stations is expected to take place at NASA GSFC.

Period of Performance

The period of performance for this statement of work is 9 months from the date of award.

Signature & Title Date