SATPC0032605 Tab 04 4 SOW.pdf
PDF 146 KB Posted
- Attached to
- Purchase of MML capacitors Federal contract opportunity
- Solicitation number
- 80NSSC23845261Q
About this file
This document contains a justification for the procurement of metallized polymer dielectric capacitors. Fission Surface Power desires to procure 110 pieces of 1000V capacitors ranging from 2 to 7 uF. The capacitors must be constructed using Miniature Micro-Layer film technology with metallized polymer dielectrics. They should have a nominal capacitance value within the specified range and a tolerance of +/- 10%. The capacitor case and terminals must meet specified flame retardancy and lead content standards. All samples must be serialized with test results recorded and traceable to serial numbers. The delivered package should include descriptions and results of all testing performed on the capacitors and their components. This procurement is associated with Federal Contract Opportunity number 80NSSC23845261Q issued by the National Aeronautics and Space Administration Shared Services Center to purchase the specified MML capacitors.
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Make and Model Justification
Background:
Fission Surface Power desires to procure metallized polymer dielectric capacitors for life and reliability validation.
Requested Items:
1. 110 pieces of metalized polymer capacitors, 1000V, range of 2 to 7 uF Justification:
The requested items must meet the following requirements:
• Source control drawing (SCD) must be provided with the capacitors from which a future reorder can be accomplished based on part number by NASA or NASA contractors.
• Capacitors must be constructed using Miniature Micro-Layer (MML) film technology with metallized polymer dielectrics. Other trade names for this technology include PolyCharge NanoLam.
• Capacitors must be nominally rated for 1000VDC
• Capacitors should have a nominal a capacitance value in the range of 2 to 7 uF with and exact value +/- 10% of nominal
• Capacitor case must be flame retardant
• All samples should be serialized, and test results should be traceable to serial numbers. Actual values of electrical characteristics (including failed samples) should be recorded.
• The delivered package should have descriptions of testing procedures and test results. It should also include test results for the elements used to manufacture capacitors.
• Finishing of the terminals should contain at least 3% lead.
• Case materials should have NASA acceptable outgassing level per ASTM E595 (CVC <0.1% and
TM < 1%).
• All screened parts, except for the samples intended for lot acceptance testing (LAT), should be shipped to the customer right after completion of screening. All LAT samples should be also returned to the customer after testing in a separate shipment. All screening and LAT results should be delivered to the customer after completion of the tests.
• All capacitors must meet the following screening and lot acceptance testing requirements:
o Screening (100% tests)
Bake at 125C for 16-24 hours
Visual examination for possible defects in molding compound, case, and terminals’ finishing.
Temperature cycling: 5 cycles between -55C and 125C with 30 min dwell time and less than 5 min transfer time.
Electrical measurements:
• Initial measurements at 25°C: capacitance and dissipation factor at 120Hz, and ESR at 100kHz.
• Dielectric Withstanding Voltage (DWV) - 1.5*Ur applied for 1 minute at 25°C
• Post-DWV measurements at 25°C: capacitance and dissipation factor at 120Hz, ESR at 100kHz, and Insulation resistance at the rated voltage 25°C
Burn-in: 125C, 1.1*Ur, 48 hours.
Post-BI measurements at 25°C: capacitance and dissipation factor at 120Hz, ESR at 100kHz, and Insulation resistance at the rated voltage.
This technology maturation procurement is cost sensitive. NASA may prioritize certain aspects of the lot acceptance testing listed below.
• Lot acceptance tests using samples that passed screening:
o Group A, 3 samples
Ripple current test at 70 kHz, 10A rms for 3 hr. Measure test voltage, current and temperature of the case after 0, 0.5, 1, 2, and 3 hours of testing.
Testing at low and high temperatures:
• Stabilize temperature at -55C for 15 min and measure capacitance and dissipation factor at 120Hz, ESR at 100kHz, and IR at Ur.
• Stabilize temperature at +125C for 15 min and measure capacitance and dissipation factor at 120Hz, ESR at 100kHz, and IR at Ur.
o Group B, 10 samples
Thermal shock: 100 cycles between -55 and +125C with 30 min minimum dwell time and less than 5 min transfer time. Post-TS measurements of capacitance and dissipation factor at 120Hz, ESR at 100kHz, and IR at Ur.
Resistance to Humidity: store parts at 85C, 60% RH for 4 weeks.
• measure at 25°C capacitance and dissipation factor at 120Hz, and ESR at 100kHz.
• Within 8 hours after humidity testing monitor leakage currents at room conditions and 1*Ur for 2 weeks.
• measure at 25°C capacitance and dissipation factor at 120Hz, and ESR at 100kHz.
o Group C, 30 samples.
Resistance to soldering heat.
• Simulation of reflow soldering per manufacturer recommended temperature profile using samples 1 to 15.
• Simulation of manual soldering per manufacturer recommended conditions using samples 16 to 30.
• DWV using all 30 samples (1.5*Ur applied for 1 minute at 25°C)
Measure at 25°C capacitance and dissipation factor at 120Hz, ESR at 100kHz, and IR at Ur.
Life testing at 105C, 1.4*Ur for 2000 hours. Measure at 25°C: capacitance and dissipation factor at 120Hz, ESR at 100kHz, and IR at Ur after 500, 1000, and 2000 hours.
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