Salient Characteristics.docx

This is a Salient Characteristics document that establishes minimum technical requirements for a real-time micro-focus X-ray inspection system procurement by the U.S. Army Research Laboratory (ARL). The system is intended for quality inspection of populated printed circuit boards (PCBs), specifically for Ball Grid Array (BGA) solder joint and void analysis following automated pick-and-place placement. The procurement is being conducted as a sole-source purchase order to Glenbrook Technologies, Inc. for their Jewel Box Ultra Compact Real Time X-ray Inspection System under solicitation number W911QX26QA203.

The required system must meet specific minimum technical specifications across 18 key characteristics, including real-time micro-focus X-ray imaging with operator-controlled zoom magnification, adjustable anode voltage (0-80 kV) and current (up to 200 micro-amps), a focal spot size of 10 microns or finer, geometric magnification of at least 500x, optical magnification of at least 1,200x, and a five-axis manipulator with joystick control. The system must accommodate a minimum 12" x 8" board capacity with an X/Y scan area of 5.5" x 9", include an integrated laser locator, support multiple image output formats (.jpg, .tif, .avi), feature self-contained computing with integrated display and wireless connectivity, maintain a compact desktop footprint not exceeding approximately 22"W x 26"D x 27"H, and operate on standard 120V/60Hz facility power. Additionally, the system must be fully shielded and compliant with U.S. radiation safety standards (21 CFR 1020.40) and CE marked. Desired evaluation factors include low-lead/lead-free enclosure design, optional transport/road case, warranty, installation, operator training, and U.S.-based service and support availability.