Salient Characteristics.doc

Salient Characteristics

Commercial Availability Certification:

I have evaluated the commercial marketplace and determined that all of the salient characteristics documented below are available in products/services offered in the commercial marketplace.

Signature (typed name): Dmitry Ruzmetov Technical Point of Contact (TPOC)

Contract Line-Item Number (CLIN) 0001: The Contractor shall deliver one (1) ultra-high vacuum (UHV) system for the deposition of thin metal films by means of electron beam (ebeam) evaporation and performing vacuum anneals of the semiconductor wafers up to 100mm (milimeters) in diameter. The complete machine shall be fabricated, tested, and verified to be compliant with the below specifications at the vendor’s facility prior to being shipped to, installed, and fully operational at the US Army Research Laboratory (ARL) in Adelphi, Maryland before Government acceptance. The machine shall fulfill the following minimum specifications:

1. Main ultra-high vacuum chamber housing the substrate stage and the components listed below. The system should have at least two (2) additional ports (4.5” inches CF flanges) for the possible expansion of the capabilities in the future (such as adding effusion cells, etc). The base pressure of the chamber achievable in 24hrs without the bake-out to be below 5e-8 Torr and after the bake-out to be below 5e-10 Torr.

2. Load-lock chamber with bakeout capability, pressure gauge, view port, linear transfer rod, a magazine for holding at least three 100mm wafers, and pumps to achieve a base pressure of at least 1e-7 Torr.

3. Pumping system which can achieve and maintain between runs a base pressure of 5e-10 Torr after bake-out. Shall include a liquid nitrogen (LN2)-cooled shroud around sample stage and isolating it from the walls of the vacuum chamber. All pre-pumps must be oil-free pumps.

4. Electron beam evaporation system with at least three (3) hearths each capable of holding 15 centimeters cubed (cm3) of material for deposition, XY sweeping capability of the ebeam, bake-ability of ebeam system up to 200° Celsius (C), control units for high voltage (HV) source and filament current including joystick control and programmable recipes, power supply at least 3 kiloWatts (kW), controllable input voltage at 50/60 Hertz (Hz) frequency with output capable of producing voltages between 4 – 10 kiloVolts (kV) and current between 0 – 300 milliAmps (mA) in HV source, controllable filament input voltage of 230 V at 50/60 Hz frequency with output voltage between 0 – 7 V and current between 0 – 50 Ampers (A), 270° beam deflection, and arc suppression to within one (1) microsecond, a shutter for the evaporation source.

5. Substrate stage and manipulator system capable of holding up to 100 mm diameter wafers/samples, a dedicated shutter for the substrate which can allow for the evaporation rate measurement with a thickness monitor while the substrate is covered with the shutter, a heater with thermocouple measurement at point where sample is located (e.g. backside of sample holder block) capable of heating up the sample stage to 950° C, water-cooled stage capable of continuous rotation between 0 and 30 rotations per minute (rpm), and programmable controller unit with control for rotation and z-position of sample relative to source material.

6. Control system which includes a hardware/software package and accompanying cabling for personal computer (PC) control, instrumentation rack, commercial controller system to control interlocks, direct current (DC) power supply with communication to power supply, communications interface, control touch-screen, shutter control and accompanying shutter control cabling to evaporation sources and main chamber, control of sample manipulator(stage/sample heating, rotation, and shutters), control of ion gauge, control of ebeam flux and shutters, control of material flux (from quartz microbalance capable of the deposition rate measurement in the range of 1 to 50 Angstroms per second (Å/s) and the stability of ±0.3Å/s), and a user manual for operation and troubleshooting,

7. Additional accessories which include all the bake-out parts and equipment, blind flanges, additional view ports, screws and gaskets for associated ports, a quartz microbalance positioned relative to the sample to ensure accurate thickness measurement (should be capable of moving out of the way of the sample), quadrupole mass analyzer (a.k.a. residual gas analyzer (RGA)) capable of detecting elements between 1 and 100 atomic mass units (amu) and capable of operating during a bake-out at 200° C, and pressure sensors capable of measuring from atmospheric to sub- 3e-11 Torr.

8. Transportation, insurance, packing, and testing which includes on-site installation, acceptance testing which meets acceptance criteria, and training.

CLIN 0002: The Contractor shall provide one (1) license for software for UHV MBE Metallization system that meets the following minimum specifications and is valid for a minimum of five (5) years:

· Shall provide software that is compatible with Windows 10 Operating System and capable to work offline.

· Shall provide updates to the software, at no additional charge, compatible with future updated versions of the Operating System for minimum of five (5) years.

· Shall provide one (1) user manual in English for the software.

CLIN 0003: The Contractor shall provide delivery, installation, setup, and re-testing at the Adelphi Laboratory Center (ALC) in Adelphi, MD 20783-1138 with the conditions specified below:

· Shall provide delivery to Adelphi Laboratory Center (ALC) truck shipments are accepted at Building #102, Receiving Room, 2800 Powder Mill Road, Adelphi, MD 20783-1138.

· Shall install the UHV metallization system at 2800 Powder Mill Road, Adelphi, MD 20783-1138.

· All components in place and mounted as agreed

· Helium (He) Leak test, confirm no leaks in main, preparation, and load lock chambers

· Measure RGA spectrum

· Introduce to molecular beam epitaxy (MBE) system controller

· Demonstrate bakeout procedure

· Achieve base pressure of 5e-10 Torr

· Demonstrate loading and unloading procedures with dummy wafer including pump down and load lock, transfer to MBE chamber, substrate heating to 900 Celsius

· Demonstrate MBE process software

· Perform heating of substrate

· Write a deposition process

· Demonstrate operation of sources

· Ramp up ebeam evaporators

· Measure layer thickness using quartz microbalance

· Deposit metal films using at least two sources.

· Demonstrate how to write a multi-layer recipe, including heating and cooling of substrate and evaporation source ramping

· Safety demonstration

· Power failure simulation CLIN 0004: The Contractor shall provide a minimum of sixteen (16) hours over two (2) days of on-site training at Adelphi Laboratory Center, Adelphi, Maryland for up to four (4) ARL employees/contractors on machine operation, provided software usage, and general maintenance.

CLIN 0005: The Contractor shall provide a Warranty that supports the following including, but not limited to, the identification of software issues, software updates, machine/hardware problems, trouble-shooting and technical support via phone for a minimum of one (1) year from the date of Government acceptance of machine. The Contractor shall include in the Warranty, four (4) hours of availability at a minimum between the hours of 8:00AM and 5:00PM Eastern Standard Time (EST) each day, Monday through Thursday, excluding federal holidays, for trouble-shooting and technical support appointments when needed by ARL.

Contracting Officer:

Template last updated 01/8/2019