Redacted SOW 20-0F0.doc

STATEMENT OF WORK (SOW)

DMEA 20-0F0

4/29//2020 Project Engineer:

Contract Officer Representative:

1.0 SCOPE:

1.1 TITLE: FormFactor Cascade Summit 12000 upgrade to Tesla 200

1.2 APPLICABILITY: ARMS Foundry testing support

1.3 BACKGROUND: The High Voltage Thyristor project requires a high-voltage wafer probe capability. In order to achieve this capability organically, a high voltage probe station is required. Upgrade of DMEA owned Summit 12000 semi-automatic probe station to a Tesla 200 high-voltage semi-automatic probe station provides the required capability without sacrificing currently installed capability.

1.4 PURPOSE: The purpose of this task is to upgrade DMEA owned Summit 12000 semi-automatic probe station to a Tesla 200 high-voltage semi-automatic probe station. The high voltage probe station is required for development and qualification of High Voltage Thyristor process and product.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:

2.3 GOVERNMENT FURNISHED EQUIPMENT:

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 RESERVED

3.2 PROGRAM MANAGEMENT: None.

3.3 TASK REQUIREMENTS: : The task requirement is to upgrade DMEA owned Summit 12000 semi-automatic probe station to a Tesla 200 high-voltage semi-automatic probe station.

3.3.1 Upgrade REQUIREMENT: The contractor shall provide the following upgrades for the FormFactor Cascade Summit 12000 semi-automatic probe station, all of which must be compatible physically and electrically while simultaneously installed. DMEA’s probe station shall be sent to the contractor’s facility where the upgrade activity shall take place. [Note: Existing components may be replaced in the upgraded configuration as needed to meet specifications.]

3.3.1.1 Replace existing wafer chuck with high-voltage wafer chuck. Required specifications:

1) Shall be capable of maintaining calibrated temperature in the range of -60°C to 300°C when paired with thermal system capable of that range

2) Shall be capable of 3,000 V bias without arcing, equipment degradation, or safety issues

3) Shall accommodate 100 mm to 200 mm wafers with vacuum hold down

4) Shall be of <40 μm planarity or lower over operating temperature range

5) Shall accommodate triaxial cabling

6) Shall be gold plated

3.3.1.2 Replace existing auxiliary chuck with high-voltage auxiliary chuck

1) Shall be capable of 3,000 V bias without arcing, equipment degradation, or safety issues

2) Shall be capable of holding 19 mm x 19 mm substrate

3.3.1.3 Include in upgraded configuration safety enclosure on probe station

1) Shall fully enclose wafer chuck and platen

2) Shall include safety interlock system

3.3.1.4 Include in upgraded configuration vibration isolation table

1) Shall have attenuation ≥ 0 dB at 6 Hz, ≥5 dB per octave at 6 Hz to 48 Hz, and ≥ 15 dB above 48 Hz

3.3.1.5 Include in upgraded configuration optical microscope system

1) Shall include camera with 1024x768 or higher pixels and 45 fps or higher frame rate

2) Shall have a Z drive resolution of 0.2 μm or better

3) Shall have a zoom range of at least 0.5-20.0

3.3.1.6 Include in upgraded configuration probe station control software capable of controlling the upgraded system

1) Shall include the following features

a) wafer map with Z-profiling, die stepping, and sub-die stepping

b) integrated thermal control

c) horizontal angle wafer alignment

d) control of chuck to load, separate, contact, and auxiliary chuck positions

e) control of microscope position

3.3.1.7 Include in upgraded configuration interconnect kit for high-voltage test signals

3.3.1.8 Include in upgraded configuration two (2) high-voltage probes

2) Shall accommodate triaxial cabling

3.3.1.9 Include in upgraded configuration two (2) probe positioners

1) Shall be compatible with provided high-voltage probes

2) Shall be compatible with probe station platen

3.3.1.10 Include in updated configuration 10X objective optical microscope lens

3.3.1.11 Include in updated configuration thermal system

1) Shall be capable of controlling wafer chuck in temperature range of -55°C to +300°C

2) Shall be capable of wafer chuck temperature accuracy of ±2.5°C at 100°C

3.3.2 Deinstall REQUIREMENT: The contractor shall deinstall the probe station at DMEA facility prior to upgrade to include the following tasks.

3.3.2.1 Perform and document system verification of performance to include measurement of mechanical accuracy, leakage current, noise, and thermal performance.

3.3.2.2 Install shipping restraints.

3.3.2.3 Crate the probe station with DMEA provided crate and packing materials.

3.3.3 Reinstall REQUIREMENT: The contractor shall reinstall the probe station at DMEA facility after upgrade to include the following tasks.

3.3.3.1 Unpack and install all component parts.

3.3.3.2 Remove shipping restraints.

3.3.3.3 Measure, calibrate, and document stage planarity, stage mechanical accuracy, and thermal performance.

3.3.3.4 Measure and document leakage current and noise.

3.3.3.5 Compare reinstall performance and provide comparison document to DMEA.

3.3.4 Training REQUIREMENT: After reinstallation, the contractor shall provide 4 hours of training for 6 people with the installed and upgraded probe station at DMEA facility.

3.3.5 Warranty REQUIREMENT: The contractor shall provide a warranty covering manufacturing defects, workmanship, and installation for 12 months from the date of installation.

3.4 PROGRAM SUMMARY: None.

4.0 POINTS OF CONTACT: