PWS-Requirement-Salient Characteristics (Redacted).docx
DOCX document 33 KB Posted
- Attached to
- One (1) Physical Vapor Deposition System
- Solicitation number
- W911QX-22-Q-0182
About this file
This solicitation requests one physical vapor deposition system with key features including a four-inch substrate capability, variable substrate holder height, standard semiconductor processing temperatures of 500 degrees Celsius or higher, and compatibility with a Scienta Omicron radial distribution chamber. The system shall include an ultra-high or high vacuum sputter deposition chamber achieving 10-9 to 10-10 Torr pressure or better, gas distribution components, a retractable film thickness monitor, multiple magnetron sputtering sources including an 5 kW high power impulse magnetron sputtering system, and necessary gas supplies. Offers are due within 15 days of posting by 12:00pm EST to the identified contracting officer's email. The solicitation is set aside for total small business and will be evaluated based on price, technical capabilities/specification, and past performance.
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Other files
| File | Type | Posted |
|---|---|---|
| Provisions and Clauses Full-Text Attachment.doc | DOC document | |
| Evaluation Criteria (Comparative Evaluation).docx | DOCX document | |
| Combination Synopsis-Solicitation for Commercial Purchases.docx | DOCX document |
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Text version
Salient Characteristics
Commercial Availability Certification:
I have evaluated the commercial marketplace and determined that all of the salient characteristics documented below are available in products/services offered in the commercial marketplace.
Signature (typed name): [Redacted] Technical Point of Contact (TPOC) or Contracting Officer’s Representative (COR)
The Sensors and Electron Devices Directorate (SEDD) at the Army Research Laboratory (ARL) requires one (1) Physical Vapor deposition/Sputtering system that shall include the following key features:
· Up to four (4) inch (in) (100 millimeter (mm)) max substrate capability, ability to accommodate smaller samples on a holder.
· Substrate holder with variable z-height
· Main substrate material is silicon
· Standard substrate temperatures used in semiconductor sputtering and physical vapor deposition growth (minimum 500 degrees Celsius (°C)).
· Must be able to connect to a Scienta Omicron Radial Distribution Chamber (RDC) research chamber compatible with this and other process and analysis equipment.
· Must specify the conditions and extent to which system can achieve high vacuum and ultra high vacuum background pressure.
· Shall have Sputter-up configuration.
The physical vapor (sputtering) system shall furthermore include these components:
· One (1) Ultra High or High Vacuum Sputter Deposition Physical Vapor Deposition (PVD) Chamber (ten to the negative ninth power (10-9) – ten to the negative tenth power (10-10) Torr pressure range or better)
· One (1) Throttle Valve and Gas Distribution
· One (1) Retractable Film Thickness Monitor
· Two (2) Magnetron Sets for three (3) inch (in) (75 millimeter) target for 300 Watt,
13.6 MegaHertz radio frequency (RF) and direct current (DC) sputtering
· Two (2) Magnetron Sets for three (3) inch (in) (75 millimeter) target for RF and 750 Watts DC sputtering
· One (1) High Power Impulse Magnetron Sputtering (HIPIMS) system with five (5) kiloWatt pulsed DC power supply
· Possible off-axis sputter cathodes if additional sources required or additional (two (2), but not to exceed (NTE) a total of four (4) confocal cathodes.
· Inert and reactive gas supply as needed
· Statement of gas purity (percent or grade) capability
Template last updated
07/28/2016
· Description of the input locations relative to chamber and targets for the gas inert and reactive gas(es) being plumbed into the system.
· Forming gas and/or safe hydrogen (H2) gas-supply with research-grade (99.999 % purity) capability.
· Room for additional reactant gases as needed
· Mass flow controller (MFC) or throttle valve gas-flow control.
· Adequate soft plasma to enable ion bombardment. Potential solutions to consider for this option could include these suggestions:
· Hollow-cathode plasma-generation source (for example Meaglow)
· ICP (inductively coupled plasma)
· gate valve access/isolation
· High-flow (ten to the ninth power (109) – ten to the fourth power (104) molecules/centimeter cubed (cm3)), high-pressure (one (1) – 100 torr) pumping capability.
Other necessary items that shall be included:
· Specify all applicable warranty information
· Shipping, packing, shipping insurance
· Installation and acceptance testing
· Onsite training
· Coordinating with ARL, obtain solution for Universal Power Supply (UPX)
· All needed connections to Scienta Omicron 2RDC research chamber (two- conjoined radial distribution chambers)
Contracting Officer:
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File details come from the government source that posted it. Updated .