PWS-Requirement-Salient Characteristics (Redacted).docx

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One (1) Physical Vapor Deposition System
Solicitation number
W911QX-22-Q-0182
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This solicitation requests one physical vapor deposition system with key features including a four-inch substrate capability, variable substrate holder height, standard semiconductor processing temperatures of 500 degrees Celsius or higher, and compatibility with a Scienta Omicron radial distribution chamber. The system shall include an ultra-high or high vacuum sputter deposition chamber achieving 10-9 to 10-10 Torr pressure or better, gas distribution components, a retractable film thickness monitor, multiple magnetron sputtering sources including an 5 kW high power impulse magnetron sputtering system, and necessary gas supplies. Offers are due within 15 days of posting by 12:00pm EST to the identified contracting officer's email. The solicitation is set aside for total small business and will be evaluated based on price, technical capabilities/specification, and past performance.

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Salient Characteristics

Commercial Availability Certification:

I have evaluated the commercial marketplace and determined that all of the salient characteristics documented below are available in products/services offered in the commercial marketplace.

Signature (typed name): [Redacted] Technical Point of Contact (TPOC) or Contracting Officer’s Representative (COR)

The Sensors and Electron Devices Directorate (SEDD) at the Army Research Laboratory (ARL) requires one (1) Physical Vapor deposition/Sputtering system that shall include the following key features:

· Up to four (4) inch (in) (100 millimeter (mm)) max substrate capability, ability to accommodate smaller samples on a holder.

· Substrate holder with variable z-height

· Main substrate material is silicon

· Standard substrate temperatures used in semiconductor sputtering and physical vapor deposition growth (minimum 500 degrees Celsius (°C)).

· Must be able to connect to a Scienta Omicron Radial Distribution Chamber (RDC) research chamber compatible with this and other process and analysis equipment.

· Must specify the conditions and extent to which system can achieve high vacuum and ultra high vacuum background pressure.

· Shall have Sputter-up configuration.

The physical vapor (sputtering) system shall furthermore include these components:

· One (1) Ultra High or High Vacuum Sputter Deposition Physical Vapor Deposition (PVD) Chamber (ten to the negative ninth power (10-9) – ten to the negative tenth power (10-10) Torr pressure range or better)

· One (1) Throttle Valve and Gas Distribution

· One (1) Retractable Film Thickness Monitor

· Two (2) Magnetron Sets for three (3) inch (in) (75 millimeter) target for 300 Watt,

13.6 MegaHertz radio frequency (RF) and direct current (DC) sputtering

· Two (2) Magnetron Sets for three (3) inch (in) (75 millimeter) target for RF and 750 Watts DC sputtering

· One (1) High Power Impulse Magnetron Sputtering (HIPIMS) system with five (5) kiloWatt pulsed DC power supply

· Possible off-axis sputter cathodes if additional sources required or additional (two (2), but not to exceed (NTE) a total of four (4) confocal cathodes.

· Inert and reactive gas supply as needed

· Statement of gas purity (percent or grade) capability

Template last updated

07/28/2016

· Description of the input locations relative to chamber and targets for the gas inert and reactive gas(es) being plumbed into the system.

· Forming gas and/or safe hydrogen (H2) gas-supply with research-grade (99.999 % purity) capability.

· Room for additional reactant gases as needed

· Mass flow controller (MFC) or throttle valve gas-flow control.

· Adequate soft plasma to enable ion bombardment. Potential solutions to consider for this option could include these suggestions:

· Hollow-cathode plasma-generation source (for example Meaglow)

· ICP (inductively coupled plasma)

· gate valve access/isolation

· High-flow (ten to the ninth power (109) – ten to the fourth power (104) molecules/centimeter cubed (cm3)), high-pressure (one (1) – 100 torr) pumping capability.

Other necessary items that shall be included:

· Specify all applicable warranty information

· Shipping, packing, shipping insurance

· Installation and acceptance testing

· Onsite training

· Coordinating with ARL, obtain solution for Universal Power Supply (UPX)

· All needed connections to Scienta Omicron 2RDC research chamber (two- conjoined radial distribution chambers)

Contracting Officer:

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File details come from the government source that posted it. Updated .