Product Description_ VP Environmental Scanning Electron Microscope.pdf

1. PURCHASE

DESCRIPTION

for

Variable Pressure Environmental Scanning Electron Microscope

(VP-ESEM)

for the

809th SCIENCE & ENGINEERING LABORATORY

(809 MXSS/MXDTAC)

Hill AFB, UT

15 April 2024

2. SCOPE:

2.1. This purchase description (PD) covers detailed specifications and performance requirements for a Variable Pressure Environmental Scanning Electron Microscope system for 809 MXSS/MXDTAC at Hill AFB, Utah. From this point on, the Variable Pressure Environmental Scanning Electron Microscope will be referred to as VP-ESEM throughout this PD. The new VP-ESEM will replace an outdated 809 MXSS scanning electron microscope, accommodate/reuse an existing 809 MXSS EDS detector, and include a new High Speed Electron Backscatter Diffraction detector. The VP-ESEM will enable a more comprehensive analysis of materials critical for use in additive manufacturing processes which impact final component quality and performance. Primary applications include, but are not limited to, simulated environment analysis, material crystallography and elemental identification using a single system.

3. OVERVIEW:

3.1. Acquisition of a VP-ESEM will permit high-resolution imaging and analysis of samples at varying pressures simulating environmental conditions. Adding a VP-ESEM will increase lab’s capability and expedite support of the RAPID team’s additive manufacturing efforts as well as other customers. The VP-ESEM will be used to study fine powders used in additively manufactured components as well the finished components themselves. These components may be used on A-10, C-130, C-17, F-16, F-35, KC-135, T-38, Ground and Shop Support Equipment and Structures, Vehicles, Missile components, etc.

4. VP-ESEM SYSTEM DESIGN:

4.1. ENGLISH: All documents and software submitted by contractor to USAF contracting office shall be in American English. All documents and software provided with VP-ESEM shall be in American English.

4.2. The VP-ESEM shall be new and one of the manufacturer's current production models, which, on the date of the solicitation, has been designed, engineered, sold or is being offered for sale through advertisements or manufacturer's published catalogs or brochures.

4.3. The VP-ESEM shall be an off the shelf design meant for high resolution imaging while varying chamber pressures to study materials under real-world environmental conditions.

Products such as a prototype unit, pre-production model or an experimental unit do not qualify. The system shall include all components, parts and features necessary to meet the requirements specified herein and be complete and ready for use.

4.4. Electron Optics. Shall meet the following minimum requirements:

4.4.1. Shall employ a fully automated, highly stable field emission electron gun that utilizes the thermal Schottky effect. Field emitter shall be fully guaranteed for at least 1 year under warranty.

4.4.2. Adjustable accelerating voltage with operating range from 200V to 30kV, with at least 50 discreet steps. The 200V to 3kV range shall have 100V or finer steps.

4.4.3. Continuously variable probe current with an operating range of 1pA to 200nA.

4.4.4. Shall maintain high vacuum in electron gun column isolated from sample chamber.

4.4.5. Include objective lens with 45° geometry and heated objective apertures.

4.4.6. Shall utilize accurate automatic beam alignment, axis alignment, and gun bias.

4.4.7. Shall have automatic adjustments for aperture alignment, astigmatism correction, and beam focus.

4.4.8. Include objective lens wobbler for optimum centering of objective lens apertures.

4.4.9. Include automatic/dynamic focus tracking capability linking the mag and working distance for changes to sample stage made in Z position.

4.4.10. Include current meter or ammeter terminal for measuring absorbed current and probe current. Capability for measurement of true probe current.

4.4.11. Include tilt correction to correct for foreshortening effect of tilt angle.

4.4.12. Include integrated beam deceleration with landing energy range of 20eV –

30keV.

4.5. Electron Detectors. Shall meet the following minimum requirements:

4.5.1. Include a High-Speed Electron Backscatter Diffraction (HS-EBSD) detector, as specified in Section 4, that is compatible with existing Oxford AZtec system specified in section 5.1.

4.5.2. Include an Everhart-Thornley type secondary electron detector with user control of both collector and scintillator voltages.

4.5.3. Include an integrated multi-element solid state backscattered electron detector. Detector shall be mounted at the bottom of the final lens, without restricting sample movements specified above. Detector shall permit operation of separate signals for viewing pure compositional and/or topographical images. Shall permit electronically variable operation to adjust the compositional to topographic signal ratio. Detector placement shall not hinder high resolution or any imaging performance or limit Energy Dispersive Spectrometer (EDS) and HS-EBSD functions. Retractable detector acceptable.

4.5.4. Include gaseous secondary electron detector for use in environmental mode.

4.5.5. Include a fully integrated low vacuum secondary electron detector for imaging using a secondary electron signal in low vacuum mode.

4.5.6. Include an in-column secondary electron detector for use with beam deceleration.

4.6. Performance. Shall meet the following minimum requirements:

4.6.1. Shall be capable of achieving resolutions of 1.0nm at 30kV, 3.0nm at 1.0kV with secondary electron detector and 2.5nm at 30kV with backscatter detector while in high vacuum mode. Resolutions of 2.1nm at 1kV and 3.1nm at 200V while using beam deceleration in high vacuum mode.

4.6.2. Shall be capable of achieving a resolution of 1.3nm at 30kV, 3.0nm at 3.0kV with secondary electron detector and 2.5nm at 30kV with backscatter electron detector in low vacuum mode.

4.6.3. Shall be capable of achieving a resolution of 1.3nm at 30kV with low vacuum secondary electron detector in environmental low vacuum mode.

4.6.4. Shall be capable of achieving high probe currents up to 200nA or more.

4.6.5. A continuously variable magnification range from 6X to 2,000,000X or better.

4.6.6. Shall operate using a High-performance Windows 10 or Windows 11 system control computer with 1080p or higher resolution monitor. A Windows 10 system shall be upgradable to Windows 11 without hardware upgrade.

4.7. Scanning/Display System. Shall meet the following minimum requirements:

4.7.1. Include digital scan generator capable of resolutions up to 5120 x 3072 pixels or better.

4.7.2. Generate live scanning electron microscope (SEM) images in full frame or reduced area scans.

4.7.3. Include controls for at least seven scan speeds.

4.7.4. Include controls for fine image shift.

4.7.5. Include scanning modes which incorporate frame integration or other charge free methods to inhibit charging of non-conducting samples.

4.7.6. Allow 360-degree digital scan rotation, linkable to working distance.

Changes to image rotation will automatically adjust to changes in Z position and XY travel, for all angles of digital rotation.

4.7.7. Includes chamber mounted digital color camera, for capturing images of mounted samples and holder. Allows point and click navigation on image.

Transition from color optical image to live SEM image shall be seamless.

Images shall be linked to SEM images collected during the same session.

4.7.8. Use displayed SEM images for point and click sample navigation via motorized stage.

4.7.9. Include software guided sample exchange with a step-by-step guide from sample introduction to applicable settings to navigation and automatic image creation.

4.7.10. Include in SEM display values for kV, magnification, working distance, low vacuum operating pressure, sequential number, and other pertinent information with independent on/off display for each item.

4.7.11. Include an external scan interface connection and external control software.

To provide direct control of SEM column scan coils using a remote digital scan generator and control of some of the SEM functions for integration with accessories such as third-party EDS systems.

4.7.12. Shall allow the display of 4 or more live images simultaneously.

4.7.13. Include ability to mix up to 4 signals in real time in any ratio to be displayed on screen.

4.7.14. Include ability to capture images and movies of live image as displayed on screen.

4.7.15. Include built-in measurement function. Measure point to point, polygon area, circle diameter, angle, and give a count. Display results on live image and allow writing to a stored image or export to comma separated value (CSV) file.

4.7.16. Include software interface with operator customizable workspace. Store settings for custom workspace using an individual login.

4.7.17. Include ability to modify the brightness, contrast or to color enhance secondary electron or back scattered electron images on both live and stored images.

4.7.18. Include automatic file saving function using only one mouse click.

4.7.19. Include automated image montaging function to capture images from multiple detector scans for creating a large area map/image. Built-in automated image collection and stitching. Quick point and drag selection of montage areas. Able to select multiple areas.

4.7.20. Include ability to recall instrument conditions from any stored SEM image.

4.8. Sample Chamber and Stage. Shall meet the following minimum requirements:

4.8.1. VP-ESEM sample chamber shall be equipped with multiple ports designed to accommodate a variety of detectors including multiple EDS (180°), coplanar EDS and HS-EBSD. The chamber shall have more than 10 ports to support a broad range of configurations.

4.8.2. Shall include the necessary ports to readily attach an existing Oxford Xmax80N EDS detector along with a fully compatible new Oxford HS- EBSD detector.

4.8.3. Chamber and stage shall be capable of accommodating and analyzing samples at any point up to 120mm in diameter, up to 80mm high and weighing up to 2kg.

4.8.4. Include mechanically eucentric stage where focus, magnification and field of view are maintained at all working distances.

4.8.5. Include computer eucentric rotation and tilt for tall samples when rotating off axis or tilting the stage (regardless of working distance).

4.8.6. Include a large computer controlled 5-axis (X,Y,Z,T,R), asynchronous, motorized stage. Stage speed should be proportional to and linked to the magnification.

4.8.7. Stage shall have motorized travel movements of 110mm X, 100mm Y, 65mm Z, -10 to 90° tilt and 360° rotation. Motion control using multi-touch on screen, keyboard entry, mouse, or joystick on desktop control panel. Absolute or relative stage motion shall be possible as well as recall of stored stage coordinates.

4.8.8. The maximum stage tilt axis shall be perpendicular to the HS-EBSD Port.

4.8.9. The stage shall allow movement of all axes via: continuous move, click-n-drag, double-click to center, or by click navigation on up to 4 displayed SEM images.

4.8.10. The stage shall allow for a user defined frame shift in both X and Y directions, for manual image stitching.

4.8.11. Shall include a high-resolution chamber mounted color camera for imaging sample and holder from above. Used for navigation, see 3.7.7. Acquired images shall be storable.

4.8.12. Shall include an infrared side view chamber camera for viewing sample position with respect to backscatter detector and final lens.

4.8.13. Software shall support point & click sample navigation using live or captured optical image of sample and holder, showing position of beam on sample.

4.8.14. Software shall include a graphical display showing sample stage with relative position of beam on sample and relative position of sample to final lens.

4.8.15. Software shall include storage and recall of sample positions.

4.8.16. Shall include integrated safety limits that protect the sample from colliding with detectors.

4.8.17. Shall include a touch sensor to immediately terminate stage travel.

4.8.18. Include a chamber mounted/integrated Plasma cleaner.

4.8.19. Accommodate optional heating and cooling stages, ranging from -73°C to

982°C.

4.9. Vacuum System. Shall meet the following minimum requirements:

4.9.1. Chamber high vacuum system. Shall include a turbo molecular pump rated at 250L/sec or better.

4.9.2. Include a rotary pump rated at ≥120L/sec to assist turbo pump in high vacuum mode.

4.9.3. Include two ion pumps, each rated at ≥120L/sec to maintain high vacuum in electron gun chamber. Maintain clean vacuum in the gun chamber with working pressures of 1x10-7Pa.

4.9.4. After being vented, the chamber shall evacuate in < 3.5 minutes to high vacuum and < 4.5 minutes to environmental ESEM vacuum.

4.9.5. Chamber vacuum. High vacuum range shall be < 6x10-4Pa or better. Low vacuum range shall be 10 to 200Pa or better. ESEM vacuum range shall be 200 to 4000Pa or better.

4.9.6. Shall include a replaceable differential pumping aperture for the column that is independent of the objective lens aperture. This pumping aperture shall not interfere with low magnification performance but will allow fine adjustment of the objective lens aperture while operating in low vacuum. This aperture need not be removed when switching between high and low vacuum.

4.9.7. A clean vacuum environment shall be maintained at the objective aperture to ensure the aperture assembly stays clean and to improve imaging performance.

4.10. Operating System. Shall meet the following minimum requirements:

4.10.1. System shall operate on Windows 10 or 11 operating system. Controlling computer shall be supplied with operating system and shall include Microsoft Office. If operating on Windows 10, then supplied computer shall meet minimum requirements to run Windows 11 for future upgrade(s).

4.10.2. Include a 24-inch flat panel display at a native resolution of at least 1920 x 1080 pixels.

4.10.3. System software shall allow for multiple user logins with customized settings. Settings shall allow General and Administrator level accounts with password protection.

4.10.4. Include comprehensive on-screen help covering all aspects of routine operation.

4.10.5. Include embedded software which links color navigation images and/or SEM images with their respective locations for position recall and reporting.

4.10.6. System shall support scripting via Python based application.

4.10.7. System shall support option to add integrated 3D measurement software.

4.10.8. Include a manual user interface to allow operator to manually control system or override automatic settings. Shall have separate controls for magnification, focus, astigmatism correction, brightness, and contrast. All controls shall be clearly marked to show their actions.

5. HS-EBSD SYSTEM DESIGN:

5.1. ENGLISH: All documents and software submitted by contractor to USAF contracting office shall be in American English. All documents and software provided with HS-EBSD shall be in American English.

5.2. The HS-EBSD shall be new and one of the manufacturer's current production models, which, on the date of the solicitation, has been designed, engineered, sold or is being offered for sale through advertisements or manufacturer's published catalogs or brochures.

5.3. The HS-EBSD shall be an off the shelf design meant for high resolution imaging in both high vacuum and low vacuum modes. Products such as a prototype unit, pre-production model or an experimental unit do not qualify. The system shall include all components, parts, and features necessary to meet the requirements specified herein and be complete and ready for use.

5.4. HS-EBSD Detector. Shall meet the following minimum requirements:

5.4.1. High speed, low noise CMOS sensor optimized for HS-EBSD with < 1 pixel distortion

5.4.2. Maximum pattern resolution of 1244 x 1024 pixels or higher

5.4.3. Analysis speeds greater than 5500 patterns indexed per second (at 156 x 128 pixels or higher)

5.4.4. Computer controlled detector tilting

5.4.5. Forward scatter detectors (FSD) with at least 5 integrated diodes for topographic, atomic density and orientation contrast imaging

5.4.6. High precision motorized detector insertion/retraction and screen elevation movements (+ 22mm)

5.4.7. Handset operated control for insertion/retraction and elevation movements

5.4.8. Collision avoidance sensors

5.5. Controller Hardware. Shall meet the following minimum requirements:

5.5.1. Windows 11 tower business computer

5.5.2. Intel i9-12th generation processor or better

5.5.3. 32GB or higher DDR5 memory

5.5.4. 1TB or larger SSD drive (mirrored RAID configuration preferred)

5.5.5. DVDRW drive

5.5.6. Gigabit wired ethernet port

5.5.7. Wired mouse and keyboard

5.5.8. Flat panel display, 24-inch or larger, native resolution 1080P or better

5.6. Operating System and Software. Shall meet the following minimum requirements:

5.6.1. Windows 11 or newer operating system. Controlling computer shall be supplied with operating system installed.

5.6.2. Include Microsoft Office 2021 or newer, with lifetime license

5.6.3. System software shall allow for multiple user logins with customized settings. Settings shall allow General and Administrator level accounts with password protection.

5.6.4. Include comprehensive on-screen help covering all aspects of routine operation.

5.6.5. Include related software with all tools necessary to collect, index and solve HS-EBSD patterns.

This includes:

Auto Calibration Calibration Refinement Tools Auto Exposure Auto Background Detector Control, Elevation Control True Indexing and Solving engines AutoLock Drift Correction Advanced Phase Discrimination with EDS assisted indexing Color Imaging with Forward Scatter Detector Correction for Psuedo-symmetry in crystal structures AZtecLIVE – realtime X-ray mapping and chemical spectrum AZtecHKL Advanced AZtecHKL Steel AZtecCrystal – post processing and phase classification tool

5.6.6. Include full installation of NIST Standard Reference Database 84, FIZ/NIST

Inorganic Crystal Structure Database (ICSD) for HS-EBSD with one-year basic license. Installed on controlling computer.

5.7. Existing Oxford AZtec System Integration:

5.7.1. The contractor shall provide new HS-EBSD hardware and software that will fully integrate with existing Oxford Instruments XmaxN80 EDS components.

Ensuring that new Aztec software is fully functional allowing EDS, HS- EBSD and combined analysis from the Aztec user interface.

5.7.2. The contractor shall arrange removal of existing EDS detector, with accompanying hardware and software, from existing JEOL JSM-6460LV scanning electron microscope system and install them on the new VP-ESEM system. All software, hardware, adapters, etc. needed for existing systems to be integrated into new system shall be included.

5.7.3. The contractor shall integrate the existing EDS and the new HS-EBSD detectors into one system with one Windows 11 based PC controller, see Section 3.

5.7.4. The contractor shall install the Aztec microanalysis software suite to include the most current versions of AztecEnergy, AztecTruMap AztecLIVE, AztecHKL and AztecCrystal-Advanced. Required licenses and keys shall be included, previous licenses shall be converted. Previous licenses and keys shall be installed.

6. OTHER DELIVERABLES:

6.1. WARRANTY. Minimum requirements:

6.1.1. The successful bidder (contractor) shall provide a minimum one (1) year warranty which warrants all products provided under this contract to be free from defects. During the warranty period, supplier shall assume responsibility for any and all defects in materials, workmanship and performance. Warranty shall include the cost(s) of: parts, shipping, labor and any travel related expenses. Warranty period to start from date of final acceptance.

6.1.2. During the warranty period, the contractor shall provide free of charge at least one on-site preventive maintenance inspections of the system.

Unlimited on-site emergency service visits shall be included for inoperable systems.

6.1.3. During warranty period, on-site service should be provided within 48 hours (business days, excluding standard Federal holidays) for inoperable equipment, barring uncontrollable delays such as transportation breakdown, extreme weather, etc.

6.1.4. Any defects in materials or workmanship or failure of any product or component to perform its designed function during the warranty period shall be repaired by the contactor at no additional cost to the government.

6.1.5. The contractor shall provide, free of charge, software and/or critical system updates that are released during the warranty period.

6.1.6. Contractor shall maintain a service office within a reasonable distance, such that service personnel shall be available for direct telephone consultation during normal business hours local time.

6.2. Continuing Service Options for VP-ESEM. Minimum requirements:

6.2.1. The successful bidder (contractor) shall offer, at time of purchase, a minimum of four one-year continuing service contract options which extends full system coverage on all products provided under this contract, at an additional annual cost. Services shall include the cost(s) of: parts (including FEG), shipping, labor and any travel related expenses.

6.2.2. Coverage period of performance to start on the date the warranty expires and annually thereafter.

6.2.3. During the performance period, the contractor shall provide free of charge one or more on-site preventive maintenance visits. Rapid phone support with dedicated number. Unlimited on-site, 48-hour response time (business days, excluding standard Federal holidays), emergency service visits shall be included for inoperable systems, barring uncontrollable delays such as transportation breakdown, extreme weather, etc.

6.2.4. Repairs which present a safety hazard are to be repaired within 8 business days of notice of failure. Non-safety related repairs are to be repaired within 15 business days of failure notice.

7. AFTER CONTRACT AWARD:

7.1. Delivery. Contractor shall deliver the complete VP-ESEM system within 140 days. The contractor shall be responsible for the crating and shipment to its final destination IAW standard commercial practice. Contractor shall make all arrangements necessary, and cover all costs to deliver VP-ESEM and all related equipment, supplies, materials, fabrications, etc. to the job site at Hill Air Force Base, Utah. Contractor shall coordinate delivery and off-loading with the government representative (GR) from 809 MXSS/MXDTAC.

7.2. Installation:

7.2.1. The contractor shall provide on-site services for the uncrating, installation and setup of VP-ESEM. Contractor’s representative shall inspect VP-ESEM to ensure that all included pieces/parts are present and accounted for. In addition, they shall fully install VP-ESEM and demonstrate that it meets specified performance prior to final acceptance by government representative. Failure to meet all requirements outlined in this PD may be grounds for rejection.

7.2.2. The contractor shall arrange additional on-site services for the uncrating, installation, and setup of HS-EBSD. Contractor’s representative shall inspect HS-EBSD to ensure that all included pieces/parts are present and accounted for. Existing EDS detector, with accompanying hardware, shall be removed from existing scanning electron microscope system and installed on the new VP-ESEM (as detailed in Section 4.7). Aztec software suite shall be installed as outlined. In addition, they shall fully install HS-EBSD and demonstrate that it meets specified performance prior to final acceptance by government representative. Failure to meet all requirements outlined in this PD may be grounds for rejection.

7.2.3. All labor, food, travel and accommodation expenses for on-site installation by the contractor’s representative(s) shall be included.

7.3. VP-ESEM Familiarization:

7.3.1. Immediately following installation, and at no additional cost, the contractor shall provide VP-ESEM training. A qualified, factory trained on this model VP-ESEM, applications specialist(s) shall provide training for 3 or more operators, for at least three 8-hour days, preferably, on-site at Hill AFB, Utah.

Training, at a minimum, shall include:

7.3.1.1. VP-ESEM System Introduction

7.3.1.2. Start Up/Shut Down procedures

7.3.1.3. Detailed system usage

7.3.1.4. Capabilities/features/functions

7.3.1.5. Software – complete operation of all functions, to include procedure/methods development

7.3.1.6. Detector usage and operation

7.3.1.7. High vacuum imaging techniques

7.3.1.8. Low vacuum imaging techniques

7.3.1.9. Environmental ESEM imaging techniques

7.3.1.10. Automated Measurement

7.3.1.11. Project correlation methods

7.3.1.12. Image Montaging

7.3.1.13. Report Generation

7.3.1.14. System Care & Maintenance

7.3.2. All labor, food, travel and accommodation expenses for the applications specialist(s) to make on-site visit shall be included.

7.4. HS-EBSD Familiarization:

7.4.1. Immediately following installation, and at no additional cost, the contractor shall provide HS-EBSD familiarization training. A qualified, factory trained applications specialist(s), trained on the specific model HS-EBSD installed, shall provide in person training for 3 or more operators, for at least three 8-hour days, on-site at Hill AFB, Utah.

Training, at a minimum, shall include:

7.4.1.1. HS-EBSD System Introduction

7.4.1.2. Start Up/Detector usage

7.4.1.3. Sample preparation for HS-EBSD analysis

7.4.1.4. Operation of Aztec HS-EBSD software

7.4.1.5. Introduction to Crystallography, Miller Indices

7.4.1.6. Principles of pattern formation, processing, and indexing

7.4.1.7. Introduction to common HS-EBSD data presentation such as pole figures, inverse pole figures, misorientation, orientation maps, and Grain boundaries

7.4.1.8. Automation and large area mapping (LAM)

7.4.1.9. Other capabilities/features/functions

7.4.1.10. Operation of all functions relating to EDS and HS-EBSD

7.4.1.11. Phase Identification/discrimination of unknown materials using EDS and

HS-EBSD

7.4.1.12. Advanced post-processing using Aztec Crystal software

7.4.1.13. Special imaging techniques, Image Montaging

7.4.1.14. Report Generation

7.4.1.15. Shut Down procedures

7.4.1.16. System Care & Maintenance

All labor, food, travel and accommodation expenses for the applications specialist(s) to make on-site visit shall be included.